JPS6460632A - Production of prepreg - Google Patents

Production of prepreg

Info

Publication number
JPS6460632A
JPS6460632A JP21675687A JP21675687A JPS6460632A JP S6460632 A JPS6460632 A JP S6460632A JP 21675687 A JP21675687 A JP 21675687A JP 21675687 A JP21675687 A JP 21675687A JP S6460632 A JPS6460632 A JP S6460632A
Authority
JP
Japan
Prior art keywords
resin
resin solution
prepreg
adhere
passed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21675687A
Other languages
Japanese (ja)
Inventor
Kiyoshi Yokochi
Masami Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP21675687A priority Critical patent/JPS6460632A/en
Publication of JPS6460632A publication Critical patent/JPS6460632A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE:To obtain a prepreg which can give a laminated sheet excellent in dimensional stability, low in warp and twist and free of bubbles by molding at a low pressure, by pressing a woven cloth with a nip roll, passing it through a resin solution to adhere the resin solution thereto and drying it. CONSTITUTION:A woven cloth 1 such as a glass cloth surface-treated with a silane coupling agent and wound into a roll is pressed with a nip roll 4 at a pressure of 1-70kg/cm<2> to render it easily impregnatable with a resin solution 2, passed through a resin solution tank 5 filled with a resin solution 2 such as a varnish of a thermosetting resin such as an epoxy resin, a polyester resin or a polyimide resin to adhere the resin to it, passed between, e.g., a pair of rolls to squeeze adherent excessive resin to a specified thickness and led to a drying chamber 3, where it is brought into B stage to obtain a prepreg 6.
JP21675687A 1987-08-31 1987-08-31 Production of prepreg Pending JPS6460632A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21675687A JPS6460632A (en) 1987-08-31 1987-08-31 Production of prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21675687A JPS6460632A (en) 1987-08-31 1987-08-31 Production of prepreg

Publications (1)

Publication Number Publication Date
JPS6460632A true JPS6460632A (en) 1989-03-07

Family

ID=16693425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21675687A Pending JPS6460632A (en) 1987-08-31 1987-08-31 Production of prepreg

Country Status (1)

Country Link
JP (1) JPS6460632A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071701A (en) * 1989-11-22 1991-12-10 B. F. Goodrich Corporation Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
US7413623B2 (en) * 2005-02-04 2008-08-19 Rse Industries, Inc. Apparatus for resin-impregnation of fibers for filament winding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5071701A (en) * 1989-11-22 1991-12-10 B. F. Goodrich Corporation Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
US7413623B2 (en) * 2005-02-04 2008-08-19 Rse Industries, Inc. Apparatus for resin-impregnation of fibers for filament winding

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