JPS6444442U - - Google Patents
Info
- Publication number
- JPS6444442U JPS6444442U JP14014587U JP14014587U JPS6444442U JP S6444442 U JPS6444442 U JP S6444442U JP 14014587 U JP14014587 U JP 14014587U JP 14014587 U JP14014587 U JP 14014587U JP S6444442 U JPS6444442 U JP S6444442U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive chip
- cylindrical portion
- stem body
- introducing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000000605 extraction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は、実施例半導体圧力センサを示す正面
図、第２図は、実施例半導体圧力センサを示す側
面図、第３図は、実施例半導体圧力センサを電気
機器に内装した状態を示す斜視図、第４図は、実
施例半導体圧力センサを電気機器に内装した状態
を示す断面図、第５図は、従来の半導体圧力セン
サを示す断面図、第６図は、従来の半導体圧力セ
ンサを電気機器に内装した状態を示す断面図であ
る。
１：樹脂ステム、２：感圧チツプ、３：リード
ピン、４：リードピン取出台板、５：電子機器。
FIG. 1 is a front view showing the semiconductor pressure sensor of the example, FIG. 2 is a side view of the semiconductor pressure sensor of the example, and FIG. 3 is a perspective view showing the semiconductor pressure sensor of the example installed inside an electrical device. 4 is a cross-sectional view showing the semiconductor pressure sensor of the embodiment installed in an electrical device, FIG. 5 is a cross-sectional view showing a conventional semiconductor pressure sensor, and FIG. 6 is a cross-sectional view showing a conventional semiconductor pressure sensor. FIG. 2 is a cross-sectional view showing a state where it is installed inside an electrical device. 1: Resin stem, 2: Pressure-sensitive chip, 3: Lead pin, 4: Lead pin extraction base plate, 5: Electronic equipment.
Claims (1)
共に、ステム本体には前記感圧チツプ対応位置に
圧力導入用筒部を一体に突設し、前記感圧チツプ
に接続されるリードピンを上記圧力導入用筒部に
対し直角方向へ突出させたことを特徴とする半導
体圧力センサ。 A pressure-sensitive chip is provided in the hollow chamber of the stem body, and a pressure-introducing cylindrical portion is integrally provided on the stem body at a position corresponding to the pressure-sensitive chip, and a lead pin connected to the pressure-sensitive chip is connected to the pressure-introducing part. A semiconductor pressure sensor characterized by protruding in a direction perpendicular to a cylindrical portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140145U JPH0642193Y2 (en) | 1987-09-14 | 1987-09-14 | Semiconductor pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140145U JPH0642193Y2 (en) | 1987-09-14 | 1987-09-14 | Semiconductor pressure sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6444442U true JPS6444442U (en) | 1989-03-16 |
| JPH0642193Y2 JPH0642193Y2 (en) | 1994-11-02 |
Family
ID=31404049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987140145U Expired - Lifetime JPH0642193Y2 (en) | 1987-09-14 | 1987-09-14 | Semiconductor pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642193Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242679U (en) * | 1975-09-22 | 1977-03-26 | ||
| JPS6288930A (en) * | 1985-10-07 | 1987-04-23 | モトロ−ラ・イカコ−ポレ−テツド | Integral type pressure transducer package and pressure transducer using said package |
-
1987
- 1987-09-14 JP JP1987140145U patent/JPH0642193Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242679U (en) * | 1975-09-22 | 1977-03-26 | ||
| JPS6288930A (en) * | 1985-10-07 | 1987-04-23 | モトロ−ラ・イカコ−ポレ−テツド | Integral type pressure transducer package and pressure transducer using said package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642193Y2 (en) | 1994-11-02 |