JPS6452081A - Chemical copper plating solution and its plating method - Google Patents

Chemical copper plating solution and its plating method

Info

Publication number
JPS6452081A
JPS6452081A JP10134188A JP10134188A JPS6452081A JP S6452081 A JPS6452081 A JP S6452081A JP 10134188 A JP10134188 A JP 10134188A JP 10134188 A JP10134188 A JP 10134188A JP S6452081 A JPS6452081 A JP S6452081A
Authority
JP
Japan
Prior art keywords
copper ion
complexing agent
copper
ion complexing
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10134188A
Other languages
Japanese (ja)
Inventor
Koji Kondo
Futoshi Ishikawa
Nobumasa Ishida
Junji Ishikawa
Katsuhiko Murakawa
Kaoru Nomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP10134188A priority Critical patent/JPS6452081A/en
Publication of JPS6452081A publication Critical patent/JPS6452081A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To stably carry out chemical copper plating at a high rate by incorporating more than a sufficient amt. of a first copper ion complexing agent in a chemical copper plating soln., and then incorporating a specified amt. of a second copper ion complexing agent having a low stability constant in the soln. CONSTITUTION:A copper ion, a copper ion complexing agent, a reducing agent, and a pH regulator are incorporated to obtain a chemical copper plating soln. Two kinds of copper ion complexing agents are used in the chemical copper plating soln. The first copper ion complexing agent is added in more than the amt. sufficient for substantially complexing the contained copper ion. Meanwhile, the second copper ion complexing agent having a substantially lower stability constant as the copper ion complex than the first copper ion complexing agent is added in the equivalent ratio of 1/100-1/2 to the copper ion. Trialkanolamine is appropriately used as the first copper ion complexing agent, and EDTA, etc., are used as the second copper ion complexing agent. By using such a plating soln., stable chemical copper plating can be applied on the material to be plated susceptible to copper plating at a high rate.
JP10134188A 1987-05-08 1988-04-26 Chemical copper plating solution and its plating method Pending JPS6452081A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10134188A JPS6452081A (en) 1987-05-08 1988-04-26 Chemical copper plating solution and its plating method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11072487 1987-05-08
JP10134188A JPS6452081A (en) 1987-05-08 1988-04-26 Chemical copper plating solution and its plating method

Publications (1)

Publication Number Publication Date
JPS6452081A true JPS6452081A (en) 1989-02-28

Family

ID=26442231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10134188A Pending JPS6452081A (en) 1987-05-08 1988-04-26 Chemical copper plating solution and its plating method

Country Status (1)

Country Link
JP (1) JPS6452081A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4959042A (en) * 1972-10-12 1974-06-07
JPS503742A (en) * 1973-05-15 1975-01-16
JPS5654386A (en) * 1979-10-11 1981-05-14 Hitachi Ltd Fuel cladding tube with composit clad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4959042A (en) * 1972-10-12 1974-06-07
JPS503742A (en) * 1973-05-15 1975-01-16
JPS5654386A (en) * 1979-10-11 1981-05-14 Hitachi Ltd Fuel cladding tube with composit clad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film

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