DE3338347A1 - Hot tinning of connecting leads of electronic components forming part of a carrier strip - Google Patents
Hot tinning of connecting leads of electronic components forming part of a carrier stripInfo
- Publication number
- DE3338347A1 DE3338347A1 DE19833338347 DE3338347A DE3338347A1 DE 3338347 A1 DE3338347 A1 DE 3338347A1 DE 19833338347 DE19833338347 DE 19833338347 DE 3338347 A DE3338347 A DE 3338347A DE 3338347 A1 DE3338347 A1 DE 3338347A1
- Authority
- DE
- Germany
- Prior art keywords
- carrier tape
- hot
- solder
- electronic components
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000004332 silver Substances 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 238000000576 coating method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
- B23K3/0676—Conveyors therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0035—Means for continuously moving substrate through, into or out of the bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
- C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
Feuerverzinnen von Anschlußbeinchen elektronischer Bau-Hot-dip tinning of leads of electronic components
elemente, die sich im Verband eines Trägerbandes befinden.elements that are in the association of a carrier tape.
Die Erfindung betrifft die kontinuierliche Feuerverzinnung von Anschlußbeinchen elektronischer Bauelemente, wobei sich die Bauelemente noch im Verband eines Trägerbandes befinden. Unter Trägerband ist im Sinne des Anmeldungsgegenstandes ein Metallband zu verstehen.The invention relates to the continuous hot-dip tinning of leads electronic components, the components still in the association of a carrier tape are located. In the sense of the subject of the application, a metal tape is a carrier tape to understand.
Zur Gewährleistung der Lötbarkeit müssen die Anschlußbeinchen elektrischer Bauelemente belotet sein. Galvanische Überzüge genügen häufig den Anforderungen nicht; dagegen sind schmelzflüssig aufgebrachte Uberzüge, vorzugsweise einer Zinn-Blei-Legierung ("Feuerverzinnung"), ein vorzüglicher Schutz und eine gute Voraussetzung für ein späteres Reflow-Lötverfahrenoder für ein beliebiges anderes Lötverfahren.To ensure solderability, the connection pins must be electrical Components be soldered. Electroplated coatings often meet the requirements not; on the other hand, molten coatings, preferably a tin-lead alloy, are applied ("Fire tinning"), excellent protection and a good basis for a later reflow soldering process or for any other soldering process.
In der DE-PS 30 47 671 ist ein Verfahren zum kontinuierlichen schmelzflüssigen Überziehen von Metallteilen mit einer lötfähigen Schicht aus Zinn oder Zinn-Blei-Legierung und eine Vorrichtung zur Durchführung eines solchen Verfahrens beschrieben und dargestellt. Diese bekannte Methode benutzt Abstreifer aus gepreßter, mit flüssigem Lot benetzter Stahlwolle oder dergleichen, wobei die Wirkung die eines Schwammes ist. Ein Nachteil dieser Methode besteht in der zunehmenden Verschmutzung des porösen Abstreifers.In DE-PS 30 47 671 is a process for continuous molten Coating of metal parts with a solderable layer of tin or tin-lead alloy and an apparatus for carrying out such a method is described and illustrated. This known method uses wipers made from pressed solder wetted with liquid solder Steel wool or the like, the effect of which is that of a sponge. A disadvantage this method consists in increasing contamination of the porous scraper.
Die Entfernung überschüssigen Lotes aus Bohrungen und so weiter durch bewegtes heißes oder kaltes Gas oder auch durch bewegte heiße Flüssigkeit ist zum Beispiel durch das Heißluftverzinnen bekannt. Die Schwierigkeit bei diesem Verfahren besteht allgemein darin, daß die Lotschichtstärke schwer zu kalibrieren ist und nicht in vorbestimmbarer Weise an verschiedenen Stellen desselben Objektes verschieden stark gestaltet werden kann. Eine Schwierigkeit stellt außerdem der Verbleib des herausgeblasenen, fein zerstäubten Lotes dar.Removal of excess solder from holes and so on moving hot or cold gas or moving hot liquid is for Example through known as hot air tinning. The difficulty This method generally consists in that the thickness of the solder layer is difficult to achieve is to be calibrated and not in a predeterminable manner at different points of the same Object can be designed with different strengths. One difficulty also poses the whereabouts of the blown out, finely atomized solder.
