JPS647502B2 - - Google Patents
Info
- Publication number
- JPS647502B2 JPS647502B2 JP16165383A JP16165383A JPS647502B2 JP S647502 B2 JPS647502 B2 JP S647502B2 JP 16165383 A JP16165383 A JP 16165383A JP 16165383 A JP16165383 A JP 16165383A JP S647502 B2 JPS647502 B2 JP S647502B2
- Authority
- JP
- Japan
- Prior art keywords
- width
- weld ring
- side extending
- wider
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165383A JPS6053056A (ja) | 1983-09-02 | 1983-09-02 | 半導体装置用セラミックパッケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165383A JPS6053056A (ja) | 1983-09-02 | 1983-09-02 | 半導体装置用セラミックパッケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6053056A JPS6053056A (ja) | 1985-03-26 |
| JPS647502B2 true JPS647502B2 (enrdf_load_stackoverflow) | 1989-02-09 |
Family
ID=15739271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16165383A Granted JPS6053056A (ja) | 1983-09-02 | 1983-09-02 | 半導体装置用セラミックパッケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053056A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7297213B2 (en) | 2000-05-24 | 2007-11-20 | Neomax Co., Ltd. | Permanent magnet including multiple ferromagnetic phases and method for producing the magnet |
| WO2020246159A1 (ja) * | 2019-06-04 | 2020-12-10 | 株式会社村田製作所 | 乱数発生装置 |
-
1983
- 1983-09-02 JP JP16165383A patent/JPS6053056A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7297213B2 (en) | 2000-05-24 | 2007-11-20 | Neomax Co., Ltd. | Permanent magnet including multiple ferromagnetic phases and method for producing the magnet |
| WO2020246159A1 (ja) * | 2019-06-04 | 2020-12-10 | 株式会社村田製作所 | 乱数発生装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6053056A (ja) | 1985-03-26 |