JPS6485215A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS6485215A JPS6485215A JP24075687A JP24075687A JPS6485215A JP S6485215 A JPS6485215 A JP S6485215A JP 24075687 A JP24075687 A JP 24075687A JP 24075687 A JP24075687 A JP 24075687A JP S6485215 A JPS6485215 A JP S6485215A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- compd
- epoxy resin
- resin composition
- schiff
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain an epoxy resin compsn. having excellent heat resistance and moldability and being useful for coating and sealing of semiconductor devices, and comprising a glycidyl group terminated stilbene compd. and a Schiff compd. CONSTITUTION:An epoxy resin compsn. is comprised of a glycidyl group terminated stilbene compd. of formula I (wherein X1 and X2 are each O, a group of formula II) (e.g., a compd. of formula III) and a Schiff compd. of formula IV [wherein Y1 and Y2 are each formula V (wherein m is 1-12), formula VI, formula VII (wherein P is not included or CH2, O, CO, S, SO2, etc.) and so on; Z1 and Z2 are each NH2, OH, OCN, COOH, etc.] (e.g., a compd. of formula VIII). The composition contg. both of the compd. of formulas I and IV has excellent heat resistance and moldability and is useful for coating and sealing of semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24075687A JPS6485215A (en) | 1987-09-28 | 1987-09-28 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24075687A JPS6485215A (en) | 1987-09-28 | 1987-09-28 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6485215A true JPS6485215A (en) | 1989-03-30 |
Family
ID=17064247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24075687A Pending JPS6485215A (en) | 1987-09-28 | 1987-09-28 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6485215A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939473A (en) * | 1995-04-27 | 1999-08-17 | Sumitomo Chemical Company, Limited | Epoxy resin, resin composition, and resin-encapsulated semiconductor device |
| JP2013119608A (en) * | 2011-12-08 | 2013-06-17 | Nippon Steel & Sumikin Chemical Co Ltd | Epoxy resin, epoxy resin composition and cured product thereof |
-
1987
- 1987-09-28 JP JP24075687A patent/JPS6485215A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939473A (en) * | 1995-04-27 | 1999-08-17 | Sumitomo Chemical Company, Limited | Epoxy resin, resin composition, and resin-encapsulated semiconductor device |
| US5939509A (en) * | 1995-04-27 | 1999-08-17 | Sumitomo Chemical Company, Ltd. | Epoxy resin, resin composition, and resin-encapsulated semiconductor device |
| JP2013119608A (en) * | 2011-12-08 | 2013-06-17 | Nippon Steel & Sumikin Chemical Co Ltd | Epoxy resin, epoxy resin composition and cured product thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DK417385A (en) | CHEMICAL HARDINABLE RESINES OF 1-OXA-3-AZA TETRALING-RELATED COMPOUNDS AND CYCLOALIPHATIC EPOXID RESINTS, PROCEDURES FOR THEIR PREPARATION AND CURRENCY AND THE USE OF APPLICATION | |
| JPS55110166A (en) | Coating composition | |
| MY124259A (en) | Epoxy resin composition for encapsulating photosemiconductor element photosemiconductor device | |
| IL129768A0 (en) | Antithrombotic organic nitrates | |
| ATE35549T1 (en) | EPOXY COMPOUNDS CONTAINING SUBSTITUTED DIAMININE HARDENERS. | |
| JPS6485215A (en) | Epoxy resin composition | |
| JPS6456721A (en) | Epoxy resin composition and semiconductor device coated and sealed therewith | |
| JPS57212230A (en) | Novel polyimide resin molded article | |
| BR9007152A (en) | PROCESS FOR MANUFACTURING CLOSES FOR PACKAGING CONTAINERS | |
| JPS54120642A (en) | Cathode-deposition-type electrocoating composition | |
| JPS5525469A (en) | Thermosetting resin composition | |
| ES8607361A1 (en) | Use of reactive diluents for epoxy resins, and epoxy balk compounds. | |
| DE69503808D1 (en) | Epoxypolyether | |
| ZA90238B (en) | Low-temperature curable compositions based upon polyaromatic aldehyde group-containing compounds and ketiminized polyamino compounds | |
| JPS54116099A (en) | Thermosetting resin composition | |
| JPS6456720A (en) | Epoxy resin composition and semiconductor device coated and sealed therewith | |
| JPS57212226A (en) | Resin composition | |
| JPS5363439A (en) | Covering composition and its production | |
| JPS5692261A (en) | Novel cyclohexanecarboxylic derivative and its preparation | |
| DE69511724D1 (en) | Epoxypolyether | |
| JPS56115362A (en) | Coating material | |
| JPS5670022A (en) | Epoxy resin, its preparation, and its composition | |
| JPS57108123A (en) | Flame-retarding resin composition | |
| JPS5392844A (en) | Coating composition | |
| JPS5725351A (en) | Primer composition |