JPS6456720A - Epoxy resin composition and semiconductor device coated and sealed therewith - Google Patents

Epoxy resin composition and semiconductor device coated and sealed therewith

Info

Publication number
JPS6456720A
JPS6456720A JP21280287A JP21280287A JPS6456720A JP S6456720 A JPS6456720 A JP S6456720A JP 21280287 A JP21280287 A JP 21280287A JP 21280287 A JP21280287 A JP 21280287A JP S6456720 A JPS6456720 A JP S6456720A
Authority
JP
Japan
Prior art keywords
formula
compound
semiconductor device
resin composition
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21280287A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP21280287A priority Critical patent/JPS6456720A/en
Publication of JPS6456720A publication Critical patent/JPS6456720A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the titled composition outstanding in heat resistance and molding processability, useful for semiconductor device sealing etc., by blending a glycidyl group-terminated diazo compound and Schiff compound of respective specific structures. CONSTITUTION:The objective composition can be obtained by blending (A) a glycidyl group-terminated diazo compound of formula I (X1 and X2 are each -O- or of formula II) (pref. a compound of formula V) and (B) a Schiff compound of formula III [Y1 and Y2 are each -(CH2)m- (m is 1-12), of formula IV, etc.; Z1 and Z2 are each -NH2, -NH-CidenticalN, etc.] (pref. a compound of formula VI).
JP21280287A 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith Pending JPS6456720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21280287A JPS6456720A (en) 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21280287A JPS6456720A (en) 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith

Publications (1)

Publication Number Publication Date
JPS6456720A true JPS6456720A (en) 1989-03-03

Family

ID=16628619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21280287A Pending JPS6456720A (en) 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith

Country Status (1)

Country Link
JP (1) JPS6456720A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017195833A1 (en) * 2016-05-12 2017-11-16 富士フイルム株式会社 Colored composition, dichroic dye compound, light absorption anisotropy film, layered product, and image display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017195833A1 (en) * 2016-05-12 2017-11-16 富士フイルム株式会社 Colored composition, dichroic dye compound, light absorption anisotropy film, layered product, and image display device
JPWO2017195833A1 (en) * 2016-05-12 2019-03-28 富士フイルム株式会社 Colored composition, dichroic dye compound, light absorption anisotropic film, laminate, and image display device

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