GB2197538A - Cooling module for use in a circuit board installation - Google Patents

Cooling module for use in a circuit board installation Download PDF

Info

Publication number
GB2197538A
GB2197538A GB8724682A GB8724682A GB2197538A GB 2197538 A GB2197538 A GB 2197538A GB 8724682 A GB8724682 A GB 8724682A GB 8724682 A GB8724682 A GB 8724682A GB 2197538 A GB2197538 A GB 2197538A
Authority
GB
United Kingdom
Prior art keywords
piston
tubular housing
thermally conductive
face
exposed end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8724682A
Other versions
GB2197538B (en
GB8724682D0 (en
Inventor
David Horne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Publication of GB8724682D0 publication Critical patent/GB8724682D0/en
Publication of GB2197538A publication Critical patent/GB2197538A/en
Application granted granted Critical
Publication of GB2197538B publication Critical patent/GB2197538B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

1 GB2197538A 1
SPECIFICATION
An improved circuit board installation i 45 1 This invention relates to cabinets, cases and other enclosures for housing sub-racks or card frames carrying circuit boards and/or modules carrying other electrical components. A cabinet or other enclosure including such sub- racks or card frames and/or modules will hereinafter, for convenience, be referred to as a "circuit board installation of the kind described".
The development of silicon chips has re- sulted in a substantial increase in the component density of individual circuit boards and/or modules of a circuit board installation of the kind described and the increased component density of each circuit board and/or module of the installation has resulted in a greater power output and hence higher operating temperatures.
Conventional methods of controlling the temperature of the enclosure of a circuit board 25- installation of the kind described include normal convection, forced convection, e.g. fan cooling, liquid cooling, various forms of heat conductor or sink, and a combination of two or more of these methods.
Where it is recognised that a substantial proportion of the heat is emitted by a particu lar individual electrical component within a cir cuit board installation of the kind described, it has been proposed to provide for local cook ing of such an individual component, e.g. by 100 directing pressurised cooling fluid towards such an individual component, and/or for local extraction of heat from such an individual component, e.g. by means of a thermally con ductive module.
In one proposed arrangement for locally ex tracting heat from an individual electrical com ponent of a circuit board installation of the kind described, there is thermally interposed between the component and a thermal con ductor for conducting extracted heat to the environment externally of the enclosure of the installation, a thermally conductive module comprising a tubular housing made of a metal, metal alloy or other material of high thermal conductivity and closed at one end, and a spring loaded piston made of a metal or metal alloy of high thermal conductivity slidably mounted in and protruding from the tubular housing. The closed end of the tubular hous- 120 ing of the module is arranged in thermal con tact with the thermal conductor and the ex posed end face of the piston is urged by its associated spring into thermal contact with the individual component from which heat is 125 to be extracted so that heat emitted by the component flows via the piston and tubular housing into the thermal conductor from where it is conveyed to the surrounding envi ronment.
It is recognised that, unless the abutting surfaces of the component and the exposed end face of the piston are each substantially flat-and in many instances the component does not have a substantially flat surface-the efficiency of the heat transfer from the component to the spring loaded piston is unsatisfactory with the result that an undesirable proportion of heat emitted by the component is not extracted by the thermally conductive module.
It is an obhject of the present invention to provide, for use in a circuit board installation of the kind described, an improved thermally conductive module for locally extracting heat from an individual electrical component of the installation.
According to the invention the improved thermally conductive module comprises a tu- bular housing which is made of a metal, metal alloy or other material of high thermal conductivity and which is closed at one end; means at said closed end of the tubular housing for securing the housing to and in thermal contact with a thermal conductor; a spring-loaded piston of metal, metal alloy or other material of high thermal conductivity slidably mounted in and protruding from the tubular housing, which piston has at least one throughbore ex- tending through the opening into the exposed end face of the piston; and, contained in the closed bore of the tubular housing, a greaselike medium of high thermal conductivity, the arrangement being such that, when the tubular housing is secured to and in thermal contact with a thermal conductor and the exposed end face of the piston is brought into thermal contact with an electrical component from which heat is to be extracted, the piston is urged against the action of its associated spring means and said grease-like medium will exude from said throughbore or throughbores opening into the exposed end face of the piston and will flow between said exposed end face and the electrical component to provide an effective thermal contact between said electri cal component and the exposed end face of the piston.
The piston may have a single throughbore which is centrally located with respect to the exposed end face of the piston or it may have a plurality of throughbores circumferentially spaced around the central longitudinal axis of the piston. The exposed end face of the piston preferably is substantially fiat and, preferably also, lies in a plane radial to the longitudinal axis of the piston.
Preferably, the end part of the piston remote from said exposed end face has a recess into which the or each throughbore opens and which serves as a seating for a coil spring retained between the piston and the closed end wall of the tubular housing.
