JPS6456720A - Epoxy resin composition and semiconductor device coated and sealed therewith - Google Patents
Epoxy resin composition and semiconductor device coated and sealed therewithInfo
- Publication number
- JPS6456720A JPS6456720A JP21280287A JP21280287A JPS6456720A JP S6456720 A JPS6456720 A JP S6456720A JP 21280287 A JP21280287 A JP 21280287A JP 21280287 A JP21280287 A JP 21280287A JP S6456720 A JPS6456720 A JP S6456720A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- compound
- semiconductor device
- resin composition
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To obtain the titled composition outstanding in heat resistance and molding processability, useful for semiconductor device sealing etc., by blending a glycidyl group-terminated diazo compound and Schiff compound of respective specific structures. CONSTITUTION:The objective composition can be obtained by blending (A) a glycidyl group-terminated diazo compound of formula I (X1 and X2 are each -O- or of formula II) (pref. a compound of formula V) and (B) a Schiff compound of formula III [Y1 and Y2 are each -(CH2)m- (m is 1-12), of formula IV, etc.; Z1 and Z2 are each -NH2, -NH-CidenticalN, etc.] (pref. a compound of formula VI).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21280287A JPS6456720A (en) | 1987-08-28 | 1987-08-28 | Epoxy resin composition and semiconductor device coated and sealed therewith |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21280287A JPS6456720A (en) | 1987-08-28 | 1987-08-28 | Epoxy resin composition and semiconductor device coated and sealed therewith |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6456720A true JPS6456720A (en) | 1989-03-03 |
Family
ID=16628619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21280287A Pending JPS6456720A (en) | 1987-08-28 | 1987-08-28 | Epoxy resin composition and semiconductor device coated and sealed therewith |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6456720A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017195833A1 (en) * | 2016-05-12 | 2017-11-16 | 富士フイルム株式会社 | Colored composition, dichroic dye compound, light absorption anisotropy film, layered product, and image display device |
-
1987
- 1987-08-28 JP JP21280287A patent/JPS6456720A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017195833A1 (en) * | 2016-05-12 | 2017-11-16 | 富士フイルム株式会社 | Colored composition, dichroic dye compound, light absorption anisotropy film, layered product, and image display device |
JPWO2017195833A1 (en) * | 2016-05-12 | 2019-03-28 | 富士フイルム株式会社 | Colored composition, dichroic dye compound, light absorption anisotropic film, laminate, and image display device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO813986L (en) | RUBBERY POLYMER COMPOSITIONS WITH IMPROVED ADHESION | |
JPS6456721A (en) | Epoxy resin composition and semiconductor device coated and sealed therewith | |
JPS6456720A (en) | Epoxy resin composition and semiconductor device coated and sealed therewith | |
EP0266895A3 (en) | Dioxolane, diol and diacrylate silicon compounds and method for their preparation and use | |
JPS57202318A (en) | Curable resin composition | |
JPS6485215A (en) | Epoxy resin composition | |
JPS53140973A (en) | Forming method of semiconductor insulation film | |
JPS5251499A (en) | Theremosetting resin compositions | |
JPS57158202A (en) | Production of crown ether ring-containing polymer | |
JPS53146799A (en) | Novel epoxy resin and its preparation | |
JPS56115362A (en) | Coating material | |
JPS5670022A (en) | Epoxy resin, its preparation, and its composition | |
JPS547431A (en) | Preparation of reactive diluent | |
JPS52147637A (en) | Chelate bond forming resin composition for powder coating | |
JPS51119798A (en) | A thermosetting resin composition | |
JPS5373519A (en) | Preparation of reactive monomer | |
JPS53121828A (en) | Powder coating resin composition | |
JPS5531838A (en) | Adhesive composition and composite using the same | |
JPS56133883A (en) | Photoelectric transducer | |
JPS5764617A (en) | Cytotoxic proteinic complex and its preparation | |
JPS57137372A (en) | Adhesive and its preparation | |
JPS5392844A (en) | Coating composition | |
JPS5525429A (en) | Adhesive | |
JPS5523113A (en) | Adhesive composition | |
JPS5599910A (en) | Photosensitive resin composition |