JPS648070B2 - - Google Patents

Info

Publication number
JPS648070B2
JPS648070B2 JP9909681A JP9909681A JPS648070B2 JP S648070 B2 JPS648070 B2 JP S648070B2 JP 9909681 A JP9909681 A JP 9909681A JP 9909681 A JP9909681 A JP 9909681A JP S648070 B2 JPS648070 B2 JP S648070B2
Authority
JP
Japan
Prior art keywords
solder
bath
molten solder
metal material
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9909681A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57169074A (en
Inventor
Hetsuku Furiidoritsuhi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURIIDORITSUHI HETSUKU KG
Original Assignee
FURIIDORITSUHI HETSUKU KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURIIDORITSUHI HETSUKU KG filed Critical FURIIDORITSUHI HETSUKU KG
Publication of JPS57169074A publication Critical patent/JPS57169074A/ja
Publication of JPS648070B2 publication Critical patent/JPS648070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
JP9909681A 1980-12-18 1981-06-27 Method and device for melt plating solderble layer comprising tin or tin-lead alloy to metal material or part continuously Granted JPS57169074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803047671 DE3047671C2 (de) 1980-12-18 1980-12-18 Verfahren zum kontinuierlichen schmelzflüssigen Überziehen von Metallteilen mit einer lötfähigen Schicht aus Zinn oder Zinn-Blei-Legierung und Vorrichtung zur Durchführung eines solchen Verfahrens

Publications (2)

Publication Number Publication Date
JPS57169074A JPS57169074A (en) 1982-10-18
JPS648070B2 true JPS648070B2 (de) 1989-02-13

Family

ID=6119447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9909681A Granted JPS57169074A (en) 1980-12-18 1981-06-27 Method and device for melt plating solderble layer comprising tin or tin-lead alloy to metal material or part continuously

Country Status (2)

Country Link
JP (1) JPS57169074A (de)
DE (1) DE3047671C2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338347A1 (de) * 1983-10-21 1985-05-02 Siemens AG, 1000 Berlin und 8000 München Feuerverzinnen von anschlussbeinchen elektronischer bauelemente, die sich im verband eines traegerbandes befinden
DE3425717A1 (de) * 1983-10-21 1986-01-23 Siemens AG, 1000 Berlin und 8000 München Feuerverzinnung von anschlussbeinchen elektronischer bauelemente, die sich im verband eines traegerbandes befinden
DE3346142C1 (de) * 1983-12-21 1985-08-01 Friedrich Heck GmbH, 5870 Hemer Verfahren zum schmelzflüssigen Überziehen von Metallbändern, Rohren, Drähten oder dgl. mit einer lötfähigen Schicht aus Zinn oder Zinn-Blei-Legierungen und Vorrichtungen zur Durchführung eines solchen Verfahrens
JP2563416B2 (ja) * 1987-12-25 1996-12-11 松下電器産業株式会社 プリント基板の表面処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521542A1 (de) * 1951-01-28 1969-09-11 Telefunken Patent Verfahren und Vorrichtung zum Verzinnen von Halbleiterscheiben
US3513018A (en) * 1967-02-27 1970-05-19 Inland Steel Co Method for producing wiped metal coatings
DE1771792A1 (de) * 1968-07-10 1972-01-13 Siemens Ag Verfahren und Vorrichtung zum Entfernen ueberschuessigen Zinns beim Tauchverzinnen
DE1796237A1 (de) * 1968-09-26 1972-08-10 Siemens Ag Verfahren zum Herstellen von Zinn- oder Zinnlegierungsschichten einer Dicke groesser als 3 my m auf Draht aus Kupfer und Kupferlegierungen durch Feuerverzinnen

Also Published As

Publication number Publication date
DE3047671A1 (de) 1982-07-22
JPS57169074A (en) 1982-10-18
DE3047671C2 (de) 1982-12-16

Similar Documents

Publication Publication Date Title
JPS5881557A (ja) プリント板の金属化面上にろう層を被覆するための装置
DE3038841C2 (de)
TW201128693A (en) Method and device for the treatment of a substrate surface of a substrate
JPS648070B2 (de)
US20120055980A1 (en) Apparatus and Method for Providing an Inerting Gas During Soldering
EP0343616A2 (de) Anordnung zum Löten von gedruckten Schaltungen
EP2204464A1 (de) Vorrichtung zur herstellung einer feuerverzinkten und galvanisierten stahlplatte
US5678752A (en) Wave soldering process
TWI401131B (zh) 於軟焊時提供惰性化氣體的設備及方法
US4246865A (en) One side surface molten metallic coating apparatus
US2394545A (en) Tin plate manufacture
EP0032430A1 (de) Vorrichtung zum Auftragen flüssiger Chemikalien auf ein sich bewegendes Flächengebilde
US5139822A (en) Method for coating solder on selective areas of a metal strip
GB2159084A (en) Vapour phase soldering
US4077443A (en) Solder resist applying machine
SU1073022A1 (ru) Устройство дл лужени печатных плат
JP2982459B2 (ja) アキシャルリード部品の半田コーティング方法および装置
US3068566A (en) Method of solder coating strip stock
JP7334716B2 (ja) 電子部品の製造装置
US343345A (en) Process of and apparatus for coating paper and other fabrics
DE3340142C1 (de)
DE3346142C1 (de) Verfahren zum schmelzflüssigen Überziehen von Metallbändern, Rohren, Drähten oder dgl. mit einer lötfähigen Schicht aus Zinn oder Zinn-Blei-Legierungen und Vorrichtungen zur Durchführung eines solchen Verfahrens
JP2619976B2 (ja) リフロー方法
JPH0740262Y2 (ja) エナメル線の塗布装置
JPS631385Y2 (de)