JPS57169074A - Method and device for melt plating solderble layer comprising tin or tin-lead alloy to metal material or part continuously - Google Patents

Method and device for melt plating solderble layer comprising tin or tin-lead alloy to metal material or part continuously

Info

Publication number
JPS57169074A
JPS57169074A JP9909681A JP9909681A JPS57169074A JP S57169074 A JPS57169074 A JP S57169074A JP 9909681 A JP9909681 A JP 9909681A JP 9909681 A JP9909681 A JP 9909681A JP S57169074 A JPS57169074 A JP S57169074A
Authority
JP
Japan
Prior art keywords
tin
solderble
layer
metal material
lead alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9909681A
Other languages
Japanese (ja)
Other versions
JPS648070B2 (en
Inventor
Hetsuku Furiidoritsuhi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURIIDORITSUHI HETSUKU KG
Original Assignee
FURIIDORITSUHI HETSUKU KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURIIDORITSUHI HETSUKU KG filed Critical FURIIDORITSUHI HETSUKU KG
Publication of JPS57169074A publication Critical patent/JPS57169074A/en
Publication of JPS648070B2 publication Critical patent/JPS648070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
JP9909681A 1980-12-18 1981-06-27 Method and device for melt plating solderble layer comprising tin or tin-lead alloy to metal material or part continuously Granted JPS57169074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803047671 DE3047671C2 (en) 1980-12-18 1980-12-18 Process for the continuous molten coating of metal parts with a solderable layer of tin or tin-lead alloy and apparatus for carrying out such a process

Publications (2)

Publication Number Publication Date
JPS57169074A true JPS57169074A (en) 1982-10-18
JPS648070B2 JPS648070B2 (en) 1989-02-13

Family

ID=6119447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9909681A Granted JPS57169074A (en) 1980-12-18 1981-06-27 Method and device for melt plating solderble layer comprising tin or tin-lead alloy to metal material or part continuously

Country Status (2)

Country Link
JP (1) JPS57169074A (en)
DE (1) DE3047671C2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171292A (en) * 1987-12-25 1989-07-06 Matsushita Electric Ind Co Ltd Surface treating method for printed board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338347A1 (en) * 1983-10-21 1985-05-02 Siemens AG, 1000 Berlin und 8000 München Hot tinning of connecting leads of electronic components forming part of a carrier strip
DE3425717A1 (en) * 1983-10-21 1986-01-23 Siemens AG, 1000 Berlin und 8000 München Hot-dip tinning of connecting pins of electronic components which are placed in the assembly of a substrate strip
DE3346142C1 (en) * 1983-12-21 1985-08-01 Friedrich Heck GmbH, 5870 Hemer Process for the fusible coating of metal strips, tubes, wires or the like with a solderable layer of tin or tin-lead alloys and apparatus for carrying out such a process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521542A1 (en) * 1951-01-28 1969-09-11 Telefunken Patent Method and device for tinning semiconductor wafers
US3513018A (en) * 1967-02-27 1970-05-19 Inland Steel Co Method for producing wiped metal coatings
DE1771792A1 (en) * 1968-07-10 1972-01-13 Siemens Ag Method and device for removing excess tin during dip tinning
DE1796237A1 (en) * 1968-09-26 1972-08-10 Siemens Ag Process for the production of tin or tin alloy layers with a thickness greater than 3 my m on wire made of copper and copper alloys by hot-dip tinning

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171292A (en) * 1987-12-25 1989-07-06 Matsushita Electric Ind Co Ltd Surface treating method for printed board

Also Published As

Publication number Publication date
DE3047671A1 (en) 1982-07-22
JPS648070B2 (en) 1989-02-13
DE3047671C2 (en) 1982-12-16

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