JPS6380850U - - Google Patents

Info

Publication number
JPS6380850U
JPS6380850U JP1986175408U JP17540886U JPS6380850U JP S6380850 U JPS6380850 U JP S6380850U JP 1986175408 U JP1986175408 U JP 1986175408U JP 17540886 U JP17540886 U JP 17540886U JP S6380850 U JPS6380850 U JP S6380850U
Authority
JP
Japan
Prior art keywords
heat dissipation
resin
dissipation fin
semiconductor device
buried
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986175408U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986175408U priority Critical patent/JPS6380850U/ja
Publication of JPS6380850U publication Critical patent/JPS6380850U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/07554
    • H10W72/536
    • H10W72/5363
    • H10W72/547
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1986175408U 1986-11-17 1986-11-17 Pending JPS6380850U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986175408U JPS6380850U (cg-RX-API-DMAC10.html) 1986-11-17 1986-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986175408U JPS6380850U (cg-RX-API-DMAC10.html) 1986-11-17 1986-11-17

Publications (1)

Publication Number Publication Date
JPS6380850U true JPS6380850U (cg-RX-API-DMAC10.html) 1988-05-27

Family

ID=31114704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986175408U Pending JPS6380850U (cg-RX-API-DMAC10.html) 1986-11-17 1986-11-17

Country Status (1)

Country Link
JP (1) JPS6380850U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313830A (ja) * 2005-05-09 2006-11-16 Nippon Inter Electronics Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313830A (ja) * 2005-05-09 2006-11-16 Nippon Inter Electronics Corp 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JPH0258345U (cg-RX-API-DMAC10.html)
JPH0369248U (cg-RX-API-DMAC10.html)
JPS6380850U (cg-RX-API-DMAC10.html)
JPH0312429U (cg-RX-API-DMAC10.html)
JPH03117844U (cg-RX-API-DMAC10.html)
JPS6183045U (cg-RX-API-DMAC10.html)
JPS61171257U (cg-RX-API-DMAC10.html)
JPH03101542U (cg-RX-API-DMAC10.html)
JPS6163849U (cg-RX-API-DMAC10.html)
JPH03101524U (cg-RX-API-DMAC10.html)
JPS61182036U (cg-RX-API-DMAC10.html)
JPH0226261U (cg-RX-API-DMAC10.html)
JPS625644U (cg-RX-API-DMAC10.html)
JPS6397241U (cg-RX-API-DMAC10.html)
JPS59112951U (ja) 絶縁物封止半導体装置
JPS61156257U (cg-RX-API-DMAC10.html)
JPS62128636U (cg-RX-API-DMAC10.html)
JPH01140843U (cg-RX-API-DMAC10.html)
JPS6435755U (cg-RX-API-DMAC10.html)
JPS62131447U (cg-RX-API-DMAC10.html)
JPH0467346U (cg-RX-API-DMAC10.html)
JPS61207037U (cg-RX-API-DMAC10.html)
JPH0472640U (cg-RX-API-DMAC10.html)
JPS62145344U (cg-RX-API-DMAC10.html)
JPS62120359U (cg-RX-API-DMAC10.html)