JP2704033B2 - How to connect electrode terminals - Google Patents
How to connect electrode terminalsInfo
- Publication number
- JP2704033B2 JP2704033B2 JP2195332A JP19533290A JP2704033B2 JP 2704033 B2 JP2704033 B2 JP 2704033B2 JP 2195332 A JP2195332 A JP 2195332A JP 19533290 A JP19533290 A JP 19533290A JP 2704033 B2 JP2704033 B2 JP 2704033B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminals
- fine particles
- conductive fine
- electrode
- charged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、相対峙する電気回路基体の電極端子を互い
に電気的に接続するための、電極端子の相互接続方法に
関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for interconnecting electrode terminals for electrically connecting electrode terminals of opposing electric circuit substrates to each other.
従来、5pel（５本/mm）程度の、配線基板の取り出し
電極を相互に接続する方法としては、異方性導電接着膜
を用いて接続する方法が知られている。2. Description of the Related Art Conventionally, as a method of connecting extraction electrodes of a wiring board of about 5 pel (5 lines / mm) to each other, a method of connecting the electrodes using an anisotropic conductive adhesive film is known.
例えば、液晶表示素子に駆動用半導体素子を接続する
方法としては、TABフイルムに半導体素子を実装した
後、当該TABフイルムの取り出し電極と液晶表示素子の
取り出し電極とを異方性導電接着膜を用いて接続する方
法が行われている。For example, as a method of connecting a driving semiconductor element to a liquid crystal display element, a semiconductor element is mounted on a TAB film, and then an extraction electrode of the TAB film and an extraction electrode of the liquid crystal display element are formed using an anisotropic conductive adhesive film. There is a way to connect.
また、液晶表示素子のガラス基板の取り出し電極に半
導体素子を接続する方法としては、当該半導体素子の電
極パツド上に半田バンプを形成して接続を行う方法や、
半導体素子の電極端子上に金バンプを形成して接着剤あ
るいは圧着治具などにより接続を行う方法等が知られて
いる。Further, as a method of connecting a semiconductor element to an extraction electrode of a glass substrate of a liquid crystal display element, a method of forming a solder bump on an electrode pad of the semiconductor element and making a connection,
2. Description of the Related Art A method of forming a gold bump on an electrode terminal of a semiconductor element and connecting the same with an adhesive or a crimping jig is known.
しかし、異方性導電接着膜を用いた接続においては、
接続端子密度が10pel以上の場合には隣接する電極間の
絶縁が保たれなくなるおそれがあるという課題を有して
いた。However, in connection using an anisotropic conductive adhesive film,
When the connection terminal density is 10 pel or more, there is a problem that insulation between adjacent electrodes may not be maintained.
また、半導体素子を直接液晶表示素子などの配線基板
上に接続する場合には、半導体素子にバンプを形成しな
ければならないため実装コストが高くなり且つ歩留りが
低下するという課題を有しており、さらには、バンプが
半導体素子と基板との応力を吸収しきれない場合がある
ため信頼性が悪いという課題も有していた。Further, when a semiconductor element is directly connected to a wiring substrate such as a liquid crystal display element, bumps must be formed on the semiconductor element, so that there is a problem that mounting cost is increased and yield is reduced. Further, there is also a problem that the reliability is poor because the bump may not be able to absorb the stress between the semiconductor element and the substrate.
本発明は、高密度配線を行う場合でも信頼性が十分に
確保され、且つ、歩留りが高く安価に実施することが可
能な電極端子の相互接続方法を提供することを目的とす
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for interconnecting electrode terminals that can ensure sufficient reliability even when high-density wiring is performed, and that can be implemented at high yield and at low cost.
