JPS6486534A - Alignment device - Google Patents

Alignment device

Info

Publication number
JPS6486534A
JPS6486534A JP63128408A JP12840888A JPS6486534A JP S6486534 A JPS6486534 A JP S6486534A JP 63128408 A JP63128408 A JP 63128408A JP 12840888 A JP12840888 A JP 12840888A JP S6486534 A JPS6486534 A JP S6486534A
Authority
JP
Japan
Prior art keywords
target
mask alignment
stage
time
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63128408A
Other languages
Japanese (ja)
Inventor
Yoshihiko Kiyokuni
Haruo Nagai
Masaki Tsukagoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63128408A priority Critical patent/JPS6486534A/en
Publication of JPS6486534A publication Critical patent/JPS6486534A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To improve operating efficiency by positioning a target into an optical visual field while reducing the quantity of positional displacement of the target when the target in a sample is conformed and operated. CONSTITUTION:The second mask alignment of a wafer is inspected itself. Two- time movement is changed into a mean value because of second mask alignment at that time, and the corrected origin of an XY stage 4 is acquired by a moving average value. A mask is aligned while being observed by a microscope. Consequently, movement correction is predicted before mask alignment with reference to the first and second movement correction of the XY stage, and the XY stage 4 is returned automatically to the corrected origin. As a result, a target 21 in the wafer 1 is kept within a narrow microscope visual field 22 approximately positively, and the accuracy of the target is also improved. Accordingly, the correction time of mask alignment is shortened, and workhours are reduced.
JP63128408A 1988-05-27 1988-05-27 Alignment device Pending JPS6486534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63128408A JPS6486534A (en) 1988-05-27 1988-05-27 Alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63128408A JPS6486534A (en) 1988-05-27 1988-05-27 Alignment device

Publications (1)

Publication Number Publication Date
JPS6486534A true JPS6486534A (en) 1989-03-31

Family

ID=14984042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63128408A Pending JPS6486534A (en) 1988-05-27 1988-05-27 Alignment device

Country Status (1)

Country Link
JP (1) JPS6486534A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02292842A (en) * 1989-05-08 1990-12-04 Toshiba Corp Substrate member treating device
JP2010188423A (en) * 2008-07-04 2010-09-02 Smk:Kk Method for controlling welding of workpiece on basis of zero point setting

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02292842A (en) * 1989-05-08 1990-12-04 Toshiba Corp Substrate member treating device
JP2010188423A (en) * 2008-07-04 2010-09-02 Smk:Kk Method for controlling welding of workpiece on basis of zero point setting

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