JPS6482639A - Method of sealing semiconductor integrated element with resin in surface mounting of electric wiring substrate - Google Patents
Method of sealing semiconductor integrated element with resin in surface mounting of electric wiring substrateInfo
- Publication number
- JPS6482639A JPS6482639A JP24220087A JP24220087A JPS6482639A JP S6482639 A JPS6482639 A JP S6482639A JP 24220087 A JP24220087 A JP 24220087A JP 24220087 A JP24220087 A JP 24220087A JP S6482639 A JPS6482639 A JP S6482639A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor integrated
- wiring substrate
- surface mounting
- electric wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve the productivity of an electric circuit substrate by forcibly filling liquid sealing resin via a through hole in an air gap formed between the through hole and an element. CONSTITUTION:A stencil 3 is pressed on the surface of a substrate 1, and air gaps 6 are formed between through holes 3a and elements contained therein. Then, liquid sealing resin 5 is broadened by a doctor knife 7 in a thin layer state, and the resin 5 is forced and filled through porous section 2a1 into the air gaps 6 by the operation of a squeegee 8. Thus, an element 2 sealed with a resin layer 5a is obtained. Since a printed substrate 1 can be treated as one unit in this manner, its productivity is excellent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242200A JP2519477B2 (en) | 1987-09-25 | 1987-09-25 | Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62242200A JP2519477B2 (en) | 1987-09-25 | 1987-09-25 | Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6482639A true JPS6482639A (en) | 1989-03-28 |
JP2519477B2 JP2519477B2 (en) | 1996-07-31 |
Family
ID=17085757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62242200A Expired - Lifetime JP2519477B2 (en) | 1987-09-25 | 1987-09-25 | Resin encapsulation method for semiconductor integrated device in surface mounting of electric wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519477B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997033304A3 (en) * | 1996-02-23 | 1997-10-16 | Mpm Corp | Applying encapsulating material to substrates |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5365062A (en) * | 1976-11-24 | 1978-06-10 | Hitachi Ltd | Production of semiconductor and apparatus for the same |
JPS5399874A (en) * | 1977-02-14 | 1978-08-31 | Hitachi Ltd | Continuous semiconductor covering equipment |
JPS5544315A (en) * | 1978-09-25 | 1980-03-28 | Asahi Chem Ind Co Ltd | Simple conversion and treating method of living discharge water to intermediate water |
-
1987
- 1987-09-25 JP JP62242200A patent/JP2519477B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5365062A (en) * | 1976-11-24 | 1978-06-10 | Hitachi Ltd | Production of semiconductor and apparatus for the same |
JPS5399874A (en) * | 1977-02-14 | 1978-08-31 | Hitachi Ltd | Continuous semiconductor covering equipment |
JPS5544315A (en) * | 1978-09-25 | 1980-03-28 | Asahi Chem Ind Co Ltd | Simple conversion and treating method of living discharge water to intermediate water |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997033304A3 (en) * | 1996-02-23 | 1997-10-16 | Mpm Corp | Applying encapsulating material to substrates |
US6067709A (en) * | 1996-02-23 | 2000-05-30 | Mpm Corporation | Applying encapsulating material to substrates |
Also Published As
Publication number | Publication date |
---|---|
JP2519477B2 (en) | 1996-07-31 |
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Legal Events
Date | Code | Title | Description |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080517 Year of fee payment: 12 |