上記課題を解決するために、本発明は、第一に、第一
の電気回路基体に形成された電極端子と第二の電気回路
基体に形成された電極端子とを相互に電気的に接続させ
るための電極端子の相互接続方法において、前記第一及
び第二の電極回路基体のうち、少なくとも一方の基体上
の電極端子に、帯電させた導電性微粒子を選択的に付着
させるに際し、該気体上の電極端子の相互に接続する部
分以外を絶縁体で覆い、荷電電界を生じた荷電ゾーン下
を導電性微粒子が通過することによって、該導電性微粒
子を帯電させ、該帯電させた導電性微粒子を電極端子の
相互に接続する部分に散布し、付着させる電極端子の相
互接続方法に、第一の特徴を有し、 第二に、第一の電気回路基体に形成された電極端子と
第二の電気回路基体に形成された電極端子とを相互に電
気的に接続させるための電極端子の相互接続方法におい
て、前記第一及び第二の電気回路基体のうち、少なくと
も一方の基体上の電極端子に、帯電させた導電性微粒子
を選択的に付着させるに際し、該導電性微粒子として、
樹脂粒子に導電性メッキを施してなる微粒子を用い、荷
電電界を生じた荷電ゾーン下を導電性微粒子が通過する
ことによって、該導電性微粒子を帯電させ、該帯電させ
た導電性微粒子を電極端子の相互に接続する部分に散布
し、付着させるこ電極端子の相互接続方法に、第二の特
徴を有している。In order to solve the above-mentioned problems, the present invention first electrically connects an electrode terminal formed on a first electric circuit base and an electrode terminal formed on a second electric circuit base to each other. In the method for interconnecting electrode terminals, the method comprises the steps of: selectively adhering charged conductive fine particles to the electrode terminals on at least one of the first and second electrode circuit substrates; The electrode terminals are connected to each other except for an interconnecting portion with an insulator, and the conductive fine particles pass under a charging zone in which a charged electric field is generated, thereby charging the conductive fine particles. The method for interconnecting electrode terminals that is scattered and attached to the interconnecting portions of the electrode terminals has the first feature. Second, the electrode terminals formed on the first electric circuit base and the second Electrode terminal formed on electric circuit substrate And a method of interconnecting electrode terminals for electrically connecting the first and second electric circuit bases to each other. On the occasion of the adherence, as the conductive fine particles,
Using fine particles obtained by subjecting resin particles to conductive plating, the conductive fine particles pass under a charging zone where a charged electric field is generated, thereby charging the conductive fine particles, and charging the conductive fine particles to an electrode terminal. The second feature of the method of interconnecting the electrode terminals is to scatter and adhere to the interconnecting portions.
また、本発明の方法において、前記荷電ゾーンがボク
サー・チャージャーによって形成されているのが有効で
ある。In the method of the present invention, it is effective that the charging zone is formed by a boxer charger.
また、本発明の方法において、前記第一の電気回路基
体により形成された電極端子と前記第二の電気回路基体
とを絶縁性接着剤により固着するのが有効である。Further, in the method of the present invention, it is effective that the electrode terminals formed by the first electric circuit base and the second electric circuit base are fixed to each other with an insulating adhesive.
本発明は、上述の方法により、高密度配線基板の相互
接続を行う場合でも、信頼性が十分に確保され、且つ、
安価に実施することが可能な電極端子の相互接続方法を
実現するものである。The present invention ensures sufficient reliability even when interconnecting high-density wiring boards by the above-described method, and
An object of the present invention is to provide a method for interconnecting electrode terminals that can be implemented at low cost.
以下、本発明について、詳細に説明する。 Hereinafter, the present invention will be described in detail.
本発明によれば、相互接続される配線基板の電極端子
上に導電性微粒子を置載する場合に、導電性微粒子を帯
電させ、配線基板上に散布することにより、導体である
電極端子と帯電した導電性微粒子との間に近接力である
影像力を働かせ、電極端子上に選択的に導電性微粒子を
付着させる事により、隣接する電極端子間の絶縁抵抗を
低下させること無く電極端子上に導電性微粒子を置載
し、導電性微粒子を介した、高密度配線基板の相互接続
を可能とするものである。この時、導電性微粒子を帯電
させる方法としては、例えば、接触帯電、コロナ放電、
ボクサーチヤージヤーによる帯電を用いれば良い。According to the present invention, when the conductive fine particles are placed on the electrode terminals of the interconnect substrate to be interconnected, the conductive fine particles are charged and dispersed on the wiring substrate, so that the conductive electrode terminals are electrically charged. By applying an image force, which is a proximity force, between the conductive particles and the conductive fine particles, and selectively attaching the conductive fine particles on the electrode terminals, the conductive fine particles are formed on the electrode terminals without lowering the insulation resistance between adjacent electrode terminals. A conductive fine particle is placed on the substrate, and the high-density wiring boards can be interconnected via the conductive fine particle. At this time, as a method of charging the conductive fine particles, for example, contact charging, corona discharge,
What is necessary is just to use the charging by a box search yarder.
