JPS6468483A - Method for administrating etching liquid - Google Patents
Method for administrating etching liquidInfo
- Publication number
- JPS6468483A JPS6468483A JP22485087A JP22485087A JPS6468483A JP S6468483 A JPS6468483 A JP S6468483A JP 22485087 A JP22485087 A JP 22485087A JP 22485087 A JP22485087 A JP 22485087A JP S6468483 A JPS6468483 A JP S6468483A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- etching
- cpus
- spectrophotometer
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To automatically maintain the titled liquid always constantly with good reproducibility by extracting said liquid from a treatment tank to the cell part of a spectrophotometer, measuring the absorbancy of the liquid and simultaneously executing the feed and discharge of the liquid to and from the tank. CONSTITUTION:The etching liquid (E) is fed from the treatment tank of a spray etching device 1 to the cell part 15 of the spectrophotometer 4 by a tube 2 and a roller pump 3 and light is projected from a light source 11 on the cell 15. The transparency thereof is then detected by a photodetecting part 10. This reception signal is applied to a detector 12 and is subjected to data rearrangement by CPUs 5, 13 provided on the outside and inside of the photometer 4, by which the degree of fatigue of the liquid is automatically processed and the administration point of the liquid E is elucidated. The electric signals from the CPUs are so converted by an A/D converter 6 that the discarding of the liquid E from the device 1 and the supply of the liquid E to the device 1 are properly executed by means of a motor pump. The etching capacity of the liquid E is maintained always constant, by which the conveying speed of a substrate material 9 which is a work is maintained constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22485087A JPS6468483A (en) | 1987-09-08 | 1987-09-08 | Method for administrating etching liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22485087A JPS6468483A (en) | 1987-09-08 | 1987-09-08 | Method for administrating etching liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6468483A true JPS6468483A (en) | 1989-03-14 |
Family
ID=16820144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22485087A Pending JPS6468483A (en) | 1987-09-08 | 1987-09-08 | Method for administrating etching liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6468483A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010071078A1 (en) * | 2008-12-17 | 2010-06-24 | 三菱製紙株式会社 | Etching solution for copper or copper alloy, etching method, and method for managing reproduction of etching solution |
-
1987
- 1987-09-08 JP JP22485087A patent/JPS6468483A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010071078A1 (en) * | 2008-12-17 | 2010-06-24 | 三菱製紙株式会社 | Etching solution for copper or copper alloy, etching method, and method for managing reproduction of etching solution |
| JPWO2010071078A1 (en) * | 2008-12-17 | 2012-05-31 | 三菱製紙株式会社 | Etching solution for copper or copper alloy, etching method, and regeneration management method of etching solution |
| JP5604307B2 (en) * | 2008-12-17 | 2014-10-08 | 三菱製紙株式会社 | Etching solution for copper or copper alloy, etching method, and regeneration management method of etching solution |
| TWI486488B (en) * | 2008-12-17 | 2015-06-01 | Mitsubishi Paper Mills Ltd | Copper or copper alloy etching solution, etching method and etching solution management method |
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