JPS6453870A - Thermal head substrate and manufacture thereof - Google Patents

Thermal head substrate and manufacture thereof

Info

Publication number
JPS6453870A
JPS6453870A JP21111487A JP21111487A JPS6453870A JP S6453870 A JPS6453870 A JP S6453870A JP 21111487 A JP21111487 A JP 21111487A JP 21111487 A JP21111487 A JP 21111487A JP S6453870 A JPS6453870 A JP S6453870A
Authority
JP
Japan
Prior art keywords
glaze layer
heat
substrate
layer
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21111487A
Other languages
Japanese (ja)
Inventor
Tomohiro Nakamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP21111487A priority Critical patent/JPS6453870A/en
Publication of JPS6453870A publication Critical patent/JPS6453870A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To enable high-accuracy and high-speed printing to be performed with low electric power, by providing a substrate and a glaze layer provided on the substrate, and incorporating a porous glass powder and gel form porous silica into the glaze layer. CONSTITUTION:A glaze layer 12 comprising a porous glass powder 13 and gel form porous silica has excellent heat resistance and a low thermal conductivity. The glaze layer 12 has a high heat-insulating property because of the lower thermal conductivity, so that by only applying low electric power to a heat generating part, the surface temperature of the layer 12 can be brought to a predetermined temperature necessary for printing. The lower thermal conductivity of the glaze layer 12 enables a corresponding reduction in the thickness of the layer 12 while maintaining a sufficiently favorable heat-insulating property. Therefore, it is possible to reduce the heat capacity of the glaze layer 12 itself, whereby heat can be absorbed into the substrate 11 sufficiently rapidly after printing, which provide the function of rapidly lowering the surface temperature.
JP21111487A 1987-08-25 1987-08-25 Thermal head substrate and manufacture thereof Pending JPS6453870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21111487A JPS6453870A (en) 1987-08-25 1987-08-25 Thermal head substrate and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21111487A JPS6453870A (en) 1987-08-25 1987-08-25 Thermal head substrate and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6453870A true JPS6453870A (en) 1989-03-01

Family

ID=16600639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21111487A Pending JPS6453870A (en) 1987-08-25 1987-08-25 Thermal head substrate and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6453870A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006321123A (en) * 2005-05-19 2006-11-30 Seiko Instruments Inc Heating resistor element, thermal head and ink jet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006321123A (en) * 2005-05-19 2006-11-30 Seiko Instruments Inc Heating resistor element, thermal head and ink jet

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