JPS6454085A - Conductive adhesive - Google Patents

Conductive adhesive

Info

Publication number
JPS6454085A
JPS6454085A JP21043787A JP21043787A JPS6454085A JP S6454085 A JPS6454085 A JP S6454085A JP 21043787 A JP21043787 A JP 21043787A JP 21043787 A JP21043787 A JP 21043787A JP S6454085 A JPS6454085 A JP S6454085A
Authority
JP
Japan
Prior art keywords
conductive particles
adhesive
resin adhesive
conductive
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21043787A
Other languages
Japanese (ja)
Inventor
Yoshihiro Bessho
Yasuhiko Horio
Toshio Tsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21043787A priority Critical patent/JPS6454085A/en
Publication of JPS6454085A publication Critical patent/JPS6454085A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a conductive adhesive which is excellent in adhesive strength, stability, conductivity, etc. and which comprises conductive particles having a vast plurality of protrusions and recesses formed on the surface thereof and a resin adhesive, said particles and said adhesive being firmly bonded to each other at their interface as a result of kneading. CONSTITUTION:Conductive particles having a vast plurality of protrusions and recesses formed on the surface thereof and a resin adhesive (e.g., an epoxy resin adhesive) are mixed and kneaded. As a result, the resin adhesive is caused to penetrate into the recesses over the conductive particles to attain bonding in entangled form of the conductive particles with the resin adhesive. Further, the conductive particles are dispersed in the resin adhesive to produce a conductive adhesive having a firm interface bonding. Particular examples of the conductive particles include powdery nickel having a vast plurality of protrusions on the surface thereof as obtd. by pyrolysis of nickel carbonyl, etc. The diameter of the conductive particle is 0.1-100mum. The mixing proportion of the conductive particles is pref. 40-90wt.% relative to the resin adhesive.
JP21043787A 1987-08-25 1987-08-25 Conductive adhesive Pending JPS6454085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21043787A JPS6454085A (en) 1987-08-25 1987-08-25 Conductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21043787A JPS6454085A (en) 1987-08-25 1987-08-25 Conductive adhesive

Publications (1)

Publication Number Publication Date
JPS6454085A true JPS6454085A (en) 1989-03-01

Family

ID=16589313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21043787A Pending JPS6454085A (en) 1987-08-25 1987-08-25 Conductive adhesive

Country Status (1)

Country Link
JP (1) JPS6454085A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0666705A2 (en) * 1994-02-04 1995-08-09 Molex Incorporated Electrical device employing a flat flexible circuit
US6180226B1 (en) 1996-08-01 2001-01-30 Loctite (R&D) Limited Method of forming a monolayer of particles, and products formed thereby
US6402876B1 (en) 1997-08-01 2002-06-11 Loctite (R&D) Ireland Method of forming a monolayer of particles, and products formed thereby
US6977025B2 (en) 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
JP2014037614A (en) * 2012-08-17 2014-02-27 Samsung Electro-Mechanics Co Ltd Metal powder, electronic component and method of producing the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0666705A2 (en) * 1994-02-04 1995-08-09 Molex Incorporated Electrical device employing a flat flexible circuit
US6180226B1 (en) 1996-08-01 2001-01-30 Loctite (R&D) Limited Method of forming a monolayer of particles, and products formed thereby
US6977025B2 (en) 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
US6402876B1 (en) 1997-08-01 2002-06-11 Loctite (R&D) Ireland Method of forming a monolayer of particles, and products formed thereby
JP2014037614A (en) * 2012-08-17 2014-02-27 Samsung Electro-Mechanics Co Ltd Metal powder, electronic component and method of producing the same

Similar Documents

Publication Publication Date Title
DE69311559D1 (en) Force converter with conductive particles
EP0304959A3 (en) Finely divided silicone rubber additive material and method for producing same
EP0340580A3 (en) Use of a silicone resin as flameproofing agent
JPS6485248A (en) Production of electroconductive composition and printed circuit board
IE781307L (en) Feed pellets
JPS6454085A (en) Conductive adhesive
US3616174A (en) Joints for insulating electrically conductive surfaces
ES2002221A6 (en) Method for making a porous rigid structure and the porous rigid structure made thereby.
JPS57133155A (en) Electrically-conductive resin
JPS6438424A (en) Epoxy resin molding material
JPS6438420A (en) Epoxy resin molding material
JPS6429461A (en) Electrical conductive composition
JPS644655A (en) High-specific gravity composite thermoplastic resin composition
Forskitt et al. The effects of non-circular holes on the elastic properties of materials
JPS5665027A (en) Production of conductive resin composition
JPS53129292A (en) Curing of caking agent
ES8500305A1 (en) Process for the preparation of a storage-stable, miscible hardener for acrylic adhesive resins.
JPS5286446A (en) Glass fiber-reinforced thermoplastic resin compositions and their prep aration
EP0284930A3 (en) A method for preparation of a polycarbonate powder
JPS5626934A (en) Production of laminated sheet employing flexible phenolic resin
JPS649789A (en) Composition for forming electrothermal resister layer
CHOLLAR et al. Epoxy thermoplastic pavement marking material: Summary of research results and revised specifications[Final Report, Aug. 1980- Mar. 1982]
JPS5339332A (en) Adhisive sheets and their amnufacture
SHIBA et al. Study on electropainting using alkoxymethylmelamine as crosslinking agent
Dahl Back to Tooling Basics: Tooling Clinic