Bei den bisherigen Verfahren zur kontinuierlichen Entfernung überschüssigen Lotes war die gesamte Oberfläche - auch des Trägerbleches - versilbert und wurde demnach mit Lot bedeckt. Dieses Verfahren beinhaltet folgende graduelle Nachteile: a) Durch das Beloten auch des Trägerbandes wird der Lotverbrauch, das ist der Austrag aus dem Lotbad, sehr hoch.With previous methods of continuous removal, excess The entire surface - including the carrier plate - was silver-plated and was soldered therefore covered with solder. This method has the following gradual disadvantages: a) By soldering the carrier tape as well, the solder consumption, that is the discharge from the solder bath, very high.
b) Insbesondere das Lot auf den seitlichen Transportstreifen und an den Transport- und Justier-Löchern kann die weitere Verarbeitung, das heißt das Ausstanzen der einzelnen Halbleiter und das dabei erfolgende Biegen der Anschlußbeinchen auf genaue eng tolerierte Maße, behindern.b) In particular the solder on the lateral transport strips and on The transport and adjustment holes can be used for further processing, that is to say that Punching out the individual semiconductors and the resulting bending of the connecting pins to exact, tightly tolerated dimensions.
Der Erfindung liegt die Aufgabe zugrunde, beim Feuerverzinnen die Bauelementanschlüsse mit einer definierten Lotschicht zu versehen und den Lotverbrauch zu reduzieren. Durch die Erfindung soll nicht nur eine einwandfreie Belotung der Anschlußbeinchen unter Freihaltung der Beinchen-Zwischenräume, sondern auch für ein Abstreifen einzelner schlecht benetzend auf der Kupferoberfläche sitzender Lottropfen Sorge getragen werden.The invention is based on the object when hot-dip tinning Providing component connections with a defined layer of solder and reducing solder consumption to reduce. The invention is not only intended to ensure proper Belotung of the Terminal legs while keeping the space between the legs free, but also for wiping off individual drops of solder that are poorly wetting on the copper surface To be taken care of.
Diese Aufgabe wird durch die in den Kennzeichen der Patentansprüche dargelegten Maßnahmen gelöst. Der wesentliche Vorteil der Erfindung besteht darin, daß der Lotverbrauch erheblich reduziert wird und das Beloten von Ober- und Unterseite der Halbleiterbeinchen gleichmäßig und gleichzeitig stattfindet. Außerdem werden auch verzogene Drahtbänder mit der Vorrichtung nach der-Erfindung einwandfrei belotet und abgestreift.This task is indicated by the features of the claims measures outlined. The main advantage of the invention is that that the solder consumption is significantly reduced and the Beloten of The top and bottom of the semiconductor legs take place evenly and simultaneously. In addition, distorted wire bands are also made with the device according to the invention flawlessly soldered and stripped.
Die ganze Oberfläche des Trägerbandes kann beispielsweise 2 bis 5 Mm verkupfert sein und eine zusätzliche Versilberung von beispielsweise 3 bis 8 ijm streifenförmig in Längsrichtung im Bereich der Montage- und Kontaktierflächen und auf den Flächen der Anschlußbeinchen aufweisen.The entire surface of the carrier tape can, for example, be 2 to 5 Mm be copper-plated and an additional silver plating of, for example, 3 to 8 ijm in strips in the longitudinal direction in the area of the mounting and contacting surfaces and on the surfaces of the leads.
Durch die zwangsläufig mit Temperaturbeanspruchung verbundenen vorhergehenden Fertigungsschritte - insbesondere durch das Umpressen - wird die Oberfläche dort, wo das Kupfer frei liegt, oxidiert. Beim Durchlaufverzinnen mittels einer Vorrichtung nach der Erfindung unter Einsatz von nichtaktiviertem Kolophonium als Flußmittel nach DIN FSW 32 gelingt es nun, nur eine streifenförmige Verzinnung zu erhalten.Due to the previous ones inevitably associated with thermal stress Manufacturing steps - especially by pressing - the surface is there, where the copper is exposed, oxidizes. During continuous tinning by means of a device according to the invention using non-activated rosin as a flux according to DIN FSW 32 it is now possible to obtain only strip-shaped tinning.
