JPS6481346A - Sealing structure of chip component of microwave integrated circuit - Google Patents
Sealing structure of chip component of microwave integrated circuitInfo
- Publication number
- JPS6481346A JPS6481346A JP23921287A JP23921287A JPS6481346A JP S6481346 A JPS6481346 A JP S6481346A JP 23921287 A JP23921287 A JP 23921287A JP 23921287 A JP23921287 A JP 23921287A JP S6481346 A JPS6481346 A JP S6481346A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- component
- cap
- sealed
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
PURPOSE:To easily readjust a circuit after a chip component to be necessarily sealed is hermetically sealed by adhering a cap and the like made of hermetically sealing insulator covering the component on a dielectric substrate, to enhance the performance and reliability of the circuit and to reduce the cost by sealing only the section of the component to be necessarily sealed so that the other circuit section remains in a nonsealing structure, and hermetically sealing the substrate with the cap by adhering the cap to the substrate. CONSTITUTION:A chip component 1 to be necessarily sealed and other component 11 are placed on a dielectric substrate 2 on which a passive circuit 3 is pattern-formed, connected to the circuit 3, and secured to one face of A metal housing 5. A cap 4 covers the component 1, and is hermetically adhered to the substrate 2. In this case, since the edge of the cap 4 and the adhering material are brought into contact with the insulated circuits 3 therebetween, it is necessary to so consider as not to reduce circuit characteristics with insulation particularly for high frequencies. Since only the section of the component to be necessarily sealed is sealed, the other circuit section remains in a nonsealing structure, it does not affect the influence to the constitution of a microwave integrated circuit. Accordingly, it can be easily readjusted even after sealing, and it can be reduced in size and cost, and enhanced in performance and reliability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23921287A JPS6481346A (en) | 1987-09-24 | 1987-09-24 | Sealing structure of chip component of microwave integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23921287A JPS6481346A (en) | 1987-09-24 | 1987-09-24 | Sealing structure of chip component of microwave integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6481346A true JPS6481346A (en) | 1989-03-27 |
Family
ID=17041411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23921287A Pending JPS6481346A (en) | 1987-09-24 | 1987-09-24 | Sealing structure of chip component of microwave integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6481346A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6677669B2 (en) * | 2002-01-18 | 2004-01-13 | International Rectifier Corporation | Semiconductor package including two semiconductor die disposed within a common clip |
-
1987
- 1987-09-24 JP JP23921287A patent/JPS6481346A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6677669B2 (en) * | 2002-01-18 | 2004-01-13 | International Rectifier Corporation | Semiconductor package including two semiconductor die disposed within a common clip |
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