JPS645042A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS645042A JPS645042A JP16034887A JP16034887A JPS645042A JP S645042 A JPS645042 A JP S645042A JP 16034887 A JP16034887 A JP 16034887A JP 16034887 A JP16034887 A JP 16034887A JP S645042 A JPS645042 A JP S645042A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cover
- gel
- space
- subjected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent thermal stress from being created in gel resin and to prevent a semiconductor element and leads from being subjected to external force, by making a case higher than the gel resin so as to define space between a cover and the gel resin. CONSTITUTION:A case 12 is higher than a gel resin 13, so that space is defined between a cover 14 and the resin 13. Even if temperature of the resin 13 is increased by heat generated in a semiconductor element 1 or by ambient temperature and the resin 13 is thermally expanded, the thermal expansion may be aborbed by the space between the resin 13 and the cover 14. Thus, creation of thermal stress in the resin 13 can be prevented effectively. In this manner, the element 1 and lead lines 8 can be prevented from being subjected to external force by the effect of the resin 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16034887A JPS645042A (en) | 1987-06-26 | 1987-06-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16034887A JPS645042A (en) | 1987-06-26 | 1987-06-26 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645042A true JPS645042A (en) | 1989-01-10 |
Family
ID=15713039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16034887A Pending JPS645042A (en) | 1987-06-26 | 1987-06-26 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645042A (en) |
-
1987
- 1987-06-26 JP JP16034887A patent/JPS645042A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0346262A3 (en) | Temperature compensated thermal protector | |
| JPS6487822A (en) | Electronic control device for car | |
| EP0295387A3 (en) | Package for heat dissipation of electronic components | |
| JPS547198A (en) | Organic semiconductor | |
| JPS6418244A (en) | Circuit package with chimney part for relieving thermal expansion | |
| FR2636180B1 (en) | THERMAL LIMITER FOR INTEGRATED CIRCUIT | |
| JPS5766655A (en) | Lead frame for semiconductor device | |
| JPS645042A (en) | Semiconductor device | |
| KR880010490A (en) | Semiconductor devices | |
| FR2344965A1 (en) | Semiconductor component without case - has large area contacts on both sides of chip, connected by layer of glass | |
| ATE123867T1 (en) | THERMAL INSULATION WITH HEAT STORAGE. | |
| JPS5212573A (en) | Reed frame | |
| JPS53108369A (en) | Electronic components | |
| JPS5763831A (en) | Semiconductor device | |
| JPS5638846A (en) | Semiconductor device | |
| JPS5288851A (en) | Insulating material for high temperature and its manufacturing method | |
| JPS6473745A (en) | Semiconductor device and manufacture thereof | |
| JPS6441249A (en) | Semiconductor device | |
| JPS5350674A (en) | Semiconductor device | |
| JPS5292575A (en) | Force and displacement converter | |
| JPS5429974A (en) | Semiconductor device of resin sealing type | |
| JPS56162856A (en) | Resin-sealed semiconductor device | |
| JPS5350676A (en) | Semiconductor device | |
| JPS52115172A (en) | Semiconductor device | |
| JPS5322381A (en) | Sem iconductor device for power |