JPS6474776A - Manufacture of superconducting wiring substrate - Google Patents

Manufacture of superconducting wiring substrate

Info

Publication number
JPS6474776A
JPS6474776A JP62230923A JP23092387A JPS6474776A JP S6474776 A JPS6474776 A JP S6474776A JP 62230923 A JP62230923 A JP 62230923A JP 23092387 A JP23092387 A JP 23092387A JP S6474776 A JPS6474776 A JP S6474776A
Authority
JP
Japan
Prior art keywords
substrate
film
onto
superconductive
al2o3
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62230923A
Other languages
Japanese (ja)
Inventor
Takahito Machi
Kazunori Yamanaka
Hirozo Yokoyama
Nobuo Kamehara
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62230923A priority Critical patent/JPS6474776A/en
Publication of JPS6474776A publication Critical patent/JPS6474776A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49888Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0884Treatment of superconductor layers by irradiation, e.g. ion-beam, electron-beam, laser beam or X-rays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

PURPOSE:To form a fine pattern by forming an A-B-Cu-O superconductive film (A represents Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu or Sc and B Ba, Sr or Ca) onto an insulating substrate, implanting A to sections except a section to be left as a wiring in a superconductive film and insulating the sections. CONSTITUTION:An Al2O3 substrate 1 having high purity is used as an insulator substrate, and Y and Ba and Cu are mixed sufficiently to the type of a nitrate solution. A composition ratio at that time is brought to Y:Ba:Cu=1:2:3. The nitrate solution is scattered onto the Al2O3 substrate 1, and thermally treated at 950 deg.C, thus acquiring a superconductive thin-film 2. Masks 3 are shaped onto the thin-film 2, and the ion beams of Y are applied and Y is doped until Y is brought to treble or more to Ba. A defect due to Y incidence is removed through annealing at 500 deg.C. Accordingly, a superconducting wiring 5 insulated by insulators 4 having excess Y can be formed onto the Al2O3 substrate 1.
JP62230923A 1987-09-17 1987-09-17 Manufacture of superconducting wiring substrate Pending JPS6474776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62230923A JPS6474776A (en) 1987-09-17 1987-09-17 Manufacture of superconducting wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62230923A JPS6474776A (en) 1987-09-17 1987-09-17 Manufacture of superconducting wiring substrate

Publications (1)

Publication Number Publication Date
JPS6474776A true JPS6474776A (en) 1989-03-20

Family

ID=16915398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62230923A Pending JPS6474776A (en) 1987-09-17 1987-09-17 Manufacture of superconducting wiring substrate

Country Status (1)

Country Link
JP (1) JPS6474776A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814978A (en) * 1986-07-15 1989-03-21 Dataflow Computer Corporation Dataflow processing element, multiprocessor, and processes
US5127104A (en) * 1986-12-29 1992-06-30 Dataflow Computer Corporation Method and product involving translation and execution of programs by automatic partitioning and data structure allocation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814978A (en) * 1986-07-15 1989-03-21 Dataflow Computer Corporation Dataflow processing element, multiprocessor, and processes
US5127104A (en) * 1986-12-29 1992-06-30 Dataflow Computer Corporation Method and product involving translation and execution of programs by automatic partitioning and data structure allocation

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