JPS63105367U - - Google Patents

Info

Publication number
JPS63105367U
JPS63105367U JP1986204121U JP20412186U JPS63105367U JP S63105367 U JPS63105367 U JP S63105367U JP 1986204121 U JP1986204121 U JP 1986204121U JP 20412186 U JP20412186 U JP 20412186U JP S63105367 U JPS63105367 U JP S63105367U
Authority
JP
Japan
Prior art keywords
external connection
connection lead
mount part
type region
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986204121U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986204121U priority Critical patent/JPS63105367U/ja
Publication of JPS63105367U publication Critical patent/JPS63105367U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】
第１図は本考案に係る半導体発光装置の一実施
例を示す断面図、第２図及び第３図は同実施例に
おけるＬＥＤチツプの構造説明図、第４図は従来
例を示す断面図である。 １Ａ及び１Ｂ……外部接続リード、２Ａ及び２
Ｂ……ＬＥＤチツプ、３Ａ及び３Ｂ……導電性接
着剤、４……ボンデイングワイヤ、５……樹脂パ
ツケージ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一方の外部接続リードのマウント部には、Ｎ型
    基板上にＰ型領域をエピタキシヤル法で形成した
    ＬＥＤチツプを、他方の外部接続リードのマウン
    ト部には、Ｐ型基板上にＮ型領域をエピタキシヤ
    ル法で形成したＬＥＤチツプをそれぞれ導電性接
    着剤を用いて装着し、両チツプをボンデイングワ
    イヤにより接続した状態で樹脂パツケージを形成
    したことを特徴とする半導体発光装置。
JP1986204121U 1986-12-25 1986-12-25 Pending JPS63105367U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986204121U JPS63105367U (ja) 1986-12-25 1986-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986204121U JPS63105367U (ja) 1986-12-25 1986-12-25

Publications (1)

Publication Number Publication Date
JPS63105367U true JPS63105367U (ja) 1988-07-08

Family

ID=31170081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986204121U Pending JPS63105367U (ja) 1986-12-25 1986-12-25

Country Status (1)

Country Link
JP (1) JPS63105367U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918453B2 (ja) * 1981-05-08 1984-04-27 川崎製鉄株式会社 金属酸化物を含有する粉状鉱石からの溶触金属製造法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5918453B2 (ja) * 1981-05-08 1984-04-27 川崎製鉄株式会社 金属酸化物を含有する粉状鉱石からの溶触金属製造法

Similar Documents

Publication Publication Date Title
JPS63105367U (ja)
JPH0345668U (ja)
JPH0651001Y2 (ja) 光結合素子
JPH0444171U (ja)
JPH0245660U (ja)
JPS6159364U (ja)
JPS646054U (ja)
JPH0310561U (ja)
JPH0399452U (ja)
JPS5918453U (ja) 発光ダイオ−ド
JPS61182036U (ja)
JPH0265349U (ja)
JPS6247154U (ja)
JPS6364060U (ja)
JPS63174449U (ja)
JPH028047U (ja)
JPS6240854U (ja)
JPH0256439U (ja)
JPS6045451U (ja) 光結合素子
JPH01120343U (ja)
JPS6424867U (ja)
JPS5887363U (ja) 半導体装置
JPS6181168U (ja)
JPS6371546U (ja)
JPH0242455U (ja)