JPS6473633A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6473633A
JPS6473633A JP62231618A JP23161887A JPS6473633A JP S6473633 A JPS6473633 A JP S6473633A JP 62231618 A JP62231618 A JP 62231618A JP 23161887 A JP23161887 A JP 23161887A JP S6473633 A JPS6473633 A JP S6473633A
Authority
JP
Japan
Prior art keywords
region
chip
heat
pads
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62231618A
Other languages
Japanese (ja)
Inventor
Fumihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62231618A priority Critical patent/JPS6473633A/en
Publication of JPS6473633A publication Critical patent/JPS6473633A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/7531—Shape of other parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To set the arbitrary quantity of heat and to eliminate the necessity of applying heat externally by forming a resistance heater for heating a chip to a predetermined temperature on the main surface of the chip. CONSTITUTION:A self-heating resistance region 2, a region 3 for performing the original function of a semiconductor integrated circuit, many bonding pads 4 of the integrated circuit, and a pair of pads 5, 6 for applying a voltage to the region 2 are provided on a chip 1 of the integrated circuit. The region 2 is formed on the main surface of the chip, and operated as a resistance heater. The region 2 is disposed on a region not used for the region 3 of the normally original function, i.e., a region outside the pad. The quantity W of heat of the region 2 becomes W=V<2>/R when it is represented by a voltage V applied between the pads 5 and 6, and a resistance value R between the pads 5 and 6. Accordingly, when the voltage of 10V is applied and the resistance is 10 ohms, the quantity of heat of 10W is obtained. When the quantity of heat of this degree is obtained, the chip 1 can be sufficiently held at high temperature.
JP62231618A 1987-09-14 1987-09-14 Semiconductor device Pending JPS6473633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231618A JPS6473633A (en) 1987-09-14 1987-09-14 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231618A JPS6473633A (en) 1987-09-14 1987-09-14 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6473633A true JPS6473633A (en) 1989-03-17

Family

ID=16926330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231618A Pending JPS6473633A (en) 1987-09-14 1987-09-14 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6473633A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method

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