JPS6445150A - Manufacture of electronic component - Google Patents

Manufacture of electronic component

Info

Publication number
JPS6445150A
JPS6445150A JP20077687A JP20077687A JPS6445150A JP S6445150 A JPS6445150 A JP S6445150A JP 20077687 A JP20077687 A JP 20077687A JP 20077687 A JP20077687 A JP 20077687A JP S6445150 A JPS6445150 A JP S6445150A
Authority
JP
Japan
Prior art keywords
recessed part
electrode
supporting member
metal particles
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20077687A
Other languages
Japanese (ja)
Other versions
JP2538605B2 (en
Inventor
Masayuki Saito
Akira Niitsuma
Hiroshi Ohira
Chiaki Tanuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62200776A priority Critical patent/JP2538605B2/en
Publication of JPS6445150A publication Critical patent/JPS6445150A/en
Application granted granted Critical
Publication of JP2538605B2 publication Critical patent/JP2538605B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to easily form a bump of a uniform height by a method wherein the surface of a supporting member which is conductive except its recessed part is electrified, electric charge is accumulated at the recessed part only, microscopic metal particles are scattered on the surface of the supporting member, the metal particles are retained by the electrostatic force of the recessed part, and they are transferred to the electrode of an IC. CONSTITUTION:A supporting member 11, having a recessed part 12 on the part corresponding to the electrode pad of an electronic part chip 15 and also having conductivity on the surface excluding the recessed part 12, is prepared. Then, said supporting member 11 is charged, microscopic metal particles 14 are retained in the recessed part 12 by electrostatic force, they are transferred to the electrode 15a of an electronic part chip 15, and a bump electrode is formed on the electrode 15a of the semiconductor chip 15 without conducting a plating treatment, the control of which is difficult. As a result, the measurements of the bump electrode, especially uniform height, can be formed easily.
JP62200776A 1987-08-13 1987-08-13 Electronic component manufacturing method Expired - Fee Related JP2538605B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62200776A JP2538605B2 (en) 1987-08-13 1987-08-13 Electronic component manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62200776A JP2538605B2 (en) 1987-08-13 1987-08-13 Electronic component manufacturing method

Publications (2)

Publication Number Publication Date
JPS6445150A true JPS6445150A (en) 1989-02-17
JP2538605B2 JP2538605B2 (en) 1996-09-25

Family

ID=16429991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62200776A Expired - Fee Related JP2538605B2 (en) 1987-08-13 1987-08-13 Electronic component manufacturing method

Country Status (1)

Country Link
JP (1) JP2538605B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042139A (en) * 1990-04-18 1992-01-07 Ibiden Co Ltd Solder supply plate
US6320158B1 (en) 1998-01-29 2001-11-20 Fujitsu Limited Method and apparatus of fabricating perforated plate
US6432806B1 (en) 1997-09-08 2002-08-13 Fujitsu Limited Method of forming bumps and template used for forming bumps
CN117855340A (en) * 2024-03-07 2024-04-09 山西创芯光电科技有限公司 Indium column preparation method for reducing blind pixel rate of infrared detector
CN117855340B (en) * 2024-03-07 2024-05-17 山西创芯光电科技有限公司 Indium column preparation method for reducing blind pixel rate of infrared detector

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH042139A (en) * 1990-04-18 1992-01-07 Ibiden Co Ltd Solder supply plate
US6432806B1 (en) 1997-09-08 2002-08-13 Fujitsu Limited Method of forming bumps and template used for forming bumps
US6320158B1 (en) 1998-01-29 2001-11-20 Fujitsu Limited Method and apparatus of fabricating perforated plate
CN117855340A (en) * 2024-03-07 2024-04-09 山西创芯光电科技有限公司 Indium column preparation method for reducing blind pixel rate of infrared detector
CN117855340B (en) * 2024-03-07 2024-05-17 山西创芯光电科技有限公司 Indium column preparation method for reducing blind pixel rate of infrared detector

Also Published As

Publication number Publication date
JP2538605B2 (en) 1996-09-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees