JPS648764U - - Google Patents
Info
- Publication number
- JPS648764U JPS648764U JP10156587U JP10156587U JPS648764U JP S648764 U JPS648764 U JP S648764U JP 10156587 U JP10156587 U JP 10156587U JP 10156587 U JP10156587 U JP 10156587U JP S648764 U JPS648764 U JP S648764U
- Authority
- JP
- Japan
- Prior art keywords
- conductive metal
- metal layer
- circuit board
- ceramic circuit
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10156587U JPS648764U (zh) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10156587U JPS648764U (zh) | 1987-07-01 | 1987-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS648764U true JPS648764U (zh) | 1989-01-18 |
Family
ID=31330677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10156587U Pending JPS648764U (zh) | 1987-07-01 | 1987-07-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS648764U (zh) |
-
1987
- 1987-07-01 JP JP10156587U patent/JPS648764U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS648764U (zh) | ||
JPS5853854A (ja) | 高密度lsiパツケ−ジ | |
JPS6395271U (zh) | ||
JP2000058995A (ja) | セラミック回路基板及び半導体モジュール | |
JP2743524B2 (ja) | 混成集積回路装置 | |
JPS61145898A (ja) | プリント配線基板 | |
JPS6133464U (ja) | アルミ系ベ−ス基板 | |
JPS61100170U (zh) | ||
JPH0420235U (zh) | ||
JPH0268452U (zh) | ||
JPS6418774U (zh) | ||
JPS60174201U (ja) | チツプ型回路部品 | |
JPS6398676U (zh) | ||
JPS605144U (ja) | 半導体装置 | |
JPS62140796U (zh) | ||
JPH0379469U (zh) | ||
JPH0221776U (zh) | ||
JPH0371689A (ja) | 金属ベース配線基板 | |
JPS6324841U (zh) | ||
JPS5822762U (ja) | 混成集積回路装置 | |
JPS58189541U (ja) | 混成集積回路装置 | |
JPH0238743U (zh) | ||
JPS58173238U (ja) | 電子部品の接続部構造 | |
JPH03116846A (ja) | 混成集積回路及びその製造方法 | |
JPS5948070U (ja) | 混成集積回路装置 |