JPS647504B2 - - Google Patents
Info
- Publication number
- JPS647504B2 JPS647504B2 JP8159982A JP8159982A JPS647504B2 JP S647504 B2 JPS647504 B2 JP S647504B2 JP 8159982 A JP8159982 A JP 8159982A JP 8159982 A JP8159982 A JP 8159982A JP S647504 B2 JPS647504 B2 JP S647504B2
- Authority
- JP
- Japan
- Prior art keywords
- slide
- carrier
- slide device
- stopper
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 claims description 18
- 238000001125 extrusion Methods 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000032258 transport Effects 0.000 claims 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 230000004907 flux Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8159982A JPS58199590A (ja) | 1982-05-17 | 1982-05-17 | はんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8159982A JPS58199590A (ja) | 1982-05-17 | 1982-05-17 | はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58199590A JPS58199590A (ja) | 1983-11-19 |
| JPS647504B2 true JPS647504B2 (enrdf_load_stackoverflow) | 1989-02-09 |
Family
ID=13750777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8159982A Granted JPS58199590A (ja) | 1982-05-17 | 1982-05-17 | はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58199590A (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57128051A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Soldering method and apparatus for semiconductor product |
-
1982
- 1982-05-17 JP JP8159982A patent/JPS58199590A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58199590A (ja) | 1983-11-19 |
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