JPS6457140A - Measuring device for light emitting element - Google Patents
Measuring device for light emitting elementInfo
- Publication number
- JPS6457140A JPS6457140A JP21133687A JP21133687A JPS6457140A JP S6457140 A JPS6457140 A JP S6457140A JP 21133687 A JP21133687 A JP 21133687A JP 21133687 A JP21133687 A JP 21133687A JP S6457140 A JPS6457140 A JP S6457140A
- Authority
- JP
- Japan
- Prior art keywords
- led
- optical fiber
- contact
- light
- metal probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Devices (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To improve measuring accuracy and to simplify measuring operation, by guiding light emitted from an LED through an optical fiber bundle, inputting a metal probe at the center of the optical fiber bundle, and bringing the metal probe into contact with the surface electrode of the LED. CONSTITUTION:Optical fibers 40 are bundled into a cylindrical bundle so as to surround a metal probe 3 at the center. The outer surface of the bundle is fixed with a resin 4. Each optical fiber 40 is cut at a relatively close position to a contact tip 31 of the metal probe 3. A smooth light receiving plane 42 is formed. The area of the light receiving plane 42 is sufficiently wider than the light emitting surface of an LED 1. When, the tip 31 is brought into contact with a specified position of a surface electrode 11, the light receiving plane 42 becomes parallel with the light emitting surface of the LED 1. The LED 1 is placed on a metal plate 8, and the tip 31 is brought into contact with the electrode 11. Then, a voltage is applied across a rear electrode 12 and the LED 1 through a conductor wire 32. Thus, the LED 1 emits light. The light is inputted into a photodetector 2 through the optical fiber bundle 4 and measured. Namely, any machining is not required for the LED 1, and measurement can be performed regardless of the thickness of the LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21133687A JPS6457140A (en) | 1987-08-27 | 1987-08-27 | Measuring device for light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21133687A JPS6457140A (en) | 1987-08-27 | 1987-08-27 | Measuring device for light emitting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457140A true JPS6457140A (en) | 1989-03-03 |
Family
ID=16604270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21133687A Pending JPS6457140A (en) | 1987-08-27 | 1987-08-27 | Measuring device for light emitting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457140A (en) |
-
1987
- 1987-08-27 JP JP21133687A patent/JPS6457140A/en active Pending
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