JPS6467941A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6467941A
JPS6467941A JP22504687A JP22504687A JPS6467941A JP S6467941 A JPS6467941 A JP S6467941A JP 22504687 A JP22504687 A JP 22504687A JP 22504687 A JP22504687 A JP 22504687A JP S6467941 A JPS6467941 A JP S6467941A
Authority
JP
Japan
Prior art keywords
wirings
aluminum wirings
integrated circuit
semiconductor integrated
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22504687A
Other languages
Japanese (ja)
Inventor
Shinya Kawarabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22504687A priority Critical patent/JPS6467941A/en
Publication of JPS6467941A publication Critical patent/JPS6467941A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To reduce the insulating volume of aluminum wirings, and to reduce the occurrence of hillocks and the capacity between the wirings by forming the wiring so that its sectional shape is a trapezoidal shape. CONSTITUTION:The sectional shape of aluminum wirings 2 is the same as a conventional one in its bottom side, but since it is narrower in width toward a perpendicular direction to the surface of a silicon wafer 1 in a so-called trapezoidal shape, its sectional area is smaller than conventional aluminum wirings, and its insulating volume becomes small. As a result, the occurrence of hillocks is reduced. A mean distance between adjacent aluminum wirings 2 is larger than a conventional example, and a capacity formed between the adjacent wirings 2 is reduced.
JP22504687A 1987-09-08 1987-09-08 Semiconductor integrated circuit device Pending JPS6467941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22504687A JPS6467941A (en) 1987-09-08 1987-09-08 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22504687A JPS6467941A (en) 1987-09-08 1987-09-08 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6467941A true JPS6467941A (en) 1989-03-14

Family

ID=16823192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22504687A Pending JPS6467941A (en) 1987-09-08 1987-09-08 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6467941A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321026A (en) * 1989-06-19 1991-01-29 Fujitsu Ltd Semiconductor device low in parasitic capacitance in wiring and its manufacture
US5357138A (en) * 1991-02-22 1994-10-18 Nec Corporation Coaxial wiring pattern structure in a multilayered wiring board
US5726498A (en) * 1995-05-26 1998-03-10 International Business Machines Corporation Wire shape conferring reduced crosstalk and formation methods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321026A (en) * 1989-06-19 1991-01-29 Fujitsu Ltd Semiconductor device low in parasitic capacitance in wiring and its manufacture
US5357138A (en) * 1991-02-22 1994-10-18 Nec Corporation Coaxial wiring pattern structure in a multilayered wiring board
US5726498A (en) * 1995-05-26 1998-03-10 International Business Machines Corporation Wire shape conferring reduced crosstalk and formation methods

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