また、帯電させた導電性微粒子が電極端子に向かう力
を生じる外部電界を形成し、前記導電性微粒子を散布す
る事により、電極端子上により多くの導電性微粒子を付
着させる事ができる。この時、外部電界を形成する方法
としては、配線基板の上方および下方に外部電極を設
け、この電極間で電界を形成する方法、あるいは、配線
基板の上方の外部電極と配線基板の電極端子との間で電
界を形成する方法がある。Further, by forming an external electric field in which the charged conductive fine particles generate a force toward the electrode terminal and spraying the conductive fine particles, more conductive fine particles can be attached to the electrode terminals. At this time, as a method of forming an external electric field, an external electrode is provided above and below the wiring board, and an electric field is formed between the electrodes, or an external electrode above the wiring board and an electrode terminal of the wiring board are connected to each other. There is a method of forming an electric field between them.
また、配線基板を配線基板の電極端子の接続部のみを
開口した絶縁体で覆い、帯電させた前記導電性微粒子を
当該電気回路基体の電極端子に散布することにより、相
互接続に要する電極端子部のみに、導電性微粒子を付着
することができる。Further, the wiring board is covered with an insulator having an opening only at a connection portion of the electrode terminal of the wiring board, and the charged conductive fine particles are sprayed on the electrode terminal of the electric circuit base to thereby form an electrode terminal portion required for interconnection. Only the conductive fine particles can be attached.
また、導電性微粒子として、金属微粒子を用いても本
発明は、実施可能であるが、樹脂粒子に導電性メツキを
施したものを用いることにより、導電性微粒子の比重を
小さくすることができ、電極端子上に、導電性微粒子を
導き易くすることができる。さらに、導電性微粒子を介
して配線基板の電極端子を相互接続する場合、配線基板
の電極端子の微小な凸凹に樹脂粒子が弾性変形し追従す
ることにより、安定な接続を行うことができる。In addition, the present invention can be practiced even if metal fine particles are used as the conductive fine particles, but the specific gravity of the conductive fine particles can be reduced by using resin particles that have been subjected to conductive plating. The conductive fine particles can be easily guided on the electrode terminals. Further, when the electrode terminals of the wiring board are interconnected via the conductive fine particles, the resin particles elastically deform and follow the minute irregularities of the electrode terminals of the wiring board, so that a stable connection can be made.
また、少なくとも一方の配線基板の電極端子に導電性
微粒子を付着させた配線基板を相互に圧着する方法とし
て、クリツプ等の圧接治具を用いても本発明は実施可能
であるが、絶縁性接着剤を用いて固着することにより、
より部品数が少なく、より薄型の接続を行うことができ
る。The present invention can also be carried out by using a press-fitting jig such as a clip as a method for pressure-bonding the wiring boards having conductive fine particles adhered to the electrode terminals of at least one of the wiring boards to each other. By fixing using an agent,
The number of parts is smaller and a thinner connection can be made.
本発明の実施例として、液晶表示素子のガラス基板の
取り出し電極上に、当該液晶表示素子を駆動するための
半導体素子をフエースダウンで接続する場合について説
明する。As an embodiment of the present invention, a case where a semiconductor element for driving the liquid crystal display element is face-down connected to an extraction electrode of a glass substrate of the liquid crystal display element will be described.
