JPS6457657U - - Google Patents
Info
- Publication number
- JPS6457657U JPS6457657U JP15064387U JP15064387U JPS6457657U JP S6457657 U JPS6457657 U JP S6457657U JP 15064387 U JP15064387 U JP 15064387U JP 15064387 U JP15064387 U JP 15064387U JP S6457657 U JPS6457657 U JP S6457657U
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- integrated circuit
- capacitor
- mounting structure
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15064387U JPH069519Y2 (ja) | 1987-10-01 | 1987-10-01 | 高周波回路の実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15064387U JPH069519Y2 (ja) | 1987-10-01 | 1987-10-01 | 高周波回路の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6457657U true JPS6457657U (es) | 1989-04-10 |
| JPH069519Y2 JPH069519Y2 (ja) | 1994-03-09 |
Family
ID=31423970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15064387U Expired - Lifetime JPH069519Y2 (ja) | 1987-10-01 | 1987-10-01 | 高周波回路の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069519Y2 (es) |
-
1987
- 1987-10-01 JP JP15064387U patent/JPH069519Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH069519Y2 (ja) | 1994-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6457368B1 (en) | Noise reduced pressure sensor | |
| JPS6457657U (es) | ||
| JPH01213018A (ja) | 弾性表面波ディバイスの構造 | |
| JPS5853765Y2 (ja) | 変換器 | |
| JP2502612Y2 (ja) | 電子部品 | |
| JPS6393136A (ja) | トランジスタ装置 | |
| JPH03113853U (es) | ||
| JPS6125259Y2 (es) | ||
| JPS60130648U (ja) | ハ−メチツクシ−ル用パツケ−ジ | |
| JPS5832332Y2 (ja) | 音叉型水晶振動子の電極導出構造 | |
| JPS6043022B2 (ja) | マイクロ波装置モジュ−ル | |
| JPH067575Y2 (ja) | 気密端子 | |
| JPH0227626Y2 (es) | ||
| JPS5834421U (ja) | 高周波デバイス用ケ−ス | |
| JPH0343659Y2 (es) | ||
| JPH0590831U (ja) | 気密端子 | |
| JPH0363987U (es) | ||
| JPH0363986U (es) | ||
| JPS5880899A (ja) | 電子装置 | |
| JPS60872U (ja) | ア−スリ−ド線付き気密端子 | |
| JPS6430847U (es) | ||
| JPH0289397A (ja) | 高周波回路装置 | |
| JPS6025231U (ja) | 水晶振動子用気密端子 | |
| JPH0457506A (ja) | 弾性表面波装置 | |
| JPH0160949B2 (es) |