The exposed end face of the closed end of the tubular housing preferably is substantially 2 GB2197538A 2 flat and, preferably also, lies in a plane radial to the longitudinal axis of the housing. The means for securing the tubular housing to and in thermal contact with a thermal conductor may take any convenient form but it prefera bly comprises an externally screw threaded stud which protrudes from the closed end of the tubular housing and which can either be screwed into a tapped hole in a thermal con ductor or be passed through an aperture in a 75 thermal conductor and secured thereto by means of a nut. Alternatively, the closed end of the tubular housing may have a tapped hole into which a screw, passing through an aper ture in a thermal conductor, can be screwed to secure the thermally conductive module to and in thermal contact with the thermal con ductor.
The grease-like medium of high thermal con ductivity contained in the tubular housing may 85 be any suitable grease having the desired ther mally conductive properties. We prefer to em ploy for this purpose a silicone free, non-creep compound.
The tubular housing and piston may be 90 made of any metal or metal alloy of high ther mal conductivity. Preferred metals, metal al loys and other materials of which they may be made include aluminium-based alloys, copper- based alloys and non-electrically conductive metal oxides.
The improved thermally conductive module has the important advantage that, in addition to providing a good thermal contact between an electrical component from which heat is to be extracted and the exposed end face of the piston, the grease-like medium of high thermal conductivity also improves the thermal contact between the piston and the tubular housing in which the piston is slidably mounted and thus provides an improved thermally conductive path from the electrical component to a thermal conductor to which the module is secured.
The improved thermally conductive module is simple and inexpensive and can be readily secured to a thermal conductor of a circuit board installation of the kind described for the extraction of heat from any desired individual electrical component of the installation.
The invention also includes, in a circuit board installation of the kind described, at least one improved thermally conductive module as hereinbefore described which is ther- mally interposed between an electrical component of the installation and a thermal conductor.
The invention is further illustrated by a description, by way of example, of a preferred thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation of the kind described, with reference to the accompanying drawings, in which:- Figure 1 is a sectional side view of the pre- 130 ferred thermally conductive module, and Figure 2 is a fragmental side view of a circuit board installation of the kind described showing how two thermally conductive mo- dules as shown in Fig. 1 are employed to extract heat from two electrical components of the installation.
Referring to Fig. 1, the preferred thermally conductive module comprises a tubular housing 1 which is made of a metal alloy of high thermal conductivity and which is closed at one end 2. Slidably mounted in and protruding from the bore 3 of the tubular housing 1 is a piston 4 of metal alloy of high thermal con- ductivity which is urged towards the open end of the tubular body by a coil spring 6 retained between the closed end wall 2 of the tubular housing and the end wall of a recess 5 in the neighbouring end part of the piston. The piston 4 is retained in the bore 3 of the tubular housing 1 by a peripherally continuous lip 7 at the open end of the housing. Extending through the piston 4 and opening into the exposed end face 9 of the piston is a single throughbore 8 which is centrally located with respect to the exposed end face. The exposed end face 9 of the piston 4 is substantially flat and lies in a plane radial to the longitudinal axis of the piston. A grease-like me- dium 10 of high thermal conductivity is contained in the bore 3 of the tubular housing 1. The exposed end face of the closed end 2 of the tubular housing 1 is substantially flat and lies in a plane radial to the longitudinal axis of the housing and the closed end of the housing and a tapped hole 11 into which is screwed an externally screw-threaded stud 12 which protrudes from the closed end of the housing. In the fragmental side view of a circuit board installation of the kind described as shown in Fig. 2, a printed circuit board 20 has two individual electrical components 21 and 22 mounted on and electrically connected to the printed circuit of the board and, associ- ated with the printed circuit board, is a thermal conductor 24 which is in thermal contact with mutually spaced fins 25 for transferring heat from the conductor to the surrounding air. Associated with each individual electrical component 21 and 22 is a thermally conductive module 26 as described in Fig. 1. The tubular housing 1 of each thermally conductive module 26 is secured to and in thermal contact with the thermal conductor 24 by means of the screw-threaded stud 12 which passes through a hole in the thermal conductor and is secured thereto by a nut 14. The exposed end face 9 of the piston 4 of each thermally conductive module 26 is in thermal contact with its associated electrical component 21, 22 from which heat is to be extracted. The piston 4 is urged against the action of its associated coil spring 6 and grease-like medium 10 exudes from the throughbore 8 opening into the exposed end face 9 and flows 3 GB2197538A 3 between the exposed end face and the electrical component 21, 22 to provide an effective thermal contact between the electrical component and the exposed end face of the piston.
Since the grease-like medium of high thermal conductivity substantially fills any spaces between the abutting surfaces of the electrical component 21, 22 and the exposed end face 9 of the piston 4, there is a high efficiency of heat transfer from the component to the spring-loaded piston and hence via the tubular housing 1 to the thermal conductor 24.

