JPS6446998A - Conductive transfer sheet - Google Patents

Conductive transfer sheet

Info

Publication number
JPS6446998A
JPS6446998A JP20485187A JP20485187A JPS6446998A JP S6446998 A JPS6446998 A JP S6446998A JP 20485187 A JP20485187 A JP 20485187A JP 20485187 A JP20485187 A JP 20485187A JP S6446998 A JPS6446998 A JP S6446998A
Authority
JP
Japan
Prior art keywords
vapor
conductive
deposited metal
metal layer
conducting properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20485187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0435920B2 (enExample
Inventor
Nobuo Kuwabara
Harumichi Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reiko Co Ltd
Original Assignee
Reiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reiko Co Ltd filed Critical Reiko Co Ltd
Priority to JP20485187A priority Critical patent/JPS6446998A/ja
Publication of JPS6446998A publication Critical patent/JPS6446998A/ja
Publication of JPH0435920B2 publication Critical patent/JPH0435920B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP20485187A 1987-08-17 1987-08-17 Conductive transfer sheet Granted JPS6446998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20485187A JPS6446998A (en) 1987-08-17 1987-08-17 Conductive transfer sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20485187A JPS6446998A (en) 1987-08-17 1987-08-17 Conductive transfer sheet

Publications (2)

Publication Number Publication Date
JPS6446998A true JPS6446998A (en) 1989-02-21
JPH0435920B2 JPH0435920B2 (enExample) 1992-06-12

Family

ID=16497447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20485187A Granted JPS6446998A (en) 1987-08-17 1987-08-17 Conductive transfer sheet

Country Status (1)

Country Link
JP (1) JPS6446998A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042830A1 (de) * 1999-01-14 2000-07-20 Schaefer Hans Juergen Verfahren und vorrichtung zur herstellung von kupferfolie, die beidseitig mit polymeren beschichtet ist und die auf leiterplatten laminiert wird
JP2006297642A (ja) * 2005-04-18 2006-11-02 Asahi Kasei Chemicals Corp インモールド成形用転写フィルム、及び電磁波シールド性を有するインモールド成形品
JP2006297714A (ja) * 2005-04-19 2006-11-02 Seiren Co Ltd 転写用金属薄膜シート
JP2014221522A (ja) * 2013-05-13 2014-11-27 尾池工業株式会社 転写フィルムおよび透明導電積層体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61209199A (ja) * 1985-03-12 1986-09-17 尾池工業株式会社 導電性転写箔

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61209199A (ja) * 1985-03-12 1986-09-17 尾池工業株式会社 導電性転写箔

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000042830A1 (de) * 1999-01-14 2000-07-20 Schaefer Hans Juergen Verfahren und vorrichtung zur herstellung von kupferfolie, die beidseitig mit polymeren beschichtet ist und die auf leiterplatten laminiert wird
JP2006297642A (ja) * 2005-04-18 2006-11-02 Asahi Kasei Chemicals Corp インモールド成形用転写フィルム、及び電磁波シールド性を有するインモールド成形品
JP2006297714A (ja) * 2005-04-19 2006-11-02 Seiren Co Ltd 転写用金属薄膜シート
JP2014221522A (ja) * 2013-05-13 2014-11-27 尾池工業株式会社 転写フィルムおよび透明導電積層体の製造方法

Also Published As

Publication number Publication date
JPH0435920B2 (enExample) 1992-06-12

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