DD158290A1 - SUPPLY MATERIAL FOR ELECTRICAL COMPONENTS - Google Patents

Abstract

The invention relates to a Traegerwerkstoff for electrical, electronic components, contacts and connecting elements made of an aluminum alloy. The aim and object of the invention is to find a Traegerwerkstoff for electrical and electronic components, contacts and connection elements, the precious metal free electrically and mechanically stable connections gewaehrleistet. It has been found that aluminum alloys of AlZnMg, AlCuSi, AlMg and, in particular, the alloy AlCu4Si1 are suitable for solving this problem. This Traegerwerkstoff comes here uncoated, ganzflaechig or selectively or ganzflaechig and selectively coated with one or more metals used.

Description

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Title of the invention "

 "• 'Carrier material for electrical components

λ Field of the invention

The invention relates to a carrier material made of aluminum, which can be used in particular in electronics and electrical engineering.

The field of application relates to substrate carriers for electronic components, detachable electrical contacts and electrical connection elements of electronic assemblies or assemblies.

Characteristic of the Known Technical Solutions The previous embodiments of carrier strips relate predominantly to the use of copper, copper alloys, iron alloys (DE - OS 2933440) as well as pure contact metals such as silver, gold, palladium, platinum, iridium, J wraps etc s also their use as surface layers on base materials (DE-OS 2738218, US-P 3931922). All these statements, based on the materials mentioned, is common, than that a high use of precious metals takes place or deficit metals must be used. This fact was a major reason for the fact that carrier materials are being used internationally on edelraetaHärmen · The main routes are selective surface coatings of, for example, iron alloys using gold, silver, platinum, rhodium, nickel, etc.

and the use of composite materials (DE-AS 263 1904) · Recently, attempts are also copper or. To coat ice alloys with pure aluminum or aluminum alloys and to use as precious metal-free composite material (DD-PS I3O6O7). However, all these efforts represent only partial solutions and are subject to fundamental disadvantages. So all solutions mentioned are burdened with a considerable manufacturing technology effort and thus high costs. • ... ,, Other disadvantages are the different coefficients of thermal expansion of the layers in composite arrangements, the relatively low thermal conductivity such as the insufficient corrosion resistance of such substrates. Further efforts to reduce the precious metal content by reducing the dimensions fail because of constructive technological and functional requirements of the electronic / electrical engineering components, assemblies and assemblies and their wiring structure. The use of cold-pressed welded composite materials has the disadvantage that the differences in the coefficient of thermal expansion of the base metal base body to precious metal support lead to failure of the functional and connection systems and the reliability (technical) is greatly reduced «(DD-PS 127784). Furthermore, the interfaces of such composite materials due to the electrochemical potential differences are particularly susceptible to corrosion and thus flawed. The use of low-alloy alloys requires the provision of precious metals and therefore does not correspond to the desired interference clearance from the precious metals market.

Object of the invention

Object of the invention i is a support material for electronic components, electrical contacts and electrical connection elements, which consists of aluminum and is adapted in the mechanical properties of the application-specific connection technology and ensures an electrically and mechanically stable connection.

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The use of a precious metal-free and deficient metallurgy carrier ^{base material aU3} aluminum pursues the goal of creating a precious metal-free alternative, especially within the electrical / electronics industry and increasing the economy in the manufacture of electronic components, electrical contacts and connections ·

. ,,:>. Explanation of the essence of the invention

The object of the invention is to provide a carrier material for electrical components, electrical contacts and electrically * .Anschlusselemente, which consists of a correspondingly modifiable aluminum material, coated, uncoated, over the entire surface, selectively or over the entire surface and selectively with one or more metals is used, and an edeliaetallfreie and deficit metal poor conception of the above electrical / electronic assemblies and assemblies offers.

According to the invention, the object is achieved in that the carrier material of an Al alloy such as Al Zn Mg, Al Cu £ Al Mg, in particular Al Cu 4 Si 1 consists.

With these alloys, even applications in the mechanical connection technology are detected, e.g. for the winding connection technique f.Wickelgeeignete Anschlusseiemente - :, 'tensile strength values of R_ = s 480 MPa are necessary.

For such an extreme case of application, in particular the alloy AlCu4Si1 is suitable of the named alloy systems. With the help of the above carrier materials, noble metal and deficit metal-intensive carrier materials (wi <

^ _0, for example, Cu, SuSn6, CuBe2, Fe alloys (eg PeNiCo) with the precious metal layers (eg. B.Ag, "-Au, Pd, Pt, etc.) completely od <partially saved. Lift the economic changes with the inventive Carrier material also offers the proposed solution, while retaining the advantages of chip mounting in the prior art, the wire assembly both hin-

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visibly the metallization and the bonding wire free of noble metals.

The solution according to the invention offers comparable properties with respect to the known solutions with regard to:

realization of the geometry or structure of the carrier strip (stampable, etchable)

- the galvanic or melt metallurgical coating

- the availability of the internal and external assembly such as .. ,, · Schwallötbarkeit of the carrier strip, chip mounting (for example, _# gluing, Solder n) and wire assembly (eg US-bonding, thermosonic bonding)

- Hermetization according to the usual capping technologies

embodiment

Substitution of the conventional carrier material in conventional device technologies is possible as follows:

- The starting material used is AlCu4Si1 semi-finished hot-rolled,

The structuring of the carrier strip geometry is carried out by punching to the final geometry or by etching (chemical graphing)

- The required Schwallötbarkeit is achieved by a corresponding coating technology (3Jiekel and partial tin) of the carrier base material.

- The chip assembly on the carrier strip is either by gluing (silver-containing two-component adhesive) or by soldering with conventional or automatic Bonder

- The wire bonding is done either with conventional precious metalizations and Thermosonic bonding or US bonding.

In the latter case it is possible to bond non-precious metal (Al wire, Al layer)

- The hermetization of the components is carried out using conventional technologies (plastic, glass, ceramic capping) «

A component type produced by the above technology ensures compared to CuSn6i carrier roaming en comparable values of reliability, such as _e as voltage drop over the chip and wire contact, changing the Kontakteigenschäften a change in temperature (change of temperature test 223 K to 358 K, time storage test 398 K, 1000 h, low temperature 218 K, 1000 h).

The components produced in this way were soundproof and suitable for winding connection, the volume resistance of the soldered connections or the winding connections after climatic and pollutant loads (compared to the customary CuSn6 carrier strips showing no significant differences

Claims (4)

invention claims 1. carrier material for electrical components, electrical contacts and electrical connection elements, characterized in that cer support made of a high strength aluminum material, with a strength R = 380 MPa and an elongation at break A _{1 10Q} = 1%, in particular the alloy AlCu4Si1, the solderable and weldable for the production of electrically and mechanically stable, precious metal and deficit-metal-poor contact systems and, due to its strength properties, also as contact carriers for mechanical and , Final techniques is suitable · 2. carrier material according to item 1, characterized in that in addition to the aluminum material AlCu4Si1 the carrier material for special connection technologies and application characteristics of aluminum alloys with application-related pest values, such as, aluminum alloys with the alloy components Si, Ci, Pe, Mg, Zn, Ni ₁ -Co , Ce, Ta, Zr, Li. 3 · carrier material according to item 1 and 2, characterized in that the carrier base material is coated uncoated or over the entire surface and / or selectively with one or more metals. 4. carrier material according to item 1 to 3, characterized in that the claims 2 to 3 independent of-the support structure and contact configuration realized v / ground.