JPS6482551A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6482551A JPS6482551A JP24183487A JP24183487A JPS6482551A JP S6482551 A JPS6482551 A JP S6482551A JP 24183487 A JP24183487 A JP 24183487A JP 24183487 A JP24183487 A JP 24183487A JP S6482551 A JPS6482551 A JP S6482551A
- Authority
- JP
- Japan
- Prior art keywords
- biasing
- envelope
- recess
- resistor
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a semiconductor device having functions of a stabilized resistor in a package itself, by providing a resistor pattern between each DC biasing lead and a connecting section of a DC biasing electrode of a semiconductor chip received in a recess in an envelope. CONSTITUTION:An envelope 1 having a recess for receiving a semiconductor chip is provided and a plurality of DC biasing leads 3, 5 are provided such that they are projected from predetermined points of the envelope 1. Resistor patterns 32, 52 are provided between the DC biasing leads 3, 6 and connecting sections 31, 51 of DC biasing electrodes of the semiconductor chip received in the recess of the envelope 1, respectively. According to such arrangement, resistor patterns 32, 52 formed in a package serve equivalently to stabilized resistors which used to be provided in conventional amplifier ICs and heat generation within the amplifier IC can be prevented to eliminate abnormal oscillation of the circuit. Thus, a semiconductor device having stable characteristics can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24183487A JPS6482551A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24183487A JPS6482551A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6482551A true JPS6482551A (en) | 1989-03-28 |
Family
ID=17080190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24183487A Pending JPS6482551A (en) | 1987-09-24 | 1987-09-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6482551A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0514002A (en) * | 1991-07-05 | 1993-01-22 | Mitsubishi Electric Corp | Semiconductor device |
-
1987
- 1987-09-24 JP JP24183487A patent/JPS6482551A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0514002A (en) * | 1991-07-05 | 1993-01-22 | Mitsubishi Electric Corp | Semiconductor device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3785835D1 (en) | CHIP FUSE. | |
DE69132880D1 (en) | SEMICONDUCTOR CHIP ARRANGEMENTS, MANUFACTURING METHODS AND COMPONENTS FOR THE SAME | |
KR950001365B1 (en) | Substrate for packaging a semiconductor device, packaging structure and method | |
EP0304263A3 (en) | Semiconductor chip assembly | |
JPS5553446A (en) | Container of electronic component | |
EP0221496A3 (en) | Integrated circuit package | |
JPS6482551A (en) | Semiconductor device | |
JPS57164548A (en) | Semiconductor device | |
ES295772U (en) | Flat package for integrated circuit memory chips. | |
JPS5561041A (en) | Packaging device for semiconductor integrated circuit | |
JPS5618454A (en) | Hybrid integrated circuit | |
JPS57104247A (en) | Terminal block with resistor | |
JPS57186383A (en) | Semiconductor laser device | |
JPS5339891A (en) | Semiconductor integrated circuit device | |
JPS6481253A (en) | Package of semiconductor integrated circuit | |
JPS6489524A (en) | Semiconductor integrated circuit | |
JPH04199552A (en) | Ic package | |
JPS5561045A (en) | Packaging device for semiconductor integrated circuit | |
JPS5240974A (en) | Package for semiconductor chips | |
JPS6316650A (en) | Integrated circuit | |
JPH01150332A (en) | Printed circuit board | |
JPS5645041A (en) | Semiconductor integrated circuit device | |
JPS5749255A (en) | Package with external terminating circuit | |
JPS5674952A (en) | Semiconductor device | |
JPS6421935A (en) | Tape carrier |