Claims (14)

1. For use in a circuit board installation of the kind described, a thermally conductive mo dule for locally extracting heat from an indivi dual electrical component of the installation, which module comprises a tubular housing which is made of a metal, metal alloy or other 85 material of high thermal conductivity and which is closed at one end; means at said closed end of the tubular housing for securing the housing to and in thermal contact with a thermal conductor; a spring-loaded piston of metal, metal alloy or other material of high thermal conductivity slidably mounted in and protruding from the tubular housing, which piston has at least one throughbore extending through and opening into the exposed end face of the piston; and, contained in the closed bore of the tubular housing, a grease like medium of high thermal conductivity, the arrangement being such that, when the tubular housing is secured to and in thermal contact with a thermal conductor and the exposed end face of the piston is brought into thermal con tact with an electrical component from which heat is to be extracted, the piston is urged against the action of its associated spring means and said grease-like medium will exude from said throughbore or throughbores open ing into the exposed end face of the piston and will flow between said exposed end face and the electrical component to provide an effective thermal contact between said electri cal component and the exposed end face of the piston.
2. A thermally conductive module as claimed in Claim 1, wherein the piston has a 115 single throughbore which is centrally located with respect to the exposed end face of the piston.
3. A thermally conductive module as claimed in Claim 1, wherein the piston has a 120 plurality of throughbores circumferentially spaced around the central longitudinal axis of the piston.
4. A thermally conductive module as claimed in any one of the preceding Claims, wherein the exposed end face of the piston is substantially flat.
5. A thermally conductive module as claimed in Claim 4, wherein the substantially flat exposed end face of the piston lies in a plane radial to the longitudinal axis of the piston.
6. A thermally conductive module as claimed in any.one of the preceding Claims, wherein the end part of the piston remote from said exposed end face has a recess into which the or each throughbore opens and which serves as a seating for a coil spring retained between the piston and the closed end wall of the tubular housing and constituting the spring loading of the piston.
7. A thermally conductive module as claimed in any one of the preceding Claims, wherein the exposed end face of the closed end of the tubular housing is substantially flat.
8. A thermally conductive module as claimed in Claim 7, wherein the substantially flat exposed end face of the closed end of the tubular housing lies in a plane radial to the longitudinal axis of the housing.
9. A thermally conductive module as claimed in any one of the preceding Claims, whe ' rein the means for securing the tubular housing to and in thermal contact with a ther- mal conductor comprises an externally screwthreaded stud which protrudes from the closed end of the tubular housing and which can either be screwed into a tapped hole in a thermal conductor or be passed through an aperture in a thermal conductor and secured thereto by means of a nut.
10. A thermally conductive module as claimed in any one of Claims 1 to 8, wherein the means for securing the tubular housing to and in thermal contact with a thermal conduc- tor comprises a tapped hole in the closed end of the tubular housing into which a screw, passing through an aperture in a thermal con ductor, can be screwed.
11. A thermally conductive module as claimed in any one of the preceding Claims, wherein the grease-like medium of high ther mal conductivity contained in the tubular hous ing is a silicone free, non-creep compound.
12. A thermally conductive module as claimed in any one of the preceding Claims, wherein the tubular housing and piston are made of an aluminium-based alloy, a copper based alloy or a non-electrically conductive metal oxide.
13. For use in a circuit board installation of the kind described, a thermally conductive mo dule for locally extracting heat from an indivi dual electrical component of the installation substantially as hereinbefore described with reference to and as shown in the accompany ing drawings.
14. In a circuit board installation of the kind described, at least one thermally conduc- tive module as claimed in any one of the preceding Claims which is thermally interposed between an electrical component of the installation and a thermal conductor.
4 Published 1988 at The Patent Office, State House, 66/71 High Holborn, London WC 1 R 4TP. Further copies may be obtained from The Patent Office, Sales Branch, St Mary Cray, Orpington, Kent BR5 3RD. Printed by Burgess & Son (Abingdon) Ltd. Con. 1/87.
GB2197538A 4 1
GB8724682A 1986-10-24 1987-10-21 An improved circuit board installation Expired GB2197538B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (3)

