DE8714174U1 - - Google Patents

Info

Publication number
DE8714174U1
DE8714174U1 DE8714174U DE8714174U DE8714174U1 DE 8714174 U1 DE8714174 U1 DE 8714174U1 DE 8714174 U DE8714174 U DE 8714174U DE 8714174 U DE8714174 U DE 8714174U DE 8714174 U1 DE8714174 U1 DE 8714174U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8714174U
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balfour Beatty PLC
Original Assignee
BICC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BICC PLC filed Critical BICC PLC
Publication of DE8714174U1 publication Critical patent/DE8714174U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8714174U 1986-10-24 1987-10-23 Expired DE8714174U1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8625472A GB8625472D0 (en) 1986-10-24 1986-10-24 Circuit board installation

Publications (1)

Publication Number Publication Date
DE8714174U1 true DE8714174U1 (de) 1988-03-03

Family

ID=10606235

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19873735985 Granted DE3735985A1 (de) 1986-10-24 1987-10-23 Waermeleitender modul fuer gedruckte schaltungsplattenanordnung
DE8714174U Expired DE8714174U1 (de) 1986-10-24 1987-10-23

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19873735985 Granted DE3735985A1 (de) 1986-10-24 1987-10-23 Waermeleitender modul fuer gedruckte schaltungsplattenanordnung

Country Status (4)

Country Link
JP (1) JPS6486541A (de)
DE (2) DE3735985A1 (de)
FR (1) FR2605829A1 (de)
GB (2) GB8625472D0 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992013437A1 (de) * 1991-01-16 1992-08-06 Robert Bosch Gmbh Gehäuse eines elektrischen steuergerätes
EP0667737A1 (de) * 1994-02-09 1995-08-16 Alcatel SEL Aktiengesellschaft Wärmeleitvorrichtung für elektrische Bauelemente
EP2634798A1 (de) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Elektrische Vorrichtung mit Kühlgehäuse
EP2669943A1 (de) * 2012-05-28 2013-12-04 Alcatel Lucent Verfahren und Vorrichtung zur Bereitstellung des Transports einer Wärmelast zwischen einer Wärmequelle und einem Wärmeempfänger
EP2811515A1 (de) * 2013-06-07 2014-12-10 Alcatel Lucent Thermostecker und Wärmeverteilungsvorrichtung für einen Thermostecker

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040288A1 (de) * 1990-12-17 1992-07-02 Ant Nachrichtentech Elektronik-baugruppe mit metallgehaeuse
DE4104888C2 (de) * 1991-02-18 1994-09-08 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
DE4118398C2 (de) * 1991-06-05 1994-07-21 Ant Nachrichtentech Elektronik-Baugruppe mit Metallgehäuse
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
DE19901445C2 (de) * 1999-01-15 2002-07-11 Siemens Ag Halbleiter-Kühl-Anordnung
US6501658B2 (en) * 2001-02-16 2002-12-31 Intel Corporation Heatsink mounting with shock absorbers
DE10142975B4 (de) * 2001-09-01 2009-05-07 Conti Temic Microelectronic Gmbh Wärmeableitelement für elktronische Bauteile und Verfahren zum Anbringen desselben
US8024936B2 (en) 2004-11-16 2011-09-27 Halliburton Energy Services, Inc. Cooling apparatus, systems, and methods
WO2006060673A1 (en) 2004-12-03 2006-06-08 Halliburton Energy Services, Inc. Rechargeable energy storage device in a downhole operation
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
EP3098557B1 (de) * 2015-05-26 2019-03-27 Advantech Co., Ltd. System zur dynamischen wärmeleitung
US20240090131A1 (en) * 2022-09-14 2024-03-14 Hamilton Sundstrand Corporation Thermal management for flat no lead packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992013437A1 (de) * 1991-01-16 1992-08-06 Robert Bosch Gmbh Gehäuse eines elektrischen steuergerätes
EP0667737A1 (de) * 1994-02-09 1995-08-16 Alcatel SEL Aktiengesellschaft Wärmeleitvorrichtung für elektrische Bauelemente
EP2634798A1 (de) * 2012-02-29 2013-09-04 Siemens Aktiengesellschaft Elektrische Vorrichtung mit Kühlgehäuse
EP2669943A1 (de) * 2012-05-28 2013-12-04 Alcatel Lucent Verfahren und Vorrichtung zur Bereitstellung des Transports einer Wärmelast zwischen einer Wärmequelle und einem Wärmeempfänger
WO2013178398A1 (en) * 2012-05-28 2013-12-05 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
EP2811515A1 (de) * 2013-06-07 2014-12-10 Alcatel Lucent Thermostecker und Wärmeverteilungsvorrichtung für einen Thermostecker

Also Published As

Publication number Publication date
GB2197538A (en) 1988-05-18
DE3735985A1 (de) 1988-05-11
FR2605829A1 (fr) 1988-04-29
GB8724682D0 (en) 1987-11-25
GB2197538B (en) 1990-04-04
JPS6486541A (en) 1989-03-31
GB8625472D0 (en) 1986-11-26
DE3735985C2 (de) 1992-10-15

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