Die Erfindung wird anhand der Figuren erläutert. Es zeigen: Figur 1 einen Ausschnitt aus einer Vorrichtung zum Durchlaufverzinnen in der Vorderansicht, Figur 2 die linke Hälfte nach der Darstellung in der Figur 1 in der Draufsicht, Figur 3 die Draufsicht auf die Lotabsaugvorrichtung, die rechts unten in der Figur 1 dargestellt ist und Figur 4 einen Ausschnitt aus einem weiteren Anwendungsbeispiel, das sich bezüglich Bandführung und Lotabsaugvorrichtung von der Vorrichtung gemäß Figur 1 unterscheidet.The invention is explained with reference to the figures. They show: figure 1 shows a detail from a device for continuous tinning in the front view, Figure 2 the left half after the representation in Figure 1 in plan view, Figure 3 shows the plan view of the solder suction device, the bottom right in the figure 1 is shown and FIG. 4 shows an excerpt from a further application example, the tape guide and solder suction device of the device according to FIG Figure 1 differs.
Ein endloses, mit Bauteilen bestücktes Trägerband 1 wird von einer Andruckrolle 2 gegen eine Transportrolle 3 gedrückt, die Transportnoppen 4 aufweist. Unter den Rollen ist ein Becken 5 mit flüssigem Lot vorgesehen, dessen Obergrenze mit 6 bezeichnet ist. Beim Verlassen des Beckens wird das Band durch eine Lotabsaugvorrichtung 7 mit einstellbarem Saugschlitz und weiter über eine Andruckrolle 8 zu nicht dargestellten Reinigungsbädern geführt. Die Lotabsaugvorrichtung besteht beispielsweise aus zwei feststehenden 9, 10 und zwei beweglichen Backen 11 12, die leicht gegen das Trägerband drücken. Zwischen den Backen ist ein kapillarer Spalt 13. In der Durchtrittsöffnung 14 zwischen den feststehenden und den beweglichen Backen sind Erweiterungen zum Durchtritt für die Bauelemente auf dem Trägerband vorgesehen.An endless, equipped with components carrier tape 1 is from a Pressure roller 2 pressed against a transport roller 3 which has transport knobs 4. A basin 5 with liquid solder is provided under the rollers, the upper limit of which is denoted by 6. When leaving the pool, the tape is drawn through a solder suction device 7 with an adjustable suction slot and further via a pressure roller 8, not shown Cleaning baths led. The solder suction device consists, for example, of two fixed 9, 10 and two movable jaws 11 12 that are slightly against the carrier tape to press. There is a capillary gap 13 between the jaws. In the passage opening 14 between the fixed and movable jaws are extensions to the Passage provided for the components on the carrier tape.
In der Figur 2 ist noch ein in zwei Schienen 15, 16 geführter Lagerbock 17 dargestellt, der ein Wegschwenken der Andruckrollen zum Einlegen des Bandes ermöglicht.In the figure 2 is still a bearing block guided in two rails 15, 16 17, which enables the pinch rollers to be pivoted away for inserting the tape.
Eine Feder 18 zieht die Andruckrollen gegen die Transportrolle 3 bzw. gegen das eingelegte Band. Die gesamte Einrichtung mit der Lotabsaugvorrichtung ist soweit absenkbar, daß der Abstreifer teilweise mit ins Lot eintaucht.A spring 18 pulls the pressure rollers against the transport roller 3 or against the inserted tape. The entire facility with the solder suction device can be lowered to such an extent that the scraper partially plunges into the perpendicular.
Figur 4 stellt ein weiteres Ausführungsbeispiel dar: Hier wird das Trägerband 1 von einer Andruckwelle 19 mit Transportnoppen schlaufenförmig in das Lötbad geführt und von einer zweiten Noppenwelle 20 wieder herausgezogen.Figure 4 shows a further embodiment: Here is the Carrier tape 1 from a pressure shaft 19 with transport knobs in loops into the Solder bath out and pulled out again by a second knob shaft 20.
Die Lotabsaugvorrichtung 21 kann - wie hier gezeigt -auch aus einer dachförmigen, nicht gekrümmten Ausführung bestehen.As shown here, the solder suction device 21 can also consist of a Roof-shaped, not curved execution exist.
