JPS646041U - - Google Patents

Info

Publication number
JPS646041U
JPS646041U JP1987099366U JP9936687U JPS646041U JP S646041 U JPS646041 U JP S646041U JP 1987099366 U JP1987099366 U JP 1987099366U JP 9936687 U JP9936687 U JP 9936687U JP S646041 U JPS646041 U JP S646041U
Authority
JP
Japan
Prior art keywords
electrode body
chip
lead frame
lead wire
insulator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987099366U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546271Y2 (index.php
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987099366U priority Critical patent/JPH0546271Y2/ja
Publication of JPS646041U publication Critical patent/JPS646041U/ja
Application granted granted Critical
Publication of JPH0546271Y2 publication Critical patent/JPH0546271Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07141—
    • H10W72/07551—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/581—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP1987099366U 1987-06-30 1987-06-30 Expired - Lifetime JPH0546271Y2 (index.php)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987099366U JPH0546271Y2 (index.php) 1987-06-30 1987-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987099366U JPH0546271Y2 (index.php) 1987-06-30 1987-06-30

Publications (2)

Publication Number Publication Date
JPS646041U true JPS646041U (index.php) 1989-01-13
JPH0546271Y2 JPH0546271Y2 (index.php) 1993-12-03

Family

ID=31326458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987099366U Expired - Lifetime JPH0546271Y2 (index.php) 1987-06-30 1987-06-30

Country Status (1)

Country Link
JP (1) JPH0546271Y2 (index.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
WO2021060161A1 (ja) * 2019-09-27 2021-04-01 株式会社村田製作所 モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210845A (ja) * 1984-04-05 1985-10-23 Toshiba Corp 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60210845A (ja) * 1984-04-05 1985-10-23 Toshiba Corp 樹脂封止型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037239A (ja) * 2001-07-24 2003-02-07 Sanyo Electric Co Ltd 半導体装置およびその製造方法
WO2021060161A1 (ja) * 2019-09-27 2021-04-01 株式会社村田製作所 モジュール

Also Published As

Publication number Publication date
JPH0546271Y2 (index.php) 1993-12-03

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