JPS64788A - Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the same - Google Patents
Surface conductive ceramic substrate and manufacture of the same and metallizing compound for the sameInfo
- Publication number
- JPS64788A JPS64788A JP4385888A JP4385888A JPS64788A JP S64788 A JPS64788 A JP S64788A JP 4385888 A JP4385888 A JP 4385888A JP 4385888 A JP4385888 A JP 4385888A JP S64788 A JPS64788 A JP S64788A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- same
- adhesion strength
- compound
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63-43858A JPH01788A (ja) | 1987-03-31 | 1988-02-26 | 表面導電性セラミックス基板とその製造方法およびそれに用いるメタライズ用組成物 |
US07/174,902 US4883704A (en) | 1987-03-30 | 1988-03-29 | Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it |
EP93111133A EP0574956B1 (en) | 1987-03-30 | 1988-03-30 | Metallized circuit substrate comprising nitride type ceramics |
DE3855613T DE3855613T2 (de) | 1987-03-30 | 1988-03-30 | Metallisiertes substrat für Schaltungen aus Nitrid-Typ- Keramiken |
EP88105174A EP0285127B1 (en) | 1987-03-30 | 1988-03-30 | Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it |
DE3855680T DE3855680T2 (de) | 1987-03-30 | 1988-03-30 | Substrat für Schaltungen aus Nitrid-Typ-Keramiken, Verfahren zu seiner Herstellung und Metallisierung |
US07/410,863 US5063121A (en) | 1987-03-30 | 1989-09-22 | Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-76165 | 1987-03-31 | ||
JP7616587 | 1987-03-31 | ||
JP63-43858A JPH01788A (ja) | 1987-03-31 | 1988-02-26 | 表面導電性セラミックス基板とその製造方法およびそれに用いるメタライズ用組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPS64788A true JPS64788A (en) | 1989-01-05 |
JPH01788A JPH01788A (ja) | 1989-01-05 |
JPH0529315B2 JPH0529315B2 (ja) | 1993-04-30 |
Family
ID=
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5230924A (en) * | 1988-12-14 | 1993-07-27 | Li Chou H | Metallized coatings on ceramics for high-temperature uses |
US11171251B2 (en) | 2015-11-13 | 2021-11-09 | Johnson Matthey Public Limited Company | Process for forming conductive track or coating |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61291480A (ja) * | 1985-06-17 | 1986-12-22 | 日本特殊陶業株式会社 | 窒化アルミニウム製基材の表面処理組成物 |
JPS62197379A (ja) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | 窒化アルミニウム基板 |
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61291480A (ja) * | 1985-06-17 | 1986-12-22 | 日本特殊陶業株式会社 | 窒化アルミニウム製基材の表面処理組成物 |
JPS62197379A (ja) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | 窒化アルミニウム基板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5230924A (en) * | 1988-12-14 | 1993-07-27 | Li Chou H | Metallized coatings on ceramics for high-temperature uses |
US11171251B2 (en) | 2015-11-13 | 2021-11-09 | Johnson Matthey Public Limited Company | Process for forming conductive track or coating |
Also Published As
Publication number | Publication date |
---|---|
JPH0529315B2 (ja) | 1993-04-30 |
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