JPS6459925A - Method and device for resin-sealed formation of semiconductor element - Google Patents

Method and device for resin-sealed formation of semiconductor element

Info

Publication number
JPS6459925A
JPS6459925A JP21721987A JP21721987A JPS6459925A JP S6459925 A JPS6459925 A JP S6459925A JP 21721987 A JP21721987 A JP 21721987A JP 21721987 A JP21721987 A JP 21721987A JP S6459925 A JPS6459925 A JP S6459925A
Authority
JP
Japan
Prior art keywords
resin
gap
air
semiconductor element
plunger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21721987A
Other languages
English (en)
Inventor
Atsushi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21721987A priority Critical patent/JPS6459925A/ja
Publication of JPS6459925A publication Critical patent/JPS6459925A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
JP21721987A 1987-08-31 1987-08-31 Method and device for resin-sealed formation of semiconductor element Pending JPS6459925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21721987A JPS6459925A (en) 1987-08-31 1987-08-31 Method and device for resin-sealed formation of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21721987A JPS6459925A (en) 1987-08-31 1987-08-31 Method and device for resin-sealed formation of semiconductor element

Publications (1)

Publication Number Publication Date
JPS6459925A true JPS6459925A (en) 1989-03-07

Family

ID=16700722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21721987A Pending JPS6459925A (en) 1987-08-31 1987-08-31 Method and device for resin-sealed formation of semiconductor element

Country Status (1)

Country Link
JP (1) JPS6459925A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997033046A1 (es) * 1996-03-06 1997-09-12 Bsm Europa, S.A. Procedimiento para la fabricacion de hitos de señalizacion, y sistema de anclaje para ellos
ES2127103A2 (es) * 1996-03-06 1999-04-01 Bsm Europa S A Procedimiento para la fabricacion de hitos de señalizacion.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997033046A1 (es) * 1996-03-06 1997-09-12 Bsm Europa, S.A. Procedimiento para la fabricacion de hitos de señalizacion, y sistema de anclaje para ellos
ES2127103A2 (es) * 1996-03-06 1999-04-01 Bsm Europa S A Procedimiento para la fabricacion de hitos de señalizacion.

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