JPS6448043U - - Google Patents

Info

Publication number
JPS6448043U
JPS6448043U JP1987143427U JP14342787U JPS6448043U JP S6448043 U JPS6448043 U JP S6448043U JP 1987143427 U JP1987143427 U JP 1987143427U JP 14342787 U JP14342787 U JP 14342787U JP S6448043 U JPS6448043 U JP S6448043U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fin
bonded
semiconductor device
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987143427U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987143427U priority Critical patent/JPS6448043U/ja
Publication of JPS6448043U publication Critical patent/JPS6448043U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP1987143427U 1987-09-18 1987-09-18 Pending JPS6448043U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987143427U JPS6448043U (cg-RX-API-DMAC10.html) 1987-09-18 1987-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987143427U JPS6448043U (cg-RX-API-DMAC10.html) 1987-09-18 1987-09-18

Publications (1)

Publication Number Publication Date
JPS6448043U true JPS6448043U (cg-RX-API-DMAC10.html) 1989-03-24

Family

ID=31410243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987143427U Pending JPS6448043U (cg-RX-API-DMAC10.html) 1987-09-18 1987-09-18

Country Status (1)

Country Link
JP (1) JPS6448043U (cg-RX-API-DMAC10.html)

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