JPS646054U - - Google Patents

Info

Publication number
JPS646054U
JPS646054U JP1987101134U JP10113487U JPS646054U JP S646054 U JPS646054 U JP S646054U JP 1987101134 U JP1987101134 U JP 1987101134U JP 10113487 U JP10113487 U JP 10113487U JP S646054 U JPS646054 U JP S646054U
Authority
JP
Japan
Prior art keywords
emitting diode
light
light emitting
chip
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987101134U
Other languages
English (en)
Other versions
JPH0644117Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987101134U priority Critical patent/JPH0644117Y2/ja
Publication of JPS646054U publication Critical patent/JPS646054U/ja
Application granted granted Critical
Publication of JPH0644117Y2 publication Critical patent/JPH0644117Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す部分断面図、
第２図は同ＬＥＤチツプを示す側断面図、第３図
は同駆動回路図、第４図ａ，ｂは従来及び本考案
のエピ成長温度プログラムを示すグラフ、第５図
は一般的な２色ＬＥＤ素子を示す側断面図、第６
図は従来例を示す部分断面図、第７図ａ，ｂは同
ＬＥＤチツプを示す側断面図、第８図は同駆動回
路図、第９図はＬＥＤチツプのダイボンド部を示
す拡大断面図である。 １……ステム、１ａ……共通端子、２，３，１
２……ＬＥＤチツプ、４……導電性ペースト、５
，６……金線、７，８……端子、９……樹脂、１
０……ＮオンＰタイプのＧａＡｌＡｓＬＥＤチツ
プ、１１……ＰオンＮタイプのＧａＰＬＥＤチツ
プ、１３……銀ペースト、１５……リードフレー
ム、１４……ＮオンＰタイプのＧａＰＬＥＤチツ
プ。

Claims (1)

  1. 【実用新案登録請求の範囲】 スラム上に２つの発光ダイオードチツプをマウ
    ントしてなる２色発光ダイオード素子において、 前記一方の発光ダイオードチツプをＮオンＰタ
    イプのＧａＡｌＡｓ発光ダイオードチツプとし、
    もう一方の発光ダイオードチツプをＰ層の厚みを
    １００μｍ以上としたＮオンＰタイプのＧａＰ発
    光ダイオードチツプとして、前記両方の発光ダイ
    オードチツプのアノード側を前記ステム上にマウ
    ントして共通端子としたことを特徴とする２色発
    光ダイオード素子。
JP1987101134U 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子 Expired - Lifetime JPH0644117Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987101134U JPH0644117Y2 (ja) 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987101134U JPH0644117Y2 (ja) 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子

Publications (2)

Publication Number Publication Date
JPS646054U true JPS646054U (ja) 1989-01-13
JPH0644117Y2 JPH0644117Y2 (ja) 1994-11-14

Family

ID=31329850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987101134U Expired - Lifetime JPH0644117Y2 (ja) 1987-06-30 1987-06-30 ２色発光ダイオ−ド素子

Country Status (1)

Country Link
JP (1) JPH0644117Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539270U (ja) * 1991-10-30 1993-05-28 ダイワ精工株式会社 覆面型魚釣用リ−ル

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531196A (en) * 1976-06-25 1978-01-07 Hitachi Metals Ltd Static regenerating furnace for active carbon
JPS5891688A (ja) * 1981-11-26 1983-05-31 Toshiba Corp 二色発光ダイオ−ドおよびその製造方法
JPS61181176A (ja) * 1985-02-06 1986-08-13 Toshiba Corp 光半導体装置
JPS6255975A (ja) * 1985-09-05 1987-03-11 Mitaka Denshi Kagaku Kenkyusho:Kk Ｌｅｄ多色発光システム
JPS6247154U (ja) * 1985-09-10 1987-03-23

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS531196A (en) * 1976-06-25 1978-01-07 Hitachi Metals Ltd Static regenerating furnace for active carbon
JPS5891688A (ja) * 1981-11-26 1983-05-31 Toshiba Corp 二色発光ダイオ−ドおよびその製造方法
JPS61181176A (ja) * 1985-02-06 1986-08-13 Toshiba Corp 光半導体装置
JPS6255975A (ja) * 1985-09-05 1987-03-11 Mitaka Denshi Kagaku Kenkyusho:Kk Ｌｅｄ多色発光システム
JPS6247154U (ja) * 1985-09-10 1987-03-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0539270U (ja) * 1991-10-30 1993-05-28 ダイワ精工株式会社 覆面型魚釣用リ−ル

Also Published As

Publication number Publication date
JPH0644117Y2 (ja) 1994-11-14

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