JPS6476747A - Semiconductor mounting board - Google Patents

Semiconductor mounting board

Info

Publication number
JPS6476747A
JPS6476747A JP23464387A JP23464387A JPS6476747A JP S6476747 A JPS6476747 A JP S6476747A JP 23464387 A JP23464387 A JP 23464387A JP 23464387 A JP23464387 A JP 23464387A JP S6476747 A JPS6476747 A JP S6476747A
Authority
JP
Japan
Prior art keywords
lead frame
conductor
circuit
circuit board
conductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23464387A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445986B2 (enrdf_load_stackoverflow
Inventor
Sadahisa Furuhashi
Motoji Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP23464387A priority Critical patent/JPS6476747A/ja
Publication of JPS6476747A publication Critical patent/JPS6476747A/ja
Publication of JPH0445986B2 publication Critical patent/JPH0445986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP23464387A 1987-09-17 1987-09-17 Semiconductor mounting board Granted JPS6476747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23464387A JPS6476747A (en) 1987-09-17 1987-09-17 Semiconductor mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23464387A JPS6476747A (en) 1987-09-17 1987-09-17 Semiconductor mounting board

Publications (2)

Publication Number Publication Date
JPS6476747A true JPS6476747A (en) 1989-03-22
JPH0445986B2 JPH0445986B2 (enrdf_load_stackoverflow) 1992-07-28

Family

ID=16974239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23464387A Granted JPS6476747A (en) 1987-09-17 1987-09-17 Semiconductor mounting board

Country Status (1)

Country Link
JP (1) JPS6476747A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5022960A (en) * 1989-05-01 1991-06-11 Ibiden Co., Ltd. Method of manufacturing circuit board for mounting electronic components
US5371029A (en) * 1991-01-22 1994-12-06 National Semiconductor Corporation Process for making a leadless chip resistor capacitor carrier using thick and thin film printing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5022960A (en) * 1989-05-01 1991-06-11 Ibiden Co., Ltd. Method of manufacturing circuit board for mounting electronic components
US5088008A (en) * 1989-05-01 1992-02-11 Ibiden Co., Ltd. Circuit board for mounting electronic components
US5371029A (en) * 1991-01-22 1994-12-06 National Semiconductor Corporation Process for making a leadless chip resistor capacitor carrier using thick and thin film printing

Also Published As

Publication number Publication date
JPH0445986B2 (enrdf_load_stackoverflow) 1992-07-28

Similar Documents

Publication Publication Date Title
JPS6437032A (en) Bendable lead frame assembly of integrated circuit and integrated circuit package
CA1222331A (en) Integrated circuit package
CA2115553A1 (en) Plated compliant lead
CA2218307A1 (en) Three dimensional packaging configuration for multi-chip module assembly
MY128551A (en) Printed wiring board and manufacturing method thereof
KR970706604A (ko) 반도체 장치 및 그의 실장 구조체(Semiconductor Device and lit Mounting Structure)
GB1501500A (en) Multilayer printed circuit boards
EP0301863A3 (en) Socket and connection system
KR880001053A (ko) 집적 회로용 팔라듐 도금 리이드 프레임 및 그 제조 방법
EP0489177A4 (en) Semiconductor device and method of manufacturing the same
US4866841A (en) Integrated circuit chip carrier
US5016082A (en) Integrated circuit interconnect design
CA2056781A1 (en) Multichip module
US4933810A (en) Integrated circuit interconnector
JPH0453195A (ja) 電子回路モジュール
KR900019545A (ko) 표면장착용 배선기판의 제조방법
EP0412323A2 (en) A film carrier for use in integrated circuit mounting
JPS6476747A (en) Semiconductor mounting board
US6934160B2 (en) Printed circuit board arrangement
JPH10214928A (ja) プリント配線板
US4860443A (en) Method for connecting leadless chip package
JPH0513611A (ja) リードレスチツプキヤリア型ハイブリツドｉｃ
JPS6448423A (en) Dividing method of semiconductor chip
JPH05218228A (ja) 電子部品搭載用基板
JPS5797660A (en) High density structure

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080728

Year of fee payment: 16

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080728

Year of fee payment: 16