4 Patentansprüche 4 Figuren4 claims 4 figures
Claims (4)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833338347 DE3338347A1 (en) | 1983-10-21 | 1983-10-21 | Hot tinning of connecting leads of electronic components forming part of a carrier strip |
| DE19843425717 DE3425717A1 (en) | 1983-10-21 | 1984-07-12 | Hot-dip tinning of connecting pins of electronic components which are placed in the assembly of a substrate strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833338347 DE3338347A1 (en) | 1983-10-21 | 1983-10-21 | Hot tinning of connecting leads of electronic components forming part of a carrier strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3338347A1 true DE3338347A1 (en) | 1985-05-02 |
Family
ID=6212460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19833338347 Withdrawn DE3338347A1 (en) | 1983-10-21 | 1983-10-21 | Hot tinning of connecting leads of electronic components forming part of a carrier strip |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3338347A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3424038A1 (en) * | 1984-06-29 | 1986-01-09 | Siemens AG, 1000 Berlin und 8000 München | Process or apparatus for the continuous soldering of metal bands or backing bands |
| DE3425717A1 (en) * | 1983-10-21 | 1986-01-23 | Siemens AG, 1000 Berlin und 8000 München | Hot-dip tinning of connecting pins of electronic components which are placed in the assembly of a substrate strip |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2803216A (en) * | 1956-05-02 | 1957-08-20 | Itt | Apparatus for printed-circuit solder coating |
| DE1614664A1 (en) * | 1967-11-30 | 1970-10-29 | Siemens Ag | Method for contacting electrical components in series construction |
| US3667425A (en) * | 1971-03-01 | 1972-06-06 | Inland Steel Co | Apparatus for controlling coating thickness |
| DE2235455A1 (en) * | 1971-07-28 | 1973-05-03 | Halbleiterwerk Frankfurt Oder | CARRIER STRIPS FOR SEMI-CONDUCTOR COMPONENTS |
| DE3040676A1 (en) * | 1980-10-29 | 1982-05-27 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Semiconductor devices made using metal lead frame strip - where leads are coated with tin prior to assembling semiconductor chips into strip |
| DE3047671C2 (en) * | 1980-12-18 | 1982-12-16 | Friedrich Heck KG, 5870 Hemer | Process for the continuous molten coating of metal parts with a solderable layer of tin or tin-lead alloy and apparatus for carrying out such a process |
| DD158290A1 (en) * | 1981-04-13 | 1983-01-05 | Guenter Heymann | SUPPLY MATERIAL FOR ELECTRICAL COMPONENTS |
| DE3147729A1 (en) * | 1981-12-02 | 1983-06-09 | Siemens AG, 1000 Berlin und 8000 München | INTERMEDIATE CARRIER TAPE WITH WIRING ELEMENTS FOR FITTING WITH CHIP COMPONENTS |
| EP0084161A2 (en) * | 1981-12-23 | 1983-07-27 | Kabushiki Kaisha Toshiba | Lead frames for electronic and electric devices |
-
1983
- 1983-10-21 DE DE19833338347 patent/DE3338347A1/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2803216A (en) * | 1956-05-02 | 1957-08-20 | Itt | Apparatus for printed-circuit solder coating |
| DE1614664A1 (en) * | 1967-11-30 | 1970-10-29 | Siemens Ag | Method for contacting electrical components in series construction |
| US3667425A (en) * | 1971-03-01 | 1972-06-06 | Inland Steel Co | Apparatus for controlling coating thickness |
| DE2235455A1 (en) * | 1971-07-28 | 1973-05-03 | Halbleiterwerk Frankfurt Oder | CARRIER STRIPS FOR SEMI-CONDUCTOR COMPONENTS |
| DE3040676A1 (en) * | 1980-10-29 | 1982-05-27 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Semiconductor devices made using metal lead frame strip - where leads are coated with tin prior to assembling semiconductor chips into strip |
| DE3047671C2 (en) * | 1980-12-18 | 1982-12-16 | Friedrich Heck KG, 5870 Hemer | Process for the continuous molten coating of metal parts with a solderable layer of tin or tin-lead alloy and apparatus for carrying out such a process |
| DD158290A1 (en) * | 1981-04-13 | 1983-01-05 | Guenter Heymann | SUPPLY MATERIAL FOR ELECTRICAL COMPONENTS |
| DE3147729A1 (en) * | 1981-12-02 | 1983-06-09 | Siemens AG, 1000 Berlin und 8000 München | INTERMEDIATE CARRIER TAPE WITH WIRING ELEMENTS FOR FITTING WITH CHIP COMPONENTS |
| EP0084161A2 (en) * | 1981-12-23 | 1983-07-27 | Kabushiki Kaisha Toshiba | Lead frames for electronic and electric devices |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3425717A1 (en) * | 1983-10-21 | 1986-01-23 | Siemens AG, 1000 Berlin und 8000 München | Hot-dip tinning of connecting pins of electronic components which are placed in the assembly of a substrate strip |
| DE3424038A1 (en) * | 1984-06-29 | 1986-01-09 | Siemens AG, 1000 Berlin und 8000 München | Process or apparatus for the continuous soldering of metal bands or backing bands |
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