JPS6481328A - Polygonal semiconductor device - Google Patents
Polygonal semiconductor deviceInfo
- Publication number
- JPS6481328A JPS6481328A JP23733387A JP23733387A JPS6481328A JP S6481328 A JPS6481328 A JP S6481328A JP 23733387 A JP23733387 A JP 23733387A JP 23733387 A JP23733387 A JP 23733387A JP S6481328 A JPS6481328 A JP S6481328A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wiring
- corner part
- carrier
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01072—Hafnium [Hf]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23733387A JPS6481328A (en) | 1987-09-24 | 1987-09-24 | Polygonal semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23733387A JPS6481328A (en) | 1987-09-24 | 1987-09-24 | Polygonal semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6481328A true JPS6481328A (en) | 1989-03-27 |
Family
ID=17013824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23733387A Pending JPS6481328A (en) | 1987-09-24 | 1987-09-24 | Polygonal semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6481328A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0445134U (ja) * | 1990-08-20 | 1992-04-16 | ||
JPH04188738A (ja) * | 1990-11-22 | 1992-07-07 | Hitachi Ltd | 集積回路素子 |
US5701234A (en) * | 1995-12-06 | 1997-12-23 | Pacesetter, Inc. | Surface mount component for selectively configuring a printed circuit board and method for using the same |
WO2011016157A1 (ja) * | 2009-08-07 | 2011-02-10 | パナソニック株式会社 | 半導体装置および電子装置 |
DE102017108136A1 (de) | 2017-04-13 | 2018-10-18 | X-Fab Semiconductor Foundries Ag | Geometrisch geformte Bauelemente in einer Anordnung für einen Überführungsdruck und zugehörige Verfahren |
-
1987
- 1987-09-24 JP JP23733387A patent/JPS6481328A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0445134U (ja) * | 1990-08-20 | 1992-04-16 | ||
JPH04188738A (ja) * | 1990-11-22 | 1992-07-07 | Hitachi Ltd | 集積回路素子 |
US5701234A (en) * | 1995-12-06 | 1997-12-23 | Pacesetter, Inc. | Surface mount component for selectively configuring a printed circuit board and method for using the same |
WO2011016157A1 (ja) * | 2009-08-07 | 2011-02-10 | パナソニック株式会社 | 半導体装置および電子装置 |
US8493765B2 (en) | 2009-08-07 | 2013-07-23 | Panasonic Corporation | Semiconductor device and electronic device |
DE102017108136A1 (de) | 2017-04-13 | 2018-10-18 | X-Fab Semiconductor Foundries Ag | Geometrisch geformte Bauelemente in einer Anordnung für einen Überführungsdruck und zugehörige Verfahren |
DE102017108136B4 (de) | 2017-04-13 | 2019-03-14 | X-Fab Semiconductor Foundries Ag | Geometrisch geformte Bauelemente in einer Anordnung für einen Überführungsdruck (Transfer Print) und zugehörige Verfahren |
US10845710B2 (en) | 2017-04-13 | 2020-11-24 | Jpmorgan Chase Bank, N.A. | Geometrically shaped components in an assembly for a transfer print and associated methods |
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