JPS6444441U - - Google Patents

Info

Publication number
JPS6444441U
JPS6444441U JP14014487U JP14014487U JPS6444441U JP S6444441 U JPS6444441 U JP S6444441U JP 14014487 U JP14014487 U JP 14014487U JP 14014487 U JP14014487 U JP 14014487U JP S6444441 U JPS6444441 U JP S6444441U
Authority
JP
Japan
Prior art keywords
pressure
embedded
introduction port
resin stem
pressure sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14014487U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14014487U priority Critical patent/JPS6444441U/ja
Publication of JPS6444441U publication Critical patent/JPS6444441U/ja
Pending legal-status Critical Current

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  • Measuring Fluid Pressure (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、実施例半導体圧力センサを示す断面
図、第2図は、実施例半導体圧力センサを示す斜
視図、第3図は、実施例半導体圧力センサを内蔵
する電子機器を示す斜視図、第4図は、インサー
ト成形時のリード配置説明図、第5図は、従来の
半導体圧力センサを示す断面図、第6図は、従来
の他の半導体圧力センサを示す断面図である。 1:樹脂ステム、2:感圧チツプ、3:リード
ピン、4:金属平板、12:圧力導入用筒部。
FIG. 1 is a sectional view showing an example semiconductor pressure sensor, FIG. 2 is a perspective view showing an example semiconductor pressure sensor, and FIG. 3 is a perspective view showing an electronic device incorporating the example semiconductor pressure sensor. FIG. 4 is an explanatory diagram of lead arrangement during insert molding, FIG. 5 is a sectional view showing a conventional semiconductor pressure sensor, and FIG. 6 is a sectional view showing another conventional semiconductor pressure sensor. 1: Resin stem, 2: Pressure sensitive chip, 3: Lead pin, 4: Metal flat plate, 12: Pressure introduction cylinder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 圧力導入口部を備えた樹脂ステムにリードピン
の一部を埋設し、かつ前記樹脂ステムの内部中空
室底部に、前記圧力導入口部に対し直交する平板
の端部を埋設配備し、この平板に感圧チツプを接
合した半導体圧力センサ。
A part of the lead pin is embedded in a resin stem provided with a pressure introduction port, and an end of a flat plate perpendicular to the pressure introduction port is embedded in the bottom of the internal hollow chamber of the resin stem, and A semiconductor pressure sensor with a pressure-sensitive chip bonded to it.
JP14014487U 1987-09-14 1987-09-14 Pending JPS6444441U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14014487U JPS6444441U (en) 1987-09-14 1987-09-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14014487U JPS6444441U (en) 1987-09-14 1987-09-14

Publications (1)

Publication Number Publication Date
JPS6444441U true JPS6444441U (en) 1989-03-16

Family

ID=31404047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14014487U Pending JPS6444441U (en) 1987-09-14 1987-09-14

Country Status (1)

Country Link
JP (1) JPS6444441U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06500978A (en) * 1991-04-08 1994-01-27 イーストマン・コダック・カンパニー Opening closing member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06500978A (en) * 1991-04-08 1994-01-27 イーストマン・コダック・カンパニー Opening closing member

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