JPS6457726A - Manufacture of tape carrier type semiconductor device - Google Patents
Manufacture of tape carrier type semiconductor deviceInfo
- Publication number
- JPS6457726A JPS6457726A JP21559387A JP21559387A JPS6457726A JP S6457726 A JPS6457726 A JP S6457726A JP 21559387 A JP21559387 A JP 21559387A JP 21559387 A JP21559387 A JP 21559387A JP S6457726 A JPS6457726 A JP S6457726A
- Authority
- JP
- Japan
- Prior art keywords
- tie
- bar
- semiconductor chip
- inner leads
- tape carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To prevent the positional displacement of an inner lead by gang- bonding a semiconductor chip with a tape carrier with the inner lead connected by a tie-bar, sealing the semiconductor chip and lastly cutting the tie-bar through laser beam machining. CONSTITUTION:Inner leads 1 and a tie-bar 2 are formed by pattern-etching rolled copper, and it is preferable that a distance L from a finger tip to the tie-bar is brought to 1.5mm. The inner leads 1 and a semiconductor chip 4, on electrodes of which bumps are shaped, are positioned, and gang-bonded. A pellet, an epoxy resin of which is half-cured, is placed onto the inner leads 1 so that the semiconductor chip 4 is hidden, the resin is solidified, and the pellet is sealed. The tie-bar 2 is exposed to the outside of a sealing body 5, and the inner leads 1 are cut by laser beams 6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21559387A JPS6457726A (en) | 1987-08-28 | 1987-08-28 | Manufacture of tape carrier type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21559387A JPS6457726A (en) | 1987-08-28 | 1987-08-28 | Manufacture of tape carrier type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457726A true JPS6457726A (en) | 1989-03-06 |
Family
ID=16674998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21559387A Pending JPS6457726A (en) | 1987-08-28 | 1987-08-28 | Manufacture of tape carrier type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457726A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10063041A1 (en) * | 2000-12-18 | 2002-07-04 | Infineon Technologies Ag | Method of making an integrated circuit |
JP2010141163A (en) * | 2008-12-12 | 2010-06-24 | Fuji Electric Systems Co Ltd | Semiconductor device and method of manufacturing the same |
-
1987
- 1987-08-28 JP JP21559387A patent/JPS6457726A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10063041A1 (en) * | 2000-12-18 | 2002-07-04 | Infineon Technologies Ag | Method of making an integrated circuit |
US6649450B2 (en) | 2000-12-18 | 2003-11-18 | Infineon Technologies Ag | Method of producing an integrated circuit and an integrated circuit |
DE10063041B4 (en) * | 2000-12-18 | 2012-12-06 | Infineon Technologies Ag | A method of manufacturing an integrated leadless package circuit and integrated leadless package circuit |
JP2010141163A (en) * | 2008-12-12 | 2010-06-24 | Fuji Electric Systems Co Ltd | Semiconductor device and method of manufacturing the same |
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