JPS6456721A - Epoxy resin composition and semiconductor device coated and sealed therewith - Google Patents

Epoxy resin composition and semiconductor device coated and sealed therewith

Info

Publication number
JPS6456721A
JPS6456721A JP21280987A JP21280987A JPS6456721A JP S6456721 A JPS6456721 A JP S6456721A JP 21280987 A JP21280987 A JP 21280987A JP 21280987 A JP21280987 A JP 21280987A JP S6456721 A JPS6456721 A JP S6456721A
Authority
JP
Japan
Prior art keywords
composition
semiconductor device
resin composition
epoxy resin
device coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21280987A
Other languages
Japanese (ja)
Inventor
Akio Nishikawa
Toru Koyama
Hideki Asano
Toshikazu Narahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP21280987A priority Critical patent/JPS6456721A/en
Publication of JPS6456721A publication Critical patent/JPS6456721A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To provide the titled composition outstanding in heat resistance and molding processability, useful for coating and sealing semiconductor devices, comprising a specific epoxy compound. CONSTITUTION:The objective composition comprising at least on epoxy compound of formula I (X1 and X2 are each -O- or -COO-; Y1 and Y2 are each -CH=N-, -CH=CH- or -N=N-) (pref. of formula II). Preferably, this composition is further incorporated with a N,N'-substituted unsaturated bismaleimide compound of formula III (D1 and D2 are each divalent group containing ethylenic unsaturated double bond) for enhancing the heat resistance of said composition.
JP21280987A 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith Pending JPS6456721A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21280987A JPS6456721A (en) 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21280987A JPS6456721A (en) 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith

Publications (1)

Publication Number Publication Date
JPS6456721A true JPS6456721A (en) 1989-03-03

Family

ID=16628723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21280987A Pending JPS6456721A (en) 1987-08-28 1987-08-28 Epoxy resin composition and semiconductor device coated and sealed therewith

Country Status (1)

Country Link
JP (1) JPS6456721A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075790A (en) * 1989-10-26 1991-12-24 Alps Electric Co., Ltd. Method for orienting liquid crystal display element by rubbing
US5390037A (en) * 1992-09-25 1995-02-14 Casio Computer Co., Ltd. Liquid crystal molecule orienting method
JPH08134173A (en) * 1994-11-10 1996-05-28 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition and cured product thereof
JPH10504792A (en) * 1994-08-29 1998-05-12 ヘキスト・アクチェンゲゼルシャフト Airgel composites, their production method and their use
US5939509A (en) * 1995-04-27 1999-08-17 Sumitomo Chemical Company, Ltd. Epoxy resin, resin composition, and resin-encapsulated semiconductor device
JP2005139298A (en) * 2003-11-06 2005-06-02 Polymatech Co Ltd Anisotropic epoxy resin cured product and method for producing the same
JP2012102227A (en) * 2010-11-10 2012-05-31 Sumitomo Bakelite Co Ltd Epoxy resin precursor composition, prepreg, laminated plate, resin sheet, printed wiring board and semiconductor device
JP2012236908A (en) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminated board
JP2013119608A (en) * 2011-12-08 2013-06-17 Nippon Steel & Sumikin Chemical Co Ltd Epoxy resin, epoxy resin composition and cured product thereof
WO2017195833A1 (en) * 2016-05-12 2017-11-16 富士フイルム株式会社 Colored composition, dichroic dye compound, light absorption anisotropy film, layered product, and image display device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5075790A (en) * 1989-10-26 1991-12-24 Alps Electric Co., Ltd. Method for orienting liquid crystal display element by rubbing
US5390037A (en) * 1992-09-25 1995-02-14 Casio Computer Co., Ltd. Liquid crystal molecule orienting method
JPH10504792A (en) * 1994-08-29 1998-05-12 ヘキスト・アクチェンゲゼルシャフト Airgel composites, their production method and their use
JPH08134173A (en) * 1994-11-10 1996-05-28 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition and cured product thereof
US5939509A (en) * 1995-04-27 1999-08-17 Sumitomo Chemical Company, Ltd. Epoxy resin, resin composition, and resin-encapsulated semiconductor device
US5939473A (en) * 1995-04-27 1999-08-17 Sumitomo Chemical Company, Limited Epoxy resin, resin composition, and resin-encapsulated semiconductor device
JP2005139298A (en) * 2003-11-06 2005-06-02 Polymatech Co Ltd Anisotropic epoxy resin cured product and method for producing the same
JP2012102227A (en) * 2010-11-10 2012-05-31 Sumitomo Bakelite Co Ltd Epoxy resin precursor composition, prepreg, laminated plate, resin sheet, printed wiring board and semiconductor device
JP2012236908A (en) * 2011-05-11 2012-12-06 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminated board
JP2013119608A (en) * 2011-12-08 2013-06-17 Nippon Steel & Sumikin Chemical Co Ltd Epoxy resin, epoxy resin composition and cured product thereof
WO2017195833A1 (en) * 2016-05-12 2017-11-16 富士フイルム株式会社 Colored composition, dichroic dye compound, light absorption anisotropy film, layered product, and image display device
JPWO2017195833A1 (en) * 2016-05-12 2019-03-28 富士フイルム株式会社 Colored composition, dichroic dye compound, light absorption anisotropic film, laminate, and image display device

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