JPS6486541A - Heat-conductive module - Google Patents

Heat-conductive module

Info

Publication number
JPS6486541A
JPS6486541A JP62267654A JP26765487A JPS6486541A JP S6486541 A JPS6486541 A JP S6486541A JP 62267654 A JP62267654 A JP 62267654A JP 26765487 A JP26765487 A JP 26765487A JP S6486541 A JPS6486541 A JP S6486541A
Authority
JP
Japan
Prior art keywords
piston
end surface
exposed end
electric elements
grease
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62267654A
Other languages
English (en)
Japanese (ja)
Inventor
Hoon Deebuido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Publication of JPS6486541A publication Critical patent/JPS6486541A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62267654A 1986-10-24 1987-10-24 Heat-conductive module Pending JPS6486541A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB868625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (1)

Publication Number Publication Date
JPS6486541A true JPS6486541A (en) 1989-03-31

Family

ID=10606235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62267654A Pending JPS6486541A (en) 1986-10-24 1987-10-24 Heat-conductive module

Country Status (4)

Country Link
JP (1) JPS6486541A (mo)
DE (2) DE3735985A1 (mo)
FR (1) FR2605829A1 (mo)
GB (2) GB8625472D0 (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060132A (ja) * 2010-09-10 2012-03-22 Honeywell Internatl Inc 熱移送のための電気構成要素組立体

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (de) * 1990-12-17 1992-07-02 Ant Nachrichtentech Elektronik-baugruppe mit metallgehaeuse
DE9100467U1 (de) * 1991-01-16 1992-05-21 Robert Bosch Gmbh, 7000 Stuttgart Gehäuse eines elektrischen Steuergerätes
DE4104888C2 (de) * 1991-02-18 1994-09-08 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE4404035A1 (de) * 1994-02-09 1995-08-10 Sel Alcatel Ag Wärmeleitvorrichtung für elektrische Bauelemente
DE19901445C2 (de) * 1999-01-15 2002-07-11 Siemens Ag Halbleiter-Kühl-Anordnung
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (de) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
US7699102B2 (en) 2004-12-03 2010-04-20 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
EP2634798A1 (de) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Elektrische Vorrichtung mit Kühlgehäuse
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (en) * 2013-06-07 2014-12-10 Alcatel Lucent Thermal connector and heat distribution device for a thermal connector
EP3098557B1 (en) * 2015-05-26 2019-03-27 Advantech Co., Ltd. Dynamic heat conduction system
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
EP0130279B1 (en) * 1983-03-25 1989-03-08 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060132A (ja) * 2010-09-10 2012-03-22 Honeywell Internatl Inc 熱移送のための電気構成要素組立体

Also Published As

Publication number Publication date
DE3735985C2 (mo) 1992-10-15
GB8625472D0 (en) 1986-11-26
GB8724682D0 (en) 1987-11-25
DE3735985A1 (de) 1988-05-11
FR2605829A1 (fr) 1988-04-29
GB2197538A (en) 1988-05-18
GB2197538B (en) 1990-04-04
DE8714174U1 (de) 1988-03-03

Similar Documents

Publication Publication Date Title
JPS6486541A (en) Heat-conductive module
SE9102875L (sv) Termoelektriskt kylelement med flexibelt vaermeledningselement
US7997786B2 (en) Heating and cooling cup
AR008849A1 (es) Difusor enchufable para uso con una sustancia a ser difundida termicamente
US4153107A (en) Temperature equalizing element for a conduction cooling module
ATE521987T1 (de) Thermoelektrische einrichtungen
CA2115303A1 (fr) Dispositif de refroidissement de composants electriques de puissance
KR910013467A (ko) 반도체 소자 장착 및 냉각 시스템과 이를 이용한 조절된 전력 공급 시스템
DE69132491D1 (de) Rauschdämpfendes Element und elektrische Schaltung mit diesem Element
US4753287A (en) Circuit board installation
KR960028747A (ko) 전기장치
CN219226717U (zh) 一种带散热的高速可插拔连接器组件
DE60202080D1 (de) Brennstoffzelle mit optimierter thermischen verwaltung
JPS6477889A (en) Positive characteristic thermistor exothermic device
SU1671958A1 (ru) Преобразователь энергии
CN218388426U (zh) 一种鳍片散热器
CN110999821A (zh) 一种plc控制用恒温器
CN223909456U (zh) 一种具有新型散热结构的高光效led日光灯管
ES2015304B3 (es) Vaina captadora de temperatura.
JPS58173876A (ja) 電子冷凍装置
JP3083206U (ja) ケースを設けた安全加熱器
JPS649646A (en) Cooling module
JPH039337Y2 (mo)
ATE232973T1 (de) Messvorrichtung des wärmeaustauschs in wechselndem, nicht stationären oder übergangs- betrieb
JPS5735363A (en) Semiconductor device