Publication Number Publication Date
GB8724682D0 GB8724682D0 (en) 1987-11-25
GB2197538A true GB2197538A (en) 1988-05-18
GB2197538B GB2197538B (en) 1990-04-04

Family

ID=10606235

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8625472A Pending GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation
GB8724682A Expired GB2197538B (en) 1986-10-24 1987-10-21 An improved circuit board installation

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8625472A Pending GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Country Status (4)

Country Link
JP (1) JPS6486541A (en)
DE (2) DE3735985A1 (en)
FR (1) FR2605829A1 (en)
GB (2) GB8625472D0 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
US7699102B2 (en) 2004-12-03 2010-04-20 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
EP3098557A1 (en) * 2015-05-26 2016-11-30 Advantech Co., Ltd. Dynamic heat conduction system
EP4340554A1 (en) * 2022-09-14 2024-03-20 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (en) * 1990-12-17 1992-07-02 Ant Nachrichtentech Electronic module with metal housing - has circuit board with integrated circuit element in thermal contact with housing
DE9100467U1 (en) * 1991-01-16 1992-05-21 Robert Bosch Gmbh, 7000 Stuttgart Housing of an electrical control unit
DE4104888C2 (en) * 1991-02-18 1994-09-08 Ant Nachrichtentech Electronic assembly with metal housing
DE4118398C2 (en) * 1991-06-05 1994-07-21 Ant Nachrichtentech Electronics assembly with metal housing
DE4404035A1 (en) * 1994-02-09 1995-08-10 Sel Alcatel Ag Thermal conduction device for electrical components
DE19901445C2 (en) * 1999-01-15 2002-07-11 Siemens Ag Semiconductor cooling arrangement
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (en) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Heat sink for elktronische components and method for attaching the same
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
EP2634798A1 (en) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Electric device with cooling housing
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (en) * 2013-06-07 2014-12-10 Alcatel Lucent Thermal connector and heat distribution device for a thermal connector

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
EP0130279B1 (en) * 1983-03-25 1989-03-08 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly for cooling electronic parts

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
US7699102B2 (en) 2004-12-03 2010-04-20 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
EP3098557A1 (en) * 2015-05-26 2016-11-30 Advantech Co., Ltd. Dynamic heat conduction system
EP4340554A1 (en) * 2022-09-14 2024-03-20 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Also Published As

Publication number Publication date
GB8625472D0 (en) 1986-11-26
GB2197538B (en) 1990-04-04
GB8724682D0 (en) 1987-11-25
DE3735985A1 (en) 1988-05-11
DE8714174U1 (en) 1988-03-03
DE3735985C2 (en) 1992-10-15
FR2605829A1 (en) 1988-04-29
JPS6486541A (en) 1989-03-31

Similar Documents

Publication Publication Date Title
GB2197538A (en) Cooling module for use in a circuit board installation
US5920458A (en) Enhanced cooling of a heat dissipating circuit element
US6922340B2 (en) Stack up assembly
US5461541A (en) Enclosure for an electronic circuit module
US6839235B2 (en) Embedded heat pipe for a conduction cooled circuit card assembly
US4468717A (en) Apparatus for cooling integrated circuit chips
US4167031A (en) Heat dissipating assembly for semiconductor devices
US4753287A (en) Circuit board installation
US5019939A (en) Thermal management plate
US20020172010A1 (en) Electronic module with high cooling power
US4167771A (en) Thermal interface adapter for a conduction cooling module
US5353192A (en) Circuit card assembly
EP0757384A3 (en) Method and apparatus for dissipating heat from an integrated circuit
EP0001153B1 (en) Cooling heat generating electrical components in an electrical apparatus
US6101094A (en) Printed circuit board with integrated cooling mechanism
JP3043417B2 (en) Electrical devices, for example switching and control devices for motor vehicles
WO1999040625A1 (en) Thermal bus bar design for an electronic cartridge
KR910013467A (en) Semiconductor device mounting and cooling system and regulated power supply system
WO1981003734A1 (en) Heat pin integrated circuit packaging
GB2309827A (en) Surface complemental heat dissipation device
US6691766B1 (en) Cabinet cooling with heat pipe
GB2052164A (en) Assemblies of electrical components
US6510053B1 (en) Circuit board cooling system
CN109997421B (en) I/O circuit board for immersion cooled electronic devices
US4520426A (en) Cooling subrack for logic cards

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19931021