第１図は、本発明装置の模式図である。 FIG. 1 is a schematic view of the device of the present invention.
第１図において、1aは導電性微粒子で、例えば金、
銀、アルミニウムやクロム又は合金の膜で被われたプラ
スチツクビーズ（平均粒子サイズ0.1μｍ〜100μｍ）な
ど、２は粒子荷電装置（ボクサー・チヤージヤー）で、
1bは帯電した導電性微粒子、３は液晶表示素子用ガラス
基板、４は液晶表示素子用ガラス基板に設けたリード
（取り出し）電極、５はリード電極４の接続部上方を開
口（開口部Ａ）した絶縁体フイルム、６はリード電極４
のアース線、７は外部電極である。In FIG. 1, reference numeral 1a denotes conductive fine particles, for example, gold,
2 is a particle charging device (boxer charger), such as plastic beads (average particle size 0.1 μm to 100 μm) covered with a film of silver, aluminum, chromium, or alloy.
1b is charged conductive fine particles, 3 is a glass substrate for a liquid crystal display element, 4 is a lead (extraction) electrode provided on the glass substrate for a liquid crystal display element, and 5 is an opening above a connection portion of the lead electrode 4 (opening A). Insulator film, 6 is the lead electrode 4
Is an external electrode.
第１図に示すように、ガラス基板３に形成された取り
だし電極４を接地し、取りだし電極４の接続部上方のみ
を開口した絶縁体５で覆ったのち、導電性微粒子1aを微
粒子荷電装置であるボクサー・チヤージヤー２により帯
電し、取りだし電極４上に散布する。As shown in FIG. 1, the extraction electrode 4 formed on the glass substrate 3 is grounded, covered with an insulator 5 having an opening only above the connection portion of the extraction electrode 4, and then the conductive fine particles 1a are charged with a fine particle charging device. It is charged by a certain boxer charger 2 and sprayed on the take-out electrode 4.
第２図は、第１図のＸ部を上方より見た平面図であ
る。FIG. 2 is a plan view of part X in FIG. 1 as viewed from above.
帯電した導電性微粒子1bがガラス基板３に近づくにつ
れて、絶縁体フイルム５の開口部Ａ近辺の帯電した導電
性微粒子1bは、リード電極端子４との間に近接力である
影像力を生じ、リード電極４上に比較的多く付着する。As the charged conductive fine particles 1b approach the glass substrate 3, the charged conductive fine particles 1b near the opening A of the insulator film 5 generate an image force, which is a proximity force, with the lead electrode terminal 4, and lead A relatively large amount adheres on the electrode 4.
この時、第１図の外部電極７とリード電極４との間で
電界を生じさせ、帯電した導電性微粒子1bを静電気力に
より、リード電極４に導くこともできる。At this time, an electric field can be generated between the external electrode 7 and the lead electrode 4 in FIG. 1 to guide the charged conductive fine particles 1b to the lead electrode 4 by electrostatic force.
第３図は、第１図に示す帯電した導電性微粒子1bがリ
ード電極４上に付着した状態（図中、1cはリード電極４
上に付着した導電性微粒子）を示す。FIG. 3 shows a state in which the charged conductive fine particles 1b shown in FIG. 1 adhere to the lead electrode 4 (in the figure, 1c denotes the lead electrode 4).
(Conductive fine particles attached on the top).
次に、絶縁体フイルム５を取り外し、第４図に示すよ
うに、半導体素子８の電極パツド９をフエースダウンで
リード電極４に位置合わせし、圧接しながら、絶縁性接
着剤10を硬化させ、接続を行った。Next, the insulating film 5 is removed, and as shown in FIG. 4, the electrode pad 9 of the semiconductor element 8 is aligned with the lead electrode 4 face down, and the insulating adhesive 10 is cured while being pressed and pressed. Connection made.
第５図は、本発明で用いたボクサー・チヤージヤーの
模式断面図で、第６図はその平面図である。FIG. 5 is a schematic sectional view of the boxer charger used in the present invention, and FIG. 6 is a plan view thereof.
