JPS6482639A - Method of sealing semiconductor integrated element with resin in surface mounting of electric wiring substrate - Google Patents

Method of sealing semiconductor integrated element with resin in surface mounting of electric wiring substrate

Info

Publication number
JPS6482639A
JPS6482639A JP24220087A JP24220087A JPS6482639A JP S6482639 A JPS6482639 A JP S6482639A JP 24220087 A JP24220087 A JP 24220087A JP 24220087 A JP24220087 A JP 24220087A JP S6482639 A JPS6482639 A JP S6482639A
Authority
JP
Japan
Prior art keywords
resin
semiconductor integrated
wiring substrate
surface mounting
electric wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24220087A
Other languages
Japanese (ja)
Other versions
JP2519477B2 (en
Inventor
Atsushi Okuno
Masajiro Inoue
Tsuneichi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON RETSUKU KK
Original Assignee
NIPPON RETSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON RETSUKU KK filed Critical NIPPON RETSUKU KK
Priority to JP62242200A priority Critical patent/JP2519477B2/en
Publication of JPS6482639A publication Critical patent/JPS6482639A/en
Application granted granted Critical
Publication of JP2519477B2 publication Critical patent/JP2519477B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the productivity of an electric circuit substrate by forcibly filling liquid sealing resin via a through hole in an air gap formed between the through hole and an element. CONSTITUTION:A stencil 3 is pressed on the surface of a substrate 1, and air gaps 6 are formed between through holes 3a and elements contained therein. Then, liquid sealing resin 5 is broadened by a doctor knife 7 in a thin layer state, and the resin 5 is forced and filled through porous section 2a1 into the air gaps 6 by the operation of a squeegee 8. Thus, an element 2 sealed with a resin layer 5a is obtained. Since a printed substrate 1 can be treated as one unit in this manner, its productivity is excellent.
JP62242200A 1987-09-25 1987-09-25 Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board Expired - Lifetime JP2519477B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62242200A JP2519477B2 (en) 1987-09-25 1987-09-25 Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62242200A JP2519477B2 (en) 1987-09-25 1987-09-25 Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board

Publications (2)

Publication Number Publication Date
JPS6482639A true JPS6482639A (en) 1989-03-28
JP2519477B2 JP2519477B2 (en) 1996-07-31

Family

ID=17085757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62242200A Expired - Lifetime JP2519477B2 (en) 1987-09-25 1987-09-25 Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board

Country Status (1)

Country Link
JP (1) JP2519477B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997033304A3 (en) * 1996-02-23 1997-10-16 Mpm Corp Applying encapsulating material to substrates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same
JPS5399874A (en) * 1977-02-14 1978-08-31 Hitachi Ltd Continuous semiconductor covering equipment
JPS5544315A (en) * 1978-09-25 1980-03-28 Asahi Chem Ind Co Ltd Simple conversion and treating method of living discharge water to intermediate water

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same
JPS5399874A (en) * 1977-02-14 1978-08-31 Hitachi Ltd Continuous semiconductor covering equipment
JPS5544315A (en) * 1978-09-25 1980-03-28 Asahi Chem Ind Co Ltd Simple conversion and treating method of living discharge water to intermediate water

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997033304A3 (en) * 1996-02-23 1997-10-16 Mpm Corp Applying encapsulating material to substrates
US6067709A (en) * 1996-02-23 2000-05-30 Mpm Corporation Applying encapsulating material to substrates

Also Published As

Publication number Publication date
JP2519477B2 (en) 1996-07-31

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