JPS6454355U - - Google Patents
Info
- Publication number
- JPS6454355U JPS6454355U JP14813487U JP14813487U JPS6454355U JP S6454355 U JPS6454355 U JP S6454355U JP 14813487 U JP14813487 U JP 14813487U JP 14813487 U JP14813487 U JP 14813487U JP S6454355 U JPS6454355 U JP S6454355U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- insulating
- utility
- model registration
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例に係る回路基板の断
面図、第２図は同回路基板に部品を実装した状態
の断面図、第３図は本考案の回路基板に挿入実装
型部品を実装する場合のリード部の加工方法を示
す説明図、第４図は本考案の他の実施例を示す要
部の断面図、第５図は従来の回路基板に挿入実装
型部品を実装する際のリード部の加工方法を示す
説明図である。
１１……挿入実装型部品、１２……リード部、
２１……絶縁フイルム、２２……回路パターン、
２２ａ……挿入実装型部品を実装するパツド部、
２２ｂ……表面実装型部品を実装するパツド部、
２３……回路フイルム、２４……絶縁基板、２５
……非貫通穴、２６……半田。
Fig. 1 is a cross-sectional view of a circuit board according to an embodiment of the present invention, Fig. 2 is a cross-sectional view of the circuit board with components mounted thereon, and Fig. 3 is a cross-sectional view of the circuit board of the present invention with components mounted thereon. An explanatory diagram showing a method of processing a lead part in the case of mounting, FIG. 4 is a cross-sectional view of the main part showing another embodiment of the present invention, and FIG. FIG. 3 is an explanatory diagram showing a method of processing a lead portion of the present invention. 11...Insertion mounting type component, 12...Lead part,
21...Insulating film, 22...Circuit pattern,
22a... Pad part for mounting insertion mounting type components,
22b...pad part for mounting surface mount type components,
23...Circuit film, 24...Insulating substrate, 25
...Non-through hole, 26...Solder.
Claims (1)
を設けてなる回路基板において、挿入実装型部品
を実装するパツド部に、その表面から絶縁基板の
内部に達する非貫通穴を形成したことを特徴とす
る回路基板。 (2) 実用新案登録請求の範囲第１項記載の回路
基板であつて、絶縁基板がモールド成形体よりな
り、非貫通穴がモールド成形により形成されてい
るもの。[Scope of Claim for Utility Model Registration] (1) In a circuit board having a circuit pattern on at least one side of the insulating board, a non-through hole extending from the surface to the inside of the insulating board in a pad portion on which an insertion-mount type component is mounted. A circuit board characterized by forming. (2) Utility model registration The circuit board according to claim 1, in which the insulating substrate is made of a molded product and the non-through holes are formed by molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14813487U JPS6454355U (en) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14813487U JPS6454355U (en) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6454355U true JPS6454355U (en) | 1989-04-04 |
Family
ID=31419174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14813487U Pending JPS6454355U (en) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6454355U (en) |
-
1987
- 1987-09-30 JP JP14813487U patent/JPS6454355U/ja active Pending
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