JPS6464291A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6464291A
JPS6464291A JP10808987A JP10808987A JPS6464291A JP S6464291 A JPS6464291 A JP S6464291A JP 10808987 A JP10808987 A JP 10808987A JP 10808987 A JP10808987 A JP 10808987A JP S6464291 A JPS6464291 A JP S6464291A
Authority
JP
Japan
Prior art keywords
base material
resin
circuit sheet
circuit
metal mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10808987A
Other languages
English (en)
Inventor
Tsuneyuki Yamanaka
Shunji Fujimura
Fujio Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP10808987A priority Critical patent/JPS6464291A/ja
Publication of JPS6464291A publication Critical patent/JPS6464291A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP10808987A 1987-04-30 1987-04-30 Manufacture of printed wiring board Pending JPS6464291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10808987A JPS6464291A (en) 1987-04-30 1987-04-30 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10808987A JPS6464291A (en) 1987-04-30 1987-04-30 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6464291A true JPS6464291A (en) 1989-03-10

Family

ID=14475593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10808987A Pending JPS6464291A (en) 1987-04-30 1987-04-30 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6464291A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206989A (ja) * 1990-11-30 1992-07-28 Nitto Boseki Co Ltd プリント配線体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04206989A (ja) * 1990-11-30 1992-07-28 Nitto Boseki Co Ltd プリント配線体

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