JPS6444441U - - Google Patents
Info
- Publication number
- JPS6444441U JPS6444441U JP14014487U JP14014487U JPS6444441U JP S6444441 U JPS6444441 U JP S6444441U JP 14014487 U JP14014487 U JP 14014487U JP 14014487 U JP14014487 U JP 14014487U JP S6444441 U JPS6444441 U JP S6444441U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- embedded
- introduction port
- resin stem
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第1図は、実施例半導体圧力センサを示す断面
図、第2図は、実施例半導体圧力センサを示す斜
視図、第3図は、実施例半導体圧力センサを内蔵
する電子機器を示す斜視図、第4図は、インサー
ト成形時のリード配置説明図、第5図は、従来の
半導体圧力センサを示す断面図、第6図は、従来
の他の半導体圧力センサを示す断面図である。
1:樹脂ステム、2:感圧チツプ、3:リード
ピン、4:金属平板、12:圧力導入用筒部。
FIG. 1 is a sectional view showing an example semiconductor pressure sensor, FIG. 2 is a perspective view showing an example semiconductor pressure sensor, and FIG. 3 is a perspective view showing an electronic device incorporating the example semiconductor pressure sensor. FIG. 4 is an explanatory diagram of lead arrangement during insert molding, FIG. 5 is a sectional view showing a conventional semiconductor pressure sensor, and FIG. 6 is a sectional view showing another conventional semiconductor pressure sensor. 1: Resin stem, 2: Pressure sensitive chip, 3: Lead pin, 4: Metal flat plate, 12: Pressure introduction cylinder.
Claims (1)
の一部を埋設し、かつ前記樹脂ステムの内部中空
室底部に、前記圧力導入口部に対し直交する平板
の端部を埋設配備し、この平板に感圧チツプを接
合した半導体圧力センサ。 A part of the lead pin is embedded in a resin stem provided with a pressure introduction port, and an end of a flat plate perpendicular to the pressure introduction port is embedded in the bottom of the internal hollow chamber of the resin stem, and A semiconductor pressure sensor with a pressure-sensitive chip bonded to it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14014487U JPS6444441U (en) | 1987-09-14 | 1987-09-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14014487U JPS6444441U (en) | 1987-09-14 | 1987-09-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6444441U true JPS6444441U (en) | 1989-03-16 |
Family
ID=31404047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14014487U Pending JPS6444441U (en) | 1987-09-14 | 1987-09-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6444441U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06500978A (en) * | 1991-04-08 | 1994-01-27 | イーストマン・コダック・カンパニー | Opening closing member |
-
1987
- 1987-09-14 JP JP14014487U patent/JPS6444441U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06500978A (en) * | 1991-04-08 | 1994-01-27 | イーストマン・コダック・カンパニー | Opening closing member |
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