図中、501は円筒状セラミツク、502は放電電極、503
は励起電極、504Aは導電性微粒子、504Bは帯電した導電
性微粒子、505は荷電ゾーン（荷電空間）、Ｅは荷電電
界、TR1及びTR2は励起用高周波変圧器、TR3は主変圧
器、506,507及び508は増幅器、509及び510はゲート、51
1は移相器、512は500Hzの主電源、513は20kHzの励起電
源である。In the figure, 501 is a cylindrical ceramic, 502 is a discharge electrode, 503
Is an excitation electrode, 504A is conductive fine particles, 504B is charged conductive fine particles, 505 is a charged zone (charged space), E is a charged electric field, TR1 and TR2 are high frequency transformers for excitation, TR3 is a main transformer, 506, 507 and 508 is an amplifier, 509 and 510 are gates, 51
1 is a phase shifter, 512 is a 500 Hz main power supply, and 513 is a 20 kHz excitation power supply.
主電源512より放電電極502に500Hzの交流電圧を印加
することによって、荷電電界Ｅを形成する。S1側の放電
電極502が負極性となった時、励起電極503に高周波の20
kHz交流電圧を印加すると、沿面放電のため面状のプラ
ズマイオン源を形成、負イオンのみが電界により引き出
されて荷電空間を走行し、励起されていないS2の表面に
吸収される。この間に粒子504Aに左方から射突してこれ
を荷電する。次に電圧の極性が反転し、S2側の帯電電極
502が負極性となるとS2のみが励起されて負イオンを放
出し、これが粒子504Aに右方から射突してこれを荷電す
る。このように粒子504Aに左右双方から交互にイオンが
射突してこれを荷電する結果、たとえ粒子504Aの電気抵
抗が著しく高くても、これを迅速にかつ高い飽和値まで
荷電する。帯電された粒子504Bは微小な振幅で揺動する
のみで直流電界下のように一方向に移動して大量に電極
を付着することがない。A charging electric field E is formed by applying an AC voltage of 500 Hz to the discharge electrode 502 from the main power supply 512. When the discharge electrode 502 of the S 1 side becomes a negative polarity, high frequency 20 to the excitation electrode 503
The application of a kHz AC voltage, forming a planar plasma ion source for surface discharge, only the negative ions are drawn out by the electric field traveling charged space and is absorbed in the excited non S 2 of the surface. During this time, the particles 504A are projected from the left and charged. Then the polarity of the voltage is inverted, S 2 side of the charging electrode
When 502 becomes negative, only S 2 is excited and emits negative ions, which strike the particle 504A from the right and charge it. As a result, the ions are alternately projected and charged from both the right and left sides of the particle 504A, and as a result, even if the electric resistance of the particle 504A is extremely high, the particles are rapidly charged to a high saturation value. The charged particles 504B only oscillate with a small amplitude and move in one direction as under a DC electric field, and do not attach a large amount of electrodes.
また、通常S1−S2間の距離は、１〜10cm、好ましくは
２〜5cmで、円筒状セラミツクの高さは３〜20cm、好ま
しくは５〜10cmである。The distance between S 1 and S 2 is usually 1 to 10 cm, preferably 2 to 5 cm, and the height of the cylindrical ceramic is 3 to 20 cm, preferably 5 to 10 cm.
第７図（Ａ）〜（Ｃ）は、それぞれ共通時間軸におけ
るS1側とS2側放電電極502間への印加電圧波形、S1側励
起電極503への印加電圧波形及びS2側励起電極504への印
加電圧波形を表わしている。Figure 7 (A) ~ (C) is a voltage waveform applied to between S 1 side and the S 2 side discharge electrode 502 in each common time axis, the applied voltage waveform and S 2 side excitation to the S 1 side excitation electrode 503 3 shows a waveform of a voltage applied to the electrode 504.
以上説明したように、本発明の電極端子の相互接続方
法によれば、以下のような効果を得ることができる。As described above, according to the electrode terminal interconnection method of the present invention, the following effects can be obtained.
