JPH0462280B2 - - Google Patents

Info

Publication number
JPH0462280B2
JPH0462280B2 JP59219131A JP21913184A JPH0462280B2 JP H0462280 B2 JPH0462280 B2 JP H0462280B2 JP 59219131 A JP59219131 A JP 59219131A JP 21913184 A JP21913184 A JP 21913184A JP H0462280 B2 JPH0462280 B2 JP H0462280B2
Authority
JP
Japan
Prior art keywords
plastic molded
molded product
conductive
layer
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59219131A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6195998A (ja
Inventor
Akira Watanabe
Takeshi Yokota
Kazuo Iijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kamaya Kagaku Kogyo Co Ltd
Original Assignee
Kamaya Kagaku Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kamaya Kagaku Kogyo Co Ltd filed Critical Kamaya Kagaku Kogyo Co Ltd
Priority to JP59219131A priority Critical patent/JPS6195998A/ja
Publication of JPS6195998A publication Critical patent/JPS6195998A/ja
Publication of JPH0462280B2 publication Critical patent/JPH0462280B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Laminated Bodies (AREA)
JP59219131A 1984-10-18 1984-10-18 導電性プラスチツク成形品の製造方法 Granted JPS6195998A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59219131A JPS6195998A (ja) 1984-10-18 1984-10-18 導電性プラスチツク成形品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59219131A JPS6195998A (ja) 1984-10-18 1984-10-18 導電性プラスチツク成形品の製造方法

Publications (2)

Publication Number Publication Date
JPS6195998A JPS6195998A (ja) 1986-05-14
JPH0462280B2 true JPH0462280B2 (enExample) 1992-10-05

Family

ID=16730721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59219131A Granted JPS6195998A (ja) 1984-10-18 1984-10-18 導電性プラスチツク成形品の製造方法

Country Status (1)

Country Link
JP (1) JPS6195998A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997034850A1 (en) * 1996-03-22 1997-09-25 Textron Automotive Company Inc. Method for fabricating painted bumper

Also Published As

Publication number Publication date
JPS6195998A (ja) 1986-05-14

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