JPS647592A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS647592A
JPS647592A JP16264987A JP16264987A JPS647592A JP S647592 A JPS647592 A JP S647592A JP 16264987 A JP16264987 A JP 16264987A JP 16264987 A JP16264987 A JP 16264987A JP S647592 A JPS647592 A JP S647592A
Authority
JP
Japan
Prior art keywords
copper
copper paste
fine powder
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16264987A
Other languages
English (en)
Inventor
Shigeki Matsuhisa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP16264987A priority Critical patent/JPS647592A/ja
Publication of JPS647592A publication Critical patent/JPS647592A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16264987A 1987-06-29 1987-06-29 Manufacture of printed wiring board Pending JPS647592A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16264987A JPS647592A (en) 1987-06-29 1987-06-29 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16264987A JPS647592A (en) 1987-06-29 1987-06-29 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS647592A true JPS647592A (en) 1989-01-11

Family

ID=15758635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16264987A Pending JPS647592A (en) 1987-06-29 1987-06-29 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS647592A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03141683A (ja) * 1989-10-27 1991-06-17 Furukawa Electric Co Ltd:The プリント配線板
EP1542518A1 (en) * 2002-06-04 2005-06-15 Sumitomo Electric Industries, Ltd. Board for printed wiring, printed wiring board, and method for manufacturing them
JP2011124534A (ja) * 2008-12-02 2011-06-23 Dainippon Printing Co Ltd 電磁波シールド材の製造方法
JP2017169791A (ja) * 2016-03-23 2017-09-28 旭化成株式会社 電位測定デバイス
JP2021003591A (ja) * 2020-09-30 2021-01-14 旭化成株式会社 電位測定デバイス

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03141683A (ja) * 1989-10-27 1991-06-17 Furukawa Electric Co Ltd:The プリント配線板
EP1542518A1 (en) * 2002-06-04 2005-06-15 Sumitomo Electric Industries, Ltd. Board for printed wiring, printed wiring board, and method for manufacturing them
EP1542518A4 (en) * 2002-06-04 2009-08-26 Sumitomo Electric Industries CIRCUIT BOARD FOR PRINTED WIRING, PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
US8231766B2 (en) 2002-06-04 2012-07-31 Sumitomo Electric Industries, Ltd. Method for producing printed wiring board
JP2011124534A (ja) * 2008-12-02 2011-06-23 Dainippon Printing Co Ltd 電磁波シールド材の製造方法
US8395059B2 (en) 2008-12-02 2013-03-12 Dai Nippon Printing Co., Ltd. Electromagnetic wave shielding material, and method for manufacturing same
JP2017169791A (ja) * 2016-03-23 2017-09-28 旭化成株式会社 電位測定デバイス
JP2021003591A (ja) * 2020-09-30 2021-01-14 旭化成株式会社 電位測定デバイス

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