JPS647644A - Assembly of heat sink for electronic equipment - Google Patents

Assembly of heat sink for electronic equipment

Info

Publication number
JPS647644A
JPS647644A JP16354187A JP16354187A JPS647644A JP S647644 A JPS647644 A JP S647644A JP 16354187 A JP16354187 A JP 16354187A JP 16354187 A JP16354187 A JP 16354187A JP S647644 A JPS647644 A JP S647644A
Authority
JP
Japan
Prior art keywords
cooling piece
thermal conductive
conductive fillers
mounting plate
soft adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16354187A
Other languages
Japanese (ja)
Other versions
JPH088328B2 (en
Inventor
Hisashi Kawashima
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16354187A priority Critical patent/JPH088328B2/en
Publication of JPS647644A publication Critical patent/JPS647644A/en
Publication of JPH088328B2 publication Critical patent/JPH088328B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve vibration resistance, and to simplify structure by applying thermal conductive fillers onto an integrated circuit element loaded onto a substrate, fast sticking a cooling piece to the thermal conductive fillers and interposing soft adhesives between the cooling piece and a mounting plate for the cooling piece. CONSTITUTION:Thermal conductive fillers 3 are applied onto an integrated circuit element 2 loaded onto a substrate 1, a cooling piece 4 is fast stuck to the thermal conductive fillers 3, and soft adhesives 6 are interposed between the cooling piece 4 and a mounting plate 5 for the cooling piece 4. A thermal compound, grease, a liquid metal, etc., are used as said thermal conductive fillers 3, and a waterproof sealant, a two-part type metallic compound, solder, etc., are employed as the soft adhesives 6. A refrigerant 9 is flowed in said cooling piece 4, and the top section 10 penetrated into an opening section 51 in the mounting plate 5 and extended to an upper section in the cooling piece 4 is fixed to the mounting plate 5 by curing the soft adhesives 6 interposed between the top section 10 and a flange 7 into which an O ring 8 is interior- finished.
JP16354187A 1987-06-30 1987-06-30 Heat sink assembly for electronic equipment Expired - Lifetime JPH088328B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16354187A JPH088328B2 (en) 1987-06-30 1987-06-30 Heat sink assembly for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16354187A JPH088328B2 (en) 1987-06-30 1987-06-30 Heat sink assembly for electronic equipment

Publications (2)

Publication Number Publication Date
JPS647644A true JPS647644A (en) 1989-01-11
JPH088328B2 JPH088328B2 (en) 1996-01-29

Family

ID=15775845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16354187A Expired - Lifetime JPH088328B2 (en) 1987-06-30 1987-06-30 Heat sink assembly for electronic equipment

Country Status (1)

Country Link
JP (1) JPH088328B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0597425A2 (en) * 1992-11-09 1994-05-18 Nec Corporation Structure for cooling an integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0597425A2 (en) * 1992-11-09 1994-05-18 Nec Corporation Structure for cooling an integrated circuit
EP0597425A3 (en) * 1992-11-09 1995-03-22 Nippon Electric Co Structure for cooling an integrated circuit.

Also Published As

Publication number Publication date
JPH088328B2 (en) 1996-01-29

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