導電性微粒子を帯電させて散布し、静電気力により、
電極端子上に、選択的に付着させることにより、隣接す
る電極端子との電気的絶縁性を保ったまま、電極端子上
に導電性微粒子を安価に置載できる。The conductive fine particles are charged and sprayed, and by electrostatic force,
By selectively attaching to the electrode terminals, the conductive fine particles can be mounted on the electrode terminals at low cost while maintaining the electrical insulation between the adjacent electrode terminals.
また、配線基板の電極端子の接続部以外を絶縁体で覆
い、帯電させた導電性微粒子を配線基板の電極端子に散
布・付着する事により、導電性微粒子を接続に寄与する
部位のみに付着させる事ができる。In addition, by covering an area other than the connection part of the electrode terminals of the wiring board with an insulator, and by spraying and adhering the charged conductive fine particles to the electrode terminals of the wiring board, the conductive fine particles are adhered only to the portions contributing to the connection. Can do things.
また、導電性微粒子として、樹脂粒子に導電性メツキ
を施したものを用いることにより、配線基板の電極端子
を導電性微粒子を介して電気的に相互接続する際、配線
基板の電極端子の微小な凸凹に、樹脂粒子が、弾性変形
し追従することにより、安定した接続をおこなうことが
できる。In addition, by using resin particles having conductive plating applied thereon as the conductive fine particles, when the electrode terminals of the wiring board are electrically interconnected via the conductive fine particles, minute electrode terminals of the wiring board may be used. The resin particles elastically deform and follow the unevenness, so that a stable connection can be made.
また、少なくとも一方の配線基板の電極端子に導電性
微粒子を付着させた配線基板を絶縁性接着剤を用いて固
着することにより、より部品数が少なく、より薄型の接
続を行うことができる。In addition, by fixing the wiring board having the conductive fine particles attached to the electrode terminals of at least one of the wiring boards using an insulating adhesive, the number of components can be reduced and the connection can be made thinner.
さらに、本発明を半導体素子のフエーズダウン実装に
実施した場合、半導体素子にバンプを形成せずに接続を
可能とするため、半導体素子の歩留りを低下させずに、
安価に実装することができる。Furthermore, when the present invention is applied to phase-down mounting of a semiconductor element, connection can be made without forming a bump on the semiconductor element, so that the yield of the semiconductor element is not reduced,
It can be mounted at low cost.
第１図〜第２図は、本発明の実施例を示す。 第１図は、導電性微粒子を帯電し、配線基板の電極端子
に散布する方法を示す概念図。 第２図は、第１図Ｘ部を上方から見た図。 第３図は、帯電した導電性微粒子が、ガラス基板の電極
端子上に選択的に付着した状態を示す。 第４図は、ガラス基板の電極端子に導電性微粒子を付着
させた後、半導体素子をフエースダウンで位置合わせ
し、絶縁性接着剤で固着した状態を示す。 第５図は、本発明で用いたボクサー・チヤージヤーの模
式断面図で、第６図はその平面図で、第７図（Ａ）〜
（Ｃ）はこの装置で用いた駆動電圧波形のタイミングチ
ヤート図である。 1a……導電性微粒子、２……粒子荷電装置（ボクサー・
チヤージヤー）、1b……帯電した導電性微粒子、３……
液晶表示素子のガラス基板、４……液晶表示素子のガラ
ス基板の取りだし電極、５……液晶表示素子のガラス基
板の取りだし電極の接続部上方を開口した絶縁体、６…
…液晶表示素子のガラス基板の取りだし電極のアース
線、７……外部電極、1c……液晶表示素子のガラス基板
の取りだし電極上に付着した導電性微粒子、８……半導
体素子、９……半導体素子の電極パツド、10……絶縁性
接着剤。1 and 2 show an embodiment of the present invention. FIG. 1 is a conceptual diagram showing a method of charging conductive fine particles and spraying the conductive fine particles on electrode terminals of a wiring board. FIG. 2 is a view of the X part in FIG. 1 viewed from above. FIG. 3 shows a state where the charged conductive fine particles are selectively attached to the electrode terminals of the glass substrate. FIG. 4 shows a state in which the conductive fine particles are attached to the electrode terminals of the glass substrate, and then the semiconductor elements are aligned face down and fixed with an insulating adhesive. FIG. 5 is a schematic sectional view of the boxer charger used in the present invention, and FIG. 6 is a plan view thereof, and FIGS.
