JPS6480098A - Manufacture of solderable flexible printed circuit iron substrate - Google Patents
Manufacture of solderable flexible printed circuit iron substrateInfo
- Publication number
- JPS6480098A JPS6480098A JP23607587A JP23607587A JPS6480098A JP S6480098 A JPS6480098 A JP S6480098A JP 23607587 A JP23607587 A JP 23607587A JP 23607587 A JP23607587 A JP 23607587A JP S6480098 A JPS6480098 A JP S6480098A
- Authority
- JP
- Japan
- Prior art keywords
- iron foil
- film
- foil
- printed circuit
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title abstract 9
- 239000000758 substrate Substances 0.000 title abstract 3
- 229910052742 iron Inorganic materials 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005530 etching Methods 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 229920000728 polyester Polymers 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000012298 atmosphere Substances 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 230000002265 prevention Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To obtain a printed circuit substrate which enables the application of a magnet to handling of it during operation by a method wherein a film and an iron foil are made to adhere together with an adhesive agent sandwiched in between them, a circuit pattern is printed on the iron foil, an etching resist is separated off, and a rust prevention treatment is performed onto the ion foil. CONSTITUTION:A heat resistant insulating film 1 30-500mum thick of polyimide, polyester, or the like is thermally treated at a temperature of 120-180C deg. for 0.5-3.0hours in air or the like. Adhesive of polyuretane, polyester series, or the like is made to be applied and coated onto one sides of the film 1 and an iron foil 25-150mum thick, which are tentatively dried at a temperature of 50-60C deg. for 5-15minutes in the air or the like to be in a semi- setting state. The film 1 and the iron foil 2 are made to adhere together with the adhesive layer 3 interposed between them, which are thermally pressed with a heated roll of 80-160 deg.C under a gauge pressure of 1.5-7kg/cm<2> so as to adhere together and be laminated into one piece, and then be aged in an inactive gas atmosphere at a temperature of 40-80C deg. for 90-180hours. A circuit pattern is screen-printed using an etching resist 4, which is heated to be dried. The iron foil 2 is removed through etching, and cleaning is performed. The resist 4 covering the iron foil is removed. A rust preventing treatment is performed onto the face of the iron foil 2. By these processes, a printed circuit substrate, which enables the application of a magnet to handling of it during operation, can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23607587A JPS6480098A (en) | 1987-09-22 | 1987-09-22 | Manufacture of solderable flexible printed circuit iron substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23607587A JPS6480098A (en) | 1987-09-22 | 1987-09-22 | Manufacture of solderable flexible printed circuit iron substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6480098A true JPS6480098A (en) | 1989-03-24 |
Family
ID=16995346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23607587A Pending JPS6480098A (en) | 1987-09-22 | 1987-09-22 | Manufacture of solderable flexible printed circuit iron substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6480098A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10043856B4 (en) * | 1999-09-08 | 2005-02-03 | Suzuki Motor Corp., Hamamatsu | Multi-drive unit |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131828B2 (en) * | 1978-09-28 | 1986-07-23 | Ono Sotsuki Kk |
-
1987
- 1987-09-22 JP JP23607587A patent/JPS6480098A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131828B2 (en) * | 1978-09-28 | 1986-07-23 | Ono Sotsuki Kk |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10043856B4 (en) * | 1999-09-08 | 2005-02-03 | Suzuki Motor Corp., Hamamatsu | Multi-drive unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY138957A (en) | A method and apparatus for forming a laminated sheet material by spattering | |
| KR970705186A (en) | Method and apparatus for attaching a sphere to a foil matrix | |
| EP0117055A3 (en) | A method and apparatus for laminating foil to a substrate | |
| JPS6448325A (en) | Manufacture of superconducting material layer | |
| JPS6480098A (en) | Manufacture of solderable flexible printed circuit iron substrate | |
| CA2081570A1 (en) | Method of manufacturing electronic device which comprises the step of smoothing a resin coating layer and apparatus for manufacturing the same | |
| MY118735A (en) | Process and apparatus for resin impregnating of a porous web | |
| JPH07102662B2 (en) | Method for manufacturing coverlay film for flexible printed circuit | |
| JP2004082677A (en) | Fabricating method for adhering panel | |
| JPS553904A (en) | Adhering method | |
| JPS6447055A (en) | Manufacture of semiconductor device | |
| JPS642318A (en) | Formation of thin film | |
| JPS5795053A (en) | X-ray window | |
| JPS5562474A (en) | Heating roller | |
| JPH0614635Y2 (en) | Mirror edge structure | |
| JPS51147250A (en) | Treatment method of semiconductor substrate | |
| JPS5759322A (en) | Manufacture of semiconductor device | |
| JPS57112038A (en) | Semiconductor device | |
| JPS62151269A (en) | Soldering device | |
| JPS54113253A (en) | Bonding method of semiconductor pellet | |
| JPS5471980A (en) | Adhesion method of semiconductor wafer to lapping surface plate | |
| JPS5527277A (en) | Fabrication method of synthetic resin sheet laminated decorating plate | |
| IT1175684B (en) | Device for modifying air layer about heat transfer roll | |
| JPS54162472A (en) | Plasma processing method | |
| JPS5717136A (en) | Formation of passivation film |