JPS6464227A - Vessel for semiconductor device - Google Patents
Vessel for semiconductor deviceInfo
- Publication number
- JPS6464227A JPS6464227A JP22152587A JP22152587A JPS6464227A JP S6464227 A JPS6464227 A JP S6464227A JP 22152587 A JP22152587 A JP 22152587A JP 22152587 A JP22152587 A JP 22152587A JP S6464227 A JPS6464227 A JP S6464227A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- crosswise
- semiconductor pellets
- alignment
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE:To mount semiconductor pellets accurately at specified positions wihtout dispersion by manual operation by respectively forming a plurality of alignment trenches to a mounting surface lengthwise and crosswise at intervals narrower than a lower limit in the semiconductor pellets. CONSTITUTION:A mounting surface 2 for mounting semiconductor pellets plated with Au is set up to a vessel body 1 composed of a Kovar material, and plural kinds of the semiconductor pellets in different size are mounted singly or in a plurality. A plurality of alignment trenches 21a, 21b are shaped lengthwise and crosswise respectively to the mounting surface 2 in a section paper shape at regular intervals narrower than a lower limit lengthwise and crosswise in plural kinds of the semiconductor pellets. The semiconductor pellet 10 such as a GaAs semiconductor element is mounted with AnSn at a No.2 position from the left of the longitudinal alignment trench 21a and at a No.3 position from the upper section of the lateral alignment trench 21b, using the alignment trenches 21a, 21b as marks, and electrodes for the semiconductor pellet 10 and terminals 3 are connected by bonding wires 11.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22152587A JPS6464227A (en) | 1987-09-03 | 1987-09-03 | Vessel for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22152587A JPS6464227A (en) | 1987-09-03 | 1987-09-03 | Vessel for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6464227A true JPS6464227A (en) | 1989-03-10 |
Family
ID=16768079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22152587A Pending JPS6464227A (en) | 1987-09-03 | 1987-09-03 | Vessel for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6464227A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002368156A (en) * | 2001-06-11 | 2002-12-20 | Oki Electric Ind Co Ltd | Semiconductor device and manufacturing method therefor |
JP2013179238A (en) * | 2012-02-29 | 2013-09-09 | Oki Electric Ind Co Ltd | Package and power amplifier |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6113937B2 (en) * | 1981-01-21 | 1986-04-16 | Shutaruku Geeruharudo | |
JPS61156753A (en) * | 1984-12-27 | 1986-07-16 | Toshiba Corp | Casing for semiconductor device |
JPS61265842A (en) * | 1985-05-20 | 1986-11-25 | Fujitsu Ltd | Semiconductor device |
-
1987
- 1987-09-03 JP JP22152587A patent/JPS6464227A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6113937B2 (en) * | 1981-01-21 | 1986-04-16 | Shutaruku Geeruharudo | |
JPS61156753A (en) * | 1984-12-27 | 1986-07-16 | Toshiba Corp | Casing for semiconductor device |
JPS61265842A (en) * | 1985-05-20 | 1986-11-25 | Fujitsu Ltd | Semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002368156A (en) * | 2001-06-11 | 2002-12-20 | Oki Electric Ind Co Ltd | Semiconductor device and manufacturing method therefor |
US6858947B2 (en) | 2001-06-11 | 2005-02-22 | Oki Electric Industry Co., Ltd. | Semiconductor device |
US7247522B2 (en) | 2001-06-11 | 2007-07-24 | Oki Electric Industry Co., Ltd | Semiconductor device |
JP2013179238A (en) * | 2012-02-29 | 2013-09-09 | Oki Electric Ind Co Ltd | Package and power amplifier |
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