(C) is a timing chart of a driving voltage waveform used in this apparatus. 1a: conductive fine particles, 2: particle charging device (boxer
Charged), charged conductive fine particles, 3 ...
The glass substrate of the liquid crystal display element, 4... The electrode for taking out the glass substrate of the liquid crystal display element, 5... The insulator opened above the connection portion of the glass substrate for the liquid crystal display element, 6.
... Earth wire of the removal electrode of the glass substrate of the liquid crystal display element, 7 ... External electrode, 1c ... Conductive fine particles attached on the removal electrode of the glass substrate of the liquid crystal display element, 8 ... Semiconductor element, 9 ... Semiconductor Element electrode pad, 10 ... Insulating adhesive.
Claims (6)
と第二の電気回路基体に形成された電極端子とを相互に
電気的に接続させるための電極端子の相互接続方法にお
いて、 前記第一及び第二の電極回路基体のうち、少なくとも一
方の基体上の電極端子に、帯電させた導電性微粒子を選
択的に付着させるに際し、該基体上の電極端子の相互に
接続する部分以外を絶縁体で覆い、荷電電界を生じた荷
電ゾーン下を導電性微粒子が通過することによって、該
導電性微粒子を帯電させ、該帯電させた導電性微粒子を
電極端子の相互に接続する部分に散布し、付着させるこ
とを特徴とする電極端子の相互接続方法。1. A method for interconnecting electrode terminals for electrically connecting electrode terminals formed on a first electric circuit base and electrode terminals formed on a second electric circuit base to each other, In selectively adhering the charged conductive fine particles to the electrode terminals on at least one of the first and second electrode circuit substrates, a portion other than the interconnecting portions of the electrode terminals on the substrate is used. The conductive fine particles are covered by an insulator and pass under a charging zone in which a charged electric field is generated, thereby charging the conductive fine particles and dispersing the charged conductive fine particles to a portion where the electrode terminals are connected to each other. A method of interconnecting electrode terminals.
によって形成されている請求項１記載の相互接続法。2. The method of claim 1 wherein said charging zone is formed by a boxer charger.
電極端子と前記第二の電極回路基体とを絶縁性接着剤に
より固着することを特徴とする請求項１記載の相互接続
方法。3. The interconnection method according to claim 1, wherein the electrode terminals formed by the first electric circuit base and the second electrode circuit base are fixed by an insulating adhesive.
と第二の電気回路基体に形成された電極端子とを相互に
電気的に接続させるための電極端子の相互接続方法にお
いて、 前記第一及び第二の電気回路基体のうち、少なくとも一
方の基体上の電極端子に、帯電させた導電性微粒子を選
択的に付着させるに際し、該導電性微粒子として、樹脂
粒子に導電性メッキを施してなる微粒子を用い、荷電電
界を生じた荷電ゾーン下を該導電性微粒子が通過するこ
とによって、該導電性微粒子を帯電させ、該帯電させた
導電性微粒子を電極端子の相互に接続する部分に散布
し、付着させることを特徴とする電極端子の相互接続方
法。4. A method for interconnecting electrode terminals for electrically connecting electrode terminals formed on a first electric circuit base and electrode terminals formed on a second electric circuit base to each other, In selectively adhering the charged conductive fine particles to the electrode terminals on at least one of the first and second electric circuit bases, the conductive fine particles are subjected to conductive plating on the resin particles. By using the resulting fine particles, the conductive fine particles are charged by passing the conductive particles under a charging zone in which a charged electric field is generated, and the charged conductive fine particles are connected to a portion where the electrode terminals are connected to each other. A method for interconnecting electrode terminals, which is sprayed and attached.
