JPS6454085A - Conductive adhesive - Google Patents
Conductive adhesiveInfo
- Publication number
- JPS6454085A JPS6454085A JP21043787A JP21043787A JPS6454085A JP S6454085 A JPS6454085 A JP S6454085A JP 21043787 A JP21043787 A JP 21043787A JP 21043787 A JP21043787 A JP 21043787A JP S6454085 A JPS6454085 A JP S6454085A
- Authority
- JP
- Japan
- Prior art keywords
- conductive particles
- adhesive
- resin adhesive
- conductive
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To provide a conductive adhesive which is excellent in adhesive strength, stability, conductivity, etc. and which comprises conductive particles having a vast plurality of protrusions and recesses formed on the surface thereof and a resin adhesive, said particles and said adhesive being firmly bonded to each other at their interface as a result of kneading. CONSTITUTION:Conductive particles having a vast plurality of protrusions and recesses formed on the surface thereof and a resin adhesive (e.g., an epoxy resin adhesive) are mixed and kneaded. As a result, the resin adhesive is caused to penetrate into the recesses over the conductive particles to attain bonding in entangled form of the conductive particles with the resin adhesive. Further, the conductive particles are dispersed in the resin adhesive to produce a conductive adhesive having a firm interface bonding. Particular examples of the conductive particles include powdery nickel having a vast plurality of protrusions on the surface thereof as obtd. by pyrolysis of nickel carbonyl, etc. The diameter of the conductive particle is 0.1-100mum. The mixing proportion of the conductive particles is pref. 40-90wt.% relative to the resin adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21043787A JPS6454085A (en) | 1987-08-25 | 1987-08-25 | Conductive adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21043787A JPS6454085A (en) | 1987-08-25 | 1987-08-25 | Conductive adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6454085A true JPS6454085A (en) | 1989-03-01 |
Family
ID=16589313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21043787A Pending JPS6454085A (en) | 1987-08-25 | 1987-08-25 | Conductive adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6454085A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0666705A2 (en) * | 1994-02-04 | 1995-08-09 | Molex Incorporated | Electrical device employing a flat flexible circuit |
US6180226B1 (en) | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
JP2014037614A (en) * | 2012-08-17 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | Metal powder, electronic component and method of producing the same |
-
1987
- 1987-08-25 JP JP21043787A patent/JPS6454085A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0666705A2 (en) * | 1994-02-04 | 1995-08-09 | Molex Incorporated | Electrical device employing a flat flexible circuit |
US6180226B1 (en) | 1996-08-01 | 2001-01-30 | Loctite (R&D) Limited | Method of forming a monolayer of particles, and products formed thereby |
US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
JP2014037614A (en) * | 2012-08-17 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | Metal powder, electronic component and method of producing the same |
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