によって形成されている請求項４記載の相互接続法。5. The method of claim 4 wherein said charging zone is formed by a boxer charger.
電極端子と前記第二の電極回路基体とを絶縁性接着剤に
より固着することを特徴とする請求項４記載の相互接続
方法。6. The interconnection method according to claim 4, wherein the electrode terminals formed by the first electric circuit base and the second electrode circuit base are fixed by an insulating adhesive.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2195332A JP2704033B2 (en) | 1990-07-23 | 1990-07-23 | How to connect electrode terminals |
| EP19900115707 EP0413335B1 (en) | 1989-08-17 | 1990-08-16 | Method of mutually connecting electrode terminals |
| AT90115707T ATE138225T1 (en) | 1989-08-17 | 1990-08-16 | PROCESS FOR MUTUAL CONNECTION OF ELECTRODE CONNECTIONS |
| DE69026992T DE69026992T2 (en) | 1989-08-17 | 1990-08-16 | Process of mutual connection of electrode connections |
| KR1019900012676A KR940008554B1 (en) | 1989-08-17 | 1990-08-17 | Electrode terminal mutual connection method |
| US08/012,805 US5352318A (en) | 1989-08-17 | 1993-02-02 | Method of mutually connecting electrode terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2195332A JP2704033B2 (en) | 1990-07-23 | 1990-07-23 | How to connect electrode terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0479397A JPH0479397A (en) | 1992-03-12 |
| JP2704033B2 true JP2704033B2 (en) | 1998-01-26 |
Family
ID=16339413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2195332A Expired - Fee Related JP2704033B2 (en) | 1989-08-17 | 1990-07-23 | How to connect electrode terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2704033B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995032449A1 (en) * | 1994-05-20 | 1995-11-30 | Seiko Epson Corporation | Structure of conductive connecting portions, and liquid crystal display and electronic printer provided with the same |
| JP3711873B2 (en) | 2001-02-19 | 2005-11-02 | ソニーケミカル株式会社 | Bumpless IC chip manufacturing method |
-
1990
- 1990-07-23 JP JP2195332A patent/JP2704033B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479397A (en) | 1992-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR940008554B1 (en) | Electrode terminal mutual connection method | |
| EP1403686B1 (en) | Liquid crystal display device | |
| TWI260097B (en) | Interconnection structure through passive component | |
| JPH0540274A (en) | Liquid crystal device | |
| JP2704033B2 (en) | How to connect electrode terminals | |
| JPS60130721A (en) | Liquid-crystal display device | |
| JP2001188891A (en) | Non-contact type ic card | |
| JPH0691129B2 (en) | Method of interconnecting electrode terminals and method of manufacturing electrical connection structure | |
| JPH0362411A (en) | Manufacture of aeolotropic conductive film | |
| JPH03185894A (en) | Mutual connection of electrode terminal | |
| JPH06103702B2 (en) | Method of interconnecting electrode terminals and method of manufacturing electrical connection structure | |
| JP2888466B2 (en) | Manufacturing method of heat seal connector | |
| KR100258719B1 (en) | Pannel structure for chip on glass(cog) | |
| JPH05119337A (en) | Mutual connection method for electrode terminal | |
| EP2093794B1 (en) | Conductive ball mounting apparatus and conductive ball mounting method | |
| JPH079138Y2 (en) | Structure of wiring pattern of LCD panel | |
| JPH03289070A (en) | Interconnection method of electrode terminal | |
| JPS61172183A (en) | Liquid crystal optical apparatus | |
| JPH01143291A (en) | Equipment for applying conductive paste to electronic parts | |
| JPS61192369A (en) | Vibrator holding apparatus of ultrasonic atomizer | |
| JPH05235103A (en) | Ic mounting method | |
| JPS6237335Y2 (en) | ||
| JPS5838610Y2 (en) | semiconductor equipment | |
| JPH08186169A (en) | Packaging method of flip chip | |
| JPS63160350A (en) | Bonding of